多协议模块

结果: 454
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 产品 封装
Telit Cinterion 多协议模块 WE310G4-I (Wi-Fi a/b/g/n+BLE) 47.00.003
5 GHz 8 dBm, 18 dBm, 19 dBm I2C, SPI, UART - 40 C + 85 C 14.3 mm x 13.1 mm x 2.6 mm Bluetooth 5.0 802.11 a/b/g/n Bluetooth Modukes Tray
Telit Cinterion 多协议模块 WE310G4-P (Wi-Fi a/b/g/n+BLE) 47.00.003
5 GHz 8 dBm, 18 dBm, 19 dBm I2C, SPI, UART - 40 C + 85 C 18 mm x 15 mm x 2.6 mm Bluetooth 5.0 802.11 a/b/g/n Bluetooth Modukes Reel, Cut Tape
Telit Cinterion 多协议模块 WE310G4-P (Wi-Fi a/b/g/n+BLE) 47.00.003
5 GHz 8 dBm, 18 dBm, 19 dBm I2C, SPI, UART - 40 C + 85 C 18 mm x 15 mm x 2.6 mm Bluetooth 5.0 802.11 a/b/g/n Bluetooth Modukes Tray
Telit Cinterion 多协议模块

2.4 GHz 8 dBm, 18 dBm SPI, UART - 40 C + 85 C 14.3 mm x 13.1 mm WiFi-802.11 b/g/n Tray
Telit Cinterion 多协议模块 WE866C6-P Wi-Fi 11ac + BT/BLE-5 MODULE
2.4 GHz, 5 GHz UART - 40 C + 85 C 15 mm x 13 mm x 2.2 mm Bluetooth LTE 802.11 a/b/g/n/ac Bluetooth Modules Reel
Texas Instruments 多协议模块 SimpleLink Wi-Fi 6 c ompanion module
CC3300MOD 2.412 GHz to 2.472 GHz 18.4 dBm SPI, UART 1.62 V, 2.97 V 1.98 V, 3.63 V - 40 C + 85 C 11 mm x 11 mm Bluetooth Wi-Fi 6, 802.11ax Reel, Cut Tape, MouseReel
Texas Instruments 多协议模块 SimpleLink dual-band (2.4GHz and 5GHz) W
CC3351MOD 2.41 GHz to 2.47 GHz 18.3 dBm SPI - 40 C + 85 C 10.9 mm x 10.9 mm x 2.1 mm Bluetooth WiFi Multiprotocol Module Reel, Cut Tape, MouseReel
Silicon Labs 多协议模块 SiWG917Y SoC Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 2MB PSRAM in package

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Reel, Cut Tape
CEL 多协议模块 HOSTED DB Wi-Fi 6 + BT5.4 for IoT Connectivity (Bulk)

2.4 GHz, 5 GHz - 40 C + 85 C Bluetooth WiFi Multiprotocol Modules
CEL 多协议模块 HOSTED DB Wi-Fi 6 + BT5.4 for IoT Connectivity (Tape & Reel)

2.4 GHz, 5 GHz - 40 C + 85 C Bluetooth WiFi Multiprotocol Modules
CEL 多协议模块 Tri-mode (WiFi, BT, 802.15.4) Radio w/USB/USB/SPI interface, SMT with Antenna, (Bulk)

2.4 GHz, 5 GHz SPI, USB - 40 C + 85 C 27.8 mm x 16.64 mm x 3.47 mm Bluetooth WiFi Multiprotocol Modules
CEL 多协议模块 Tri-mode (WiFi, BT, 802.15.4) Radio w/USB/USB/SPI interface, SMT with Antenna, (Tape & Reel)

2.4 GHz, 5 GHz SPI, USB - 40 C + 85 C 27.8 mm x 16.64 mm x 3.47 mm Bluetooth WiFi Multiprotocol Modules
Silex Technology 多协议模块 Based on NXP's RW610, IM-100 is a small, stand-alone, dual-band Wi-Fi 6

260 MHz I2C, SPI, UART - 40 C + 85 C MHF 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Multiprotocol Modules Reel
Silex Technology 多协议模块 IM-100 is a small, stand-alone, dual-band Wi-Fi 6 and Bluetooth Low Energy

260 MHz I2C, SPI, UART - 40 C + 85 C MHF 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Multiprotocol Modules Cut Tape
Silex Technology 多协议模块 the option to attach an antenna via a trace. does not include the u.Fl connector

260 MHz I2C, SPI, UART - 40 C + 85 C 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Multiprotocol Modules Reel
Silex Technology 多协议模块 the option to attach an antenna via a trace does not include the u.Fl connector

260 MHz I2C, SPI, UART - 40 C + 85 C 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Multiprotocol Modules Cut Tape
Silex Technology 多协议模块 [Bulk SKU] SX-PCEBE-SMT is a Wi-Fi7 2x2 Tri-band IEEE802.11 be WLAN, Bluetooth 5.3 BR/EDR/HS/LE module in an M.2 LGA Type 1620 Surface Mount form factor. It is based on Qualcomm's QCC2076 chipset.

SX-PCEBE 2.4 GHz, 5 GHz, 6 GHz USB - 40 C + 85 C MHF4 Bluetooth WiFi Multiprotocol Module Reel
Silex Technology 多协议模块 [Sample Pack] SX-PCEBE-SMT-SP is a Wi-Fi 7 2x2 Tri-band IEEE802.11 be WLAN, Bluetooth 5.3 BR/EDR/HS/LE module in an M.2 LGA Type 1620 Surface Mount form factor. It is based on Qualcomm's QCC2076 chipset. This is ideal for low quantity purchases for e

SX-PCEBE 2.4 GHz, 5 GHz, 6 GHz USB - 40 C + 85 C MHF4 Bluetooth WiFi Multiprotocol Module Cut Tape
Quectel 多协议模块
21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS BDS, Galileo, GLONASS, GPS, LTE Cat M1/NB2
Quectel 多协议模块
850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS BDS, EGPRS, Galileo, GLONASS, GPS, LTE Cat M1/NB2
Quectel 多协议模块
2.2 V 4.5 V 17.7 mm x 15.8 mm x 2.2 mm LTE Cat NB2 BDS, Galileo, GLONASS, GPS BDS, Galileo, GLONASS, GPS, LTE Cat NB2
Quectel 多协议模块
2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 15 mm x 13 mm x 2 mm BLE 5.2 802.11 a/b/g/n/ac/ax 802.11 a/b/g/n/ac/ax, BLE 5.2
Quectel 多协议模块
2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 15 mm x 13 mm x 2 mm BLE 5.2 802.11 a/b/g/n/ac/ax 802.11 a/b/g/n/ac/ax, BLE 5.2
Quectel 多协议模块 Wi-Fi 6 and Bluetooth 5.4, Max data rate 600.5Mbps, LCC form factor, -20C to +80C

FCS960K 2.4 GHz, 5 GHz 4 dBm, 18 dBm UART 3 V 3.6 V - 20 C + 80 C 12 mm x 12 mm x 2 mm Bluetooth Wi-Fi, IEEE 802.11 a/b/g/n/ac/ax Multiprotocol Module Reel
Quectel 多协议模块 Wi-Fi 6 and Bluetooth 5.4, Max data rate 600.5Mbps, LCC form factor, -40C to +85C

FCS960K 2.4 GHz, 5 GHz 4 dBm, 18 dBm UART, USB 3 V 3.6 V - 40 C + 85 C 12 mm x 12 mm x 2 mm Bluetooth Wi-Fi, IEEE 802.11 a/b/g/n/ac/ax Multiprotocol Module Reel