多协议模块

结果: 732
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 资格 产品 封装
Quectel 多协议模块 Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 25.5 mm x 18 mm x 3.16 mm Modules Reel, Cut Tape
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, 2MB flash
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C PCB 20 mm x 18 mm x 2.6 mm BLE 5.2 802.11 b/g/n 802.11 b/g/n, BLE 5.2 Reel, Cut Tape
Silex Technology 多协议模块 [Sample Pack] SX-PCEBE-M2-SP is a Wi-Fi7 2x2 Tri-band IEEE802.11 be WLAN, Bluetooth 5.3 BR/EDR/HS/LE module in a M.2 card form factor (M.2 Card Type 2230-S3-A-E). It is based on Qualcomm's QCC2076 chipset. This is ideal for low quantity purchases fo
SX-PCEBE 2.4 GHz, 5 GHz, 6 GHz USB - 40 C + 85 C MHF4 Bluetooth WiFi Multiprotocol Module Bulk
Ezurio 多协议模块 Module, BL54LM20A, (Nordic nRF54LM20A), MHF4 Connector, Cut Tape
BLM54LM20A 2.4 GHz 8 dBm GPIO, I2C, I2S, PWM, SPI, UART, USB 1.7 V 3.6 V - 40 C + 85 C MHF4 11 mm x 8 mm x 0.6 mm Bluetooth LE Thread, Zigbee - 802.15.4 Multiprotocol Modules Cut Tape
Ezurio 多协议模块 Module, BL54LM20A, (Nordic nRF54LM20A), MHF4 Connector, Tape/Reel
BLM54LM20A 2.4 GHz 8 dBm GPIO, I2C, I2S, PWM, SPI, UART, USB 1.7 V 3.6 V - 40 C + 85 C MHF4 11 mm x 8 mm x 0.6 mm Bluetooth LE Thread, Zigbee - 802.15.4 Multiprotocol Modules Reel
Ezurio 多协议模块 Module, BL54LM20A, (Nordic nRF54LM20A), Chip Antenna, Cut Tape
BLM54LM20A 2.4 GHz 8 dBm GPIO, I2C, I2S, PWM, SPI, UART, USB 1.7 V 3.6 V - 40 C + 85 C Chip 11 mm x 8 mm x 0.6 mm Bluetooth LE Thread, Zigbee - 802.15.4 Multiprotocol Modules Cut Tape
Ezurio 多协议模块 Module, BL54LM20A, (Nordic nRF54LM20A), Chip Antenna, Tape/Reel
BLM54LM20A 2.4 GHz 8 dBm GPIO, I2C, I2S, PWM, SPI, UART, USB 1.7 V 3.6 V - 40 C + 85 C Chip 11 mm x 8 mm x 0.6 mm Bluetooth LE Thread, Zigbee - 802.15.4 Multiprotocol Modules Reel
Ezurio 多协议模块 Module, BL54LM20B, (Nordic nRF54LM20B), MHF4 Connector, Cut Tape
BLM54LM20B 2.4 GHz 8 dBm GPIO, I2C, I2S, PWM, SPI, UART, USB 1.7 V 3.6 V - 40 C + 85 C MHF4 11 mm x 8 mm x 0.6 mm Bluetooth LE Thread, Zigbee - 802.15.4 Multiprotocol Modules Cut Tape
Ezurio 多协议模块 Module, BL54LM20B, (Nordic nRF54LM20B), MHF4 Connector, Tape/Reel
BLM54LM20B 2.4 GHz 8 dBm GPIO, I2C, I2S, PWM, SPI, UART, USB 1.7 V 3.6 V - 40 C + 85 C MHF4 11 mm x 8 mm x 0.6 mm Bluetooth LE Thread, Zigbee - 802.15.4 Multiprotocol Modules Reel
Ezurio 多协议模块 Module, BL54LM20B, (Nordic nRF54LM20B), Chip Antenna, Cut Tape
BLM54LM20B 2.4 GHz 8 dBm GPIO, I2C, I2S, PWM, SPI, UART, USB 1.7 V 3.6 V - 40 C + 85 C Chip 11 mm x 8 mm x 0.6 mm Bluetooth LE Thread, Zigbee - 802.15.4 Multiprotocol Modules Cut Tape
Ezurio 多协议模块 Module, BL54LM20B, (Nordic nRF54LM20B), Chip Antenna, Tape/Reel
BLM54LM20B 2.4 GHz 8 dBm GPIO, I2C, I2S, PWM, SPI, UART, USB 1.7 V 3.6 V - 40 C + 85 C Chip 11 mm x 8 mm x 0.6 mm Bluetooth LE Thread, Zigbee - 802.15.4 Multiprotocol Modules Reel
Telink 多协议模块 The ML9118A module is designed based on Telink WiFi 6 multiprotocol SoC, the TLSR9118. It features WiFi 6 + Bluetooth 5.4, tailored for lowpower IoT applications.
