多协议模块

结果: 733
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 资格 产品 封装
Silicon Labs 多协议模块 1band nlink Wifi BT4.0 zigbee 无库存
¥237.978
最低: 490
倍数: 490
RS9113 2.4 GHz 17 dBm SDIO, USB 3 V 3.6 V - 40 C + 85 C u.FL 15 mm x 14 mm x 2.1 mm Bluetooth 4.0 Cellular 802.11 a/b/g/n ANT, Thread WiFi Transceiver Modules Tray
Microchip Technology ATWINC3400-MR210CA142-T
Microchip Technology 多协议模块 ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna T&R 无库存交货期 20 周
卷轴
¥100.909
最低: 500
倍数: 500
: 500
2.4 GHz 18.3 dBm 3 V 4.2 V - 40 C + 85 C u.FL 22.43 mmx 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n 802.11 b/g/n, Bluetooth 5.0 Reel
ADLINK Technology RedPine Signals RS9113 WIFI/BT KIT
ADLINK Technology 多协议模块 RS9113-NBZ-D3N IEEE802.11a/b/g/n Dual band mPCIe half Card 1T1R+Dual mode BT4.0+Zigbee 802.15.4 USB interface Combo module 1pcs x WIFI/BT Antenna Operating Temperature range: -40 to +85 C 无库存
¥1,482.7069
¥1,350.4291
¥1,284.9795
最低: 1
倍数: 1
2.4 GHz, 5 GHz 20 dBm 3 V 3.6 V - 40 C + 85 C Bluetooth PCIe 802.11 a/b/g/n 802.15.4 (ANT, Thread, Zigbee)
SparkFun 多协议模块 The Digi XBee 3 global cellular module is a cutting-edge compact module engineered for rapid integration of cellular IoT capabilities. This innovative solution is equipped with cellular and BLE connectivity with end-device carrier certifications an 无库存交货期 2 周
¥875.4675
最低: 1
倍数: 1
23 dBm SPI, UART, USB 3.3 V 4.3 V - 40 C + 85 C SMA 32.94 mm x 24.38 mm BLE LTE-M/NBIoT GNSS BLE, GNSS, LTEM/NBIoT
Jorjin 多协议模块 Based on TI WL1833 and supports 802.11a/b/g/n and BT/BLE 4.2 无库存
卷轴
¥81.8911
最低: 1,800
倍数: 1,800
: 1,800
2.4 GHz, 5 GHz 17 dBm SDIO, UART 2.9 V 4.8 V - 40 C + 85 C 12.8 mm x 12 mm x 1.63 mm Bluetooth 802.11 a/b/g/n Reel
SparkFun 多协议模块 The Digi XBee 3 global cellular module is a compact programmable reliable solution with BLE and end-device carrier certifications for developing secure wireless devices with worldwide connectivity and global positioning. A combination of the XBee e 无库存
¥1,252.4807
最低: 1
倍数: 1
23 dBm SPI, UART, USB 2.8 V 5.5 V - 40 C + 85 C SMA 43.18 mm x 30.48 mm BLE 3G, LTE-M/NBIoT GNSS 3G, BLE, GNSS, LTEM/NBIoT
Silex Technology 多协议模块 [Sample Pack] SX-PCEBE-M2-SP is a Wi-Fi7 2x2 Tri-band IEEE802.11 be WLAN, Bluetooth 5.3 BR/EDR/HS/LE module in a M.2 card form factor (M.2 Card Type 2230-S3-A-E). It is based on Qualcomm's QCC2076 chipset. This is ideal for low quantity purchases fo 无库存交货期 30 周
¥936.9282
¥883.321
¥829.8042
¥776.2083
最低: 1
倍数: 1
SX-PCEBE 2.4 GHz, 5 GHz, 6 GHz USB - 40 C + 85 C MHF4 Bluetooth WiFi Multiprotocol Module Bulk
Silex Technology 多协议模块 1x1 Wi-Fi+BLE radio /basbnd SDIO EvalMod 无库存交货期 30 周
¥625.3307
¥590.6736
¥532.4447
最低: 1
倍数: 1
SX-SDCAC 2.4 GHz, 5 GHz SDIO 3.135 V 3.465 V - 40 C + 85 C MHF4 24 mm x 51 mm x 5.8 mm Bluetooth 5.0 802.11 a/b/g/n/ac WiFi Modules Bulk
Silex Technology 多协议模块 802.11ac+Bluetooth SDIO card SoC 无库存交货期 30 周
¥665.5361
¥620.5395
¥575.7011
最低: 1
倍数: 1
SX-PCEAC2 2.4 GHz, 5 GHz SDIO 3.135 V 3.465 V - 40 C + 85 C MHF4 24 mm x 51 mm x 5.8 mm Bluetooth 5.0 802.11 a/b/g/n/ac Bulk
Silex Technology 多协议模块 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module 无库存交货期 26 周
卷轴
¥307.2018
最低: 500
倍数: 500
: 500
SX-SDMAX 2.4 GHz, 5 GHz UART 1.8 V 3.3 V - 40 C + 85 C MHF 17 mm x 18 mm x 2.65 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax 802.11 a/b/g/n/ac/ax, Bluetooth 5.3 Reel
Silex Technology 多协议模块 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus BLE v5.3 BR/EDR/LE SDIO 3.0 module Sample 无库存交货期 26 周
