- 40 C 多协议模块

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数量 RoHS ECAD模型 系列
频率
输出功率
接口类型
电源电压-最小
电源电压-最大
最小工作温度
最大工作温度
天线连接器类型
尺寸
协议 - 蓝牙、BLE - 802.15.1
协议 - 蜂窝、Nbiot、LTE
协议 - GPS、GLONASS
协议 - Sub GHz
协议 - WiFi - 802.11
协议 - ANT、Thread、Zigbee - 802.15.4
资格
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封装
Quectel 多协议模块 Wi-Fi 6 (dual band 2.4/5GHz) & Bluetooth 5.4 (Bluetooth LE Audio and BLE Long Range), SDI 3.0 interface, 1x antenna, -40 C to +85 C
数据表
2.4 GHz, 5 GHz UART 3 V 4.8 V - 40 C + 85 C 12 mm x 12 mm x 1.55 mm Bluetooth 5.4 WiFi 6, IEEE 802.11a/b/g/n/ac/ax Reel, Cut Tape
Ezurio 多协议模块 60 Series, Sterling Module w/u.FL, SDIO/UART
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60-2230C 2.4 GHz, 5 GHz 18 dBm UART, USB 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Adapters Tray
Espressif Systems 多协议模块 ESP32-S31-WROOM-3 modules are powerful, generic Wi-Fi, Bluetooth 5.4 (LE), Bluetooth Classic and IEEE 802.15.4 MCUs that have a rich set of peripherals. They are an ideal choice for a wide variety of application scenarios related to Internet of Thi
数据表
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GPIO, SPI, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.4 IEEE 802.11ax
Ezurio 多协议模块 Module, Veda IF913, SIP, Tri Band, No Memory, RF Trace Pin, Cut Tape
数据表
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IF913 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Wireless Module Cut Tape
Kaga FEI 多协议模块 WLAN module for NXP IW611. WiFi 6 1x1 dual band, BT, BLE 5.4
数据表
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SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Multiprotocol Modules Tray
Kaga FEI 多协议模块 WLAN + ARM M33 MCU module for NXP RW612. WiFi 6 1x1 dual band, BT, BLE 5.4.
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SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Multiprotocol Modules Tray
GigaDevice 多协议模块 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 15 x 12.4 / 21 GPIO / -40-105 degC
数据表
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2.402 GHz to 2.48 GHz 23.4 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 105 C 9.6 mm x 12.4 mm x 2.4 mm Bluetooth LE V5.2 IEEE 802.11 b/g/n/ax Wireless Module
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 15 x 12.4 / 21 GPIO / -40-105 degC / onboard PCB antenna
数据表
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RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 105 C 15 mm x 12.4 mm x 2.4 mm BLE WiFi Module
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / external IPEX connection
数据表
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RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi Module
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / onboard PCB antenna
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RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi Module
u-blox 多协议模块 Dual-band Wi-Fi 6, BLE Stand-alone module, antenna pin, Open CPU, 16MB, NXP RW610 chip
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IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Multiprotocol Modules Reel, Cut Tape
u-blox 多协议模块 Dual-band Wi-Fi 6, BLE Stand-alone module, PCB antenna, Open CPU, 16MB, NXP RW610 chip
数据表
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IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Multiprotocol Modules Reel, Cut Tape
u-blox 多协议模块 M.2 Type 2230 Key E card with MAYA-W472 Wi-Fi 6 Dual-Band, Bluetooth 5.4, 802.15.4 module
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MAYA-W4 2.405 GHz to 2.48 GHz 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Multiprotocol Modules Tray
u-blox 多协议模块
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MAYA-W3 UART 1.71 V 3.6 V - 40 C + 85 C 14.3 mm x 10.4 mm Bluetooth WiFi Multiprotocol Modules Reel, Cut Tape
u-blox 多协议模块
数据表
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MAYA-W4 2.4 GHz, 5 GHz 18 dBm SPI, UART 3.13 V 3.46 V - 40 C + 85 C U.FL 14.3 mm x 10.4 mm x 1.9 mm Bluetooth WiFi Multiradio Modules Reel, Cut Tape
u-blox 多协议模块
数据表
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MAYA-W4 2.4 GHz to 5.89 GHz 18 dBm USB, UART 1.71 V 3.46 V - 40 C + 85 C U.FL 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Modules Reel, Cut Tape
u-blox 多协议模块
数据表
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MAYA-W4 2.4 GHz, 5 GHz 18 dBm SPI, UART 3.13 V 3.46 V - 40 C + 85 C U.FL 14.3 mm x 10.4 mm x 1.9 mm Bluetooth WiFi Multiradio Modules Reel, Cut Tape
u-blox 多协议模块 Wi-Fi 6 Dual-Band, BLE 5.4, 802.15.4, host-based module, 2 ant pins
数据表
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MAYA-W4 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Multiradio Modules Reel, Cut Tape
u-blox 多协议模块 Wi-Fi 6 Dual-Band, BLE 5.4, 802.15.4, host-based module, U.FL conn, NXP610
数据表
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MAYA-W4 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Multiradio Modules Reel, Cut Tape
u-blox 多协议模块 Wi-Fi 6 Dual-Band, BLE 5.4, 802.15.4, host-based module, embedded antenna
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MAYA-W4 2.402 GHz to 2.48 GHz 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Multiprotocol Modules Reel, Cut Tape
Wurth Elektronik 多协议模块 WIRL-NFW2 Orthosie-I w/o firmware-with RFplug w/ FL & RF shield 9.0x13.0x2.0mm
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WIRL-NFW2 2.472 GHz, 2.48 GHz 21 dBm ADC, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 13 mm x 9.5 mm x 2 mm Bluetooth LE WiFi Radio Modules Reel, Cut Tape, MouseReel
NXP Semiconductors 多协议模块 IW610BHN/A1ZDI
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IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Multiprotocol Modules Tray
NXP Semiconductors 多协议模块 IW610CHN/A1ZDI
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IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Multiprotocol Modules Tray
NXP Semiconductors 多协议模块 IW610FHN/A1ZDI
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IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Multiprotocol Modules Reel, Cut Tape
Murata Electronics 多协议模块 Type 2NR BLE Module
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2.48 GHz 8 dBm I2C, SPI 1.7 V 3.4 V - 40 C + 105 C U.FL 7.4 mm x 7 mm x 1.4 mm Bluetooth Multiprotocol Modules Reel, Cut Tape