ML9118 I2C, SPI, QSPI, UART 3 V 3.6 V - 40 C + 105 C 18 mm x 25.5 mm x 3.1 mm BLE 802.11 b/g/n ANT, Thread, Zigbee Wireless Modules
Telit Cinterion 多协议模块
2.4 GHz, 5 GHz SPI, UART, USB - 40 C + 85 C WiFi 802.11 a/b/g/n Multiprotocol Module Tray
Telink 多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 35.29 mm x 18 mm x 2.6 mm Wireless Modules Reel
Ezurio 多协议模块 Module, BL54L15, Bluetooth LE, MHF4, Cut Tape
BL54L15 2.402 GHz to 2.48 GHz UART 1.7 V 3.6 V - 40 C + 105 C MHF4 14 mm x 10 mm x 1.6 mm Bluetooth LE 802.15.4 Modules Cut Tape
Ezurio 多协议模块 Module, Sona NX611, 2 x RF Trace, MIMO, SIP, Cut Tape
Sona NX611 2.4 GHz, 5 GHz UART 1.8 V 3.3 V - 40 C + 85 C MHF4 Bluetooth 5.4, Bluetooth LE WiFi 6 WiFi Modules with Bluetooth Cut Tape
Ezurio 多协议模块 Module, Sona NX611, 1 x RF Trace, MIMO, SIP, Tape and Reel
Sona NX611 2.4 GHz to 2.495 GHz, 5.15 GHz to 5.825 GHz SDIO, UART - 40 C + 85 C Trace Pin Bluetooth 5.4, Bluetooth LE WiFi 6 Embedded Modules Reel
Ezurio 多协议模块 Module, Sona MT320, MIMO, M.2 1420, MHF4,Tape and Reel
2.4 GHz, 5 GHz - 40 C + 85 C 20 mm x 14 mm Wireless Modules Reel
Ezurio 多协议模块 Module, Sona MT320, MIMO, M.2 1420, MHF4, Tape and Reel
2.4 GHz, 5 GHz - 40 C + 85 C 20 mm x 14 mm Wireless Modules Reel
Ezurio 多协议模块 Module, Veda SL917, 4MB Flash, NCP, Trace Pad, Cut Tape
Veda SL917 2.4 GHz I2C, SPI, UART 1.8 V 3.3 V - 40 C + 85 C Chip 21.1 mm x 16 mm x 2.3 mm Bluetooth 5.4, Bluetooth LE WiFi 6, 802.11 b/g/n/ax Modules Reel
Ezurio 多协议模块 Module, Veda SL917, 8MB Flash, SoC, Trace Pad, Cut Tape
Veda SL917 2.4 GHz I2C, SPI, UART 1.8 V 3.3 V - 40 C + 85 C Chip 21.1 mm x 16 mm x 2.3 mm Bluetooth 5.4, Bluetooth LE WiFi 6, 802.11 b/g/n/ax Modules Reel
Ezurio 多协议模块 Module, Veda SL917, 4MB Flash, NCP, Integrated Antenna, Cut Tape
Veda SL917 2.4 GHz I2C, SPI, UART 1.8 V 3.3 V - 40 C + 85 C Chip 21.1 mm x 16 mm x 2.3 mm Bluetooth 5.4, Bluetooth LE WiFi 6, 802.11 b/g/n/ax Modules Reel
Ezurio 多协议模块 Module, Veda SL917, 8MB Flash, SoC, Integrated Antenna, Cut Tape
Veda SL917 2.4 GHz I2C, SPI, UART 1.8 V 3.3 V - 40 C + 85 C Chip 21.1 mm x 16 mm x 2.3 mm Bluetooth 5.4, Bluetooth LE WiFi 6, 802.11 b/g/n/ax Modules Reel
Ezurio 多协议模块 Module, BL54L15 , Bluetooth LE, Trace Pin, Tape and Reel
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Multiprotocol Modules Reel, Cut Tape
Ezurio 多协议模块 Module, BL54L10, Bluetooth LE, Trace ANT, Tape and Reel
BL54L10 2.402 GHz to 2.48 GHz 8 dBm I2S, SPI, UART 1.7 V 2.7 V - 40 C + 105 C Trace 14 mm x 10 mm x 1.6 mm Bluetooth LE 802.15.4 Multiprotocol Modules Reel, Cut Tape