¥405.9751
¥375.9397
¥333.011
最低: 1
倍数: 1
SX-SDMAX 2.4 GHz, 5 GHz UART 1.8 V 3.3 V - 40 C + 85 C MHF 17 mm x 18 mm x 2.65 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax 802.11 a/b/g/n/ac/ax, Bluetooth 5.3 Cut Tape
Silex Technology 多协议模块 SMPL 802.11a/b/g/nac WLAN + BLE 4.2 SDIO 无库存交货期 30 周
¥433.5923
¥394.5508
¥366.0183
最低: 1
倍数: 1
2.4 GHz, 5 GHz SDIO, UART 3.135 V 3.465 V - 40 C + 85 C u.FL 19 mm x 30 mm x 2.4 mm Bluetooth 5.0 802.11 a/b/g/n/ac Cut Tape
Murata Electronics 多协议模块 Type 2BZ Shielded Small Wi-Fi 11a/b/g/n/ac/ax 2x2 MIMO Bluetooth 5.2 Mod 无库存交货期 22 周
剪切带
¥192.1452
¥167.579
¥159.0588
¥147.3181
卷轴
¥127.7917
最低: 1
倍数: 1
: 1,000
2BZ 2.4 GHz, 5 GHz SDIO Interface, HCI 3 V 4.8 V - 40 C + 85 C u.FL 11.4 mm x 8.9 mm x 1.4 mm Bluetooth 5.2 Reel, Cut Tape, MouseReel
Murata Electronics 多协议模块 Type 2DS Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 无库存交货期 58 周
剪切带
¥57.9012
最低: 1,000
倍数: 1,000
: 500
2DS 2.4 GHz USB 3 V 3.6 V - 40 C + 85 C 25 mm x 14 mm x 2.4 mm WiFi Modules Reel


Quectel 多协议模块 External, 2400-2500 MHz, 5150-5850 MHz, Wi-Fi 6 (Bluetooth), Dipole, -, SMA Male (center pin), Terminal, 200 13 无库存交货期 5 周
¥753.4614
¥662.3947
¥596.7982
¥563.87
最低: 1
倍数: 1
2.4 GHz to 2.5 GHz, 5.15 GHz to 5.85 GHz 33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 GNSS GNSS, LTE Cat 1
Quectel 多协议模块 无库存交货期 5 周
¥389.0138
¥340.8758
¥326.231
¥308.8629
最低: 1
倍数: 1
2.4 GHz ADC, GPIO, I2C, PWM, UART 3 V 3.6 V - 40 C + 85 C 24 mm x 16 mm x 2.6 mm Bluetooth 5.2 802.11 b/g/n 802.11 b/g/n, Bluetooth 5.2
Quectel 多协议模块 无库存交货期 5 周
¥730.7145
¥645.4334
¥619.9519
¥599.8605
最低: 1
倍数: 1
2.4 GHz ADC, GPIO, PWM 3 V 3.6 V - 40 C + 105 C 16.8 mm x 15 mm x 1.85 mm Bluetooth 5.2 802.11 b/g/n 802.11 b/g/n, Bluetooth 5.2
Quectel 多协议模块 无库存交货期 5 周
¥730.7145
¥645.4334
¥619.9519
¥599.8605
最低: 1
倍数: 1
2.4 GHz ADC, GPIO, PWM, UART 3 V 3.6 V - 40 C + 85 C 17.91 mm x 14.99 mm x 2.8 mm Bluetooth 5.2 802.11 b/g/n 802.11 b/g/n, Bluetooth 5.2
Quectel 多协议模块 无库存交货期 5 周
¥636.9132
¥627.6472
¥612.8442
¥592.6624
最低: 1
倍数: 1
2.4 GHz ADC, GPIO, PWM 3 V 3.6 V - 40 C + 105 C 17.3 mm x 15 mm x 2.8 mm Bluetooth 5.2 802.11 b/g/n 802.11 b/g/n, Bluetooth 5.2
CEL 多协议模块 RTL8721, Dual Band, WiFi+BLE, BULK 无库存
CMP4020 2.4 GHz, 5 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.1 Bulk
CEL 多协议模块 WiFi+BLE, USB, Ant. 无库存交货期 18 周
CMP9377 2.4 GHz, 5 GHz 20 dBm USB 3.3 V 3.3 V - 40 C + 85 C Chip 24 mm x 12 mm x 3 mm Bluetooth 5.0 802.11 a/b/g/n/ac Tray
Quectel 多协议模块 Cat 1 + 3G, 4Gbit ROM+2Gbit RAM, North America 无库存交货期 24 周
剪切带
¥912.1134
¥802.2661
¥766.1965
¥737.325
卷轴
¥673.3105
最低: 1
倍数: 1
: 250
2.4 GHz to 2.5 GHz, 5.15 GHz to 5.85 GHz 33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 GNSS GNSS, LTE Cat 1 Reel, Cut Tape
Quectel 多协议模块 Cat 1 + 3G, mPCIe form factor, North America 无库存交货期 24 周
卷轴
¥702.0916
最低: 100
倍数: 100
: 100
2.4 GHz to 2.5 GHz, 5.15 GHz to 5.85 GHz 33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 GNSS GNSS, LTE Cat 1 Reel
Quectel 多协议模块 Cat 1 + 3G + 2G, 4Gbit ROM+2Gbit RAM, Latin A, Australia, NZ 无库存交货期 24 周
卷轴
¥744.8621
最低: 250
倍数: 250
: 250
2.4 GHz to 2.5 GHz, 5.15 GHz to 7.15 GHz 33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 GNSS GNSS, LTE Cat 1 Reel
Quectel 多协议模块 Cat 4 + 3G + 2G, 4Gbit ROM+2Gbit RAM, Support B5, EMEA, Southeast Asia 无库存交货期 14 周
卷轴
¥540.9649
最低: 250
倍数: 250
: 250
850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C External 32 mm x 29 mm x 2.4 mm LTE Cat 4 GNSS GNSS, LTE Cat 4 Reel