多协议模块

结果: 454
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 产品 封装
Embedded Artists 多协议模块 2EL M.2 Wi-Fi 6 a/b/g/n/ac/ax, Bluetooth 5.3 with IW612 chipset and LBES5PL2EL
323预期 2027/2/26
最低: 1
倍数: 1

2.4 GHz to 2.484 GHz 2.6 dBm SPI - 40 C + 85 C 802.11 a/b/g/n/ac/ax Bulk
Nordic Semiconductor 多协议模块 Lower Power SIP for cellular IoT and DECT NR+
37,666在途量
最低: 1
倍数: 1
: 2,000

nRF91 23 dBm I2C, I2S, SPI, UART, USB 3 V 5.5 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Nordic Semiconductor 多协议模块 Lower Power SIP for cellular IoT and DECT NR+
4,088在途量
最低: 1
倍数: 1
: 100

nRF91 23 dBm I2C, I2S, SPI, UART, USB 3 V 5.5 V - 40 C + 85 C Reel, Cut Tape
Nordic Semiconductor 多协议模块 Low Power Cellular IoT SIP, LTE-M, NB-IoT, GNSS wireless modem
2,500预期 2026/12/25
最低: 1
倍数: 1
: 2,500

700 MHz to 2.2 GHz 23 dBm I2C, I2S, SPI, UART 3 V 5.5 V - 40 C + 85 C 16 mm x 10.5 mm x 1.04 mm DECT NR+, LTE Cat-M1/NB1/NB2 GPS, QZSS DECT NR+, GPS, LTE CatM1/NB1/NB2, QZSS Reel, Cut Tape
CEL 多协议模块 ZB/Thread/BT, +20dBm, 1.64Mb, Antenna BULK 3库存量
最低: 1
倍数: 1

2.4 GHz 20 dBm ADC, GPIO, I2C, QSPI, SPI, UART, USB 3.3 V 3.3 V - 40 C + 85 C PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Thread, Zigbee Bulk
Silicon Labs 多协议模块 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules
1,716在途量
最低: 1
倍数: 1

2.4 GHz, 5 GHz 18 dBm SDIO, UART, USB 1.85 V 3.3 V - 40 C + 85 C External 9.8 mm x 9.1 mm x 1.6 mm Bluetooth 5.0 802.11 a/b/g/n WiFi Modules Tray
Ezurio 多协议模块 Sterling LWB+, MHF4, Tape and Reel
1,500预期 2026/10/2
最低: 1
倍数: 1
: 800

Sterling-LWB+ 2.4 GHz SDIO, UART 3.3 V 3.3 V - 40 C + 85 C 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Reel, Cut Tape
Ezurio 多协议模块 Module, Sona MT320, MIMO, M.2 1420, RF Trace, Cut Tape
449预期 2027/3/9
最低: 1
倍数: 1

2.4 GHz, 5 GHz - 40 C + 85 C 20 mm x 14 mm Wireless Modules Cut Tape
u-blox 多协议模块 RW612, 802.11ax+BLE+802.15.4, ant pin, open CPU, 16MB
495预期 2027/1/18
最低: 1
倍数: 1
: 250

2.4 GHz, 5 GHz 11 dBm 3.15 V 3.45 V - 40 C + 85 C Antenna Pin Bluetooth LE/IEEE 802.15.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape, MouseReel
u-blox 多协议模块 IW612, 802.11ax+BT+802.15.4, 1 PCB antenna or ant. pin
958在途量
最低: 1
倍数: 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C PCB Antenna 14.3 mm x 10.4 mm x 1.9 mm Multiprotocol Modules Reel, Cut Tape, MouseReel
u-blox 多协议模块 Host-based dual-band Wi-Fi 6 and Bluetooth LE module for IoT, 1 antenna pin
500预期 2026/12/31
最低: 1
倍数: 1
: 500

MAYA-W4 2.4 GHz, 5 GHz 15 dBm, 18 dBm SPI, UART, USB 3.13 VDC 3.46 VDC - 40 C + 85 C Pin 14.3 mm x 10.4 mm x 1.9 mm Bluetooth and Wi-Fi Modules Reel, Cut Tape
u-blox 多协议模块 ESP32, 802.11bgn+BT, PCB antenna, u-connectXpress
497预期 2026/11/19
最低: 1
倍数: 1
: 500

NINA-W15 2.4 GHz 8 dBm, 18 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C u.FL Bluetooth 802.11 b/g/n WiFi, BLE Modules Reel, Cut Tape
u-blox 多协议模块 RTL8720DF, 802.11abgn+BLE, PCB antenna, u-cX
1,000预期 2026/12/7
最低: 1
倍数: 1
: 500

NORA-W36 3 V 3.6 V - 40 C + 105 C PCB Antenna 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
Texas Instruments 多协议模块 SimpleLink multipro tocol 2.4-GHz wirele
1,900预期 2026/9/18
最低: 1
倍数: 1
: 2,000

CC2651R3SIPA 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External, Integrated 7 mm x 7 mm BLE Thread, Zigbee Multiprotocol Modules Reel, Cut Tape, MouseReel
Silicon Labs 多协议模块 MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin
800预期 2026/11/6
最低: 1
倍数: 1

2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Bluetooth Modules Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
1,000预期 2026/9/25
最低: 1
倍数: 1
: 1,000

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Reel, Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
600预期 2027/1/22
最低: 1
倍数: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Cut Tape
Silicon Labs 多协议模块 SiWN917Y NCP Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 4MB Flash in IC package?
400在途量
最低: 1
倍数: 1

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Cut Tape
NXP Semiconductors 多协议模块 IW611HN/A1C
25预期 2026/10/29
最低: 1
倍数: 1
: 2,000

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Bluetooth Modules Reel, Cut Tape
NXP Semiconductors 多协议模块 IW612HN/A1I
100预期 2026/10/29
最低: 1
倍数: 1
: 2,000

IW612HN 2.4 GHz, 5 GHz I2S Bluetooth 5.2 Bluetooth Modules Reel, Cut Tape
Murata Electronics 多协议模块 Type 2DL-921, Shielded Small Wi-Fi 11a/b/g/n/ac/ax + Bluetooth 5.3 Module
2,675在途量
最低: 1
倍数: 1
: 1,000

2DL 2.4 GHz, 5 GHz 18 dBm UART 1.71 V 3.46 V - 40 C + 85 C u.FL 8.8 mm x 7.7 mm x 1.3 mm Bluetooth 5.3 Bluetooth Modules Reel, Cut Tape, MouseReel
Advantech 多协议模块 Advantech Wi-Fi 7+BT5.3, Qualcomm WCN7851, 2T2R,M.2 2230 E key (Wi-Fi: PCIe/BT:USB)
16在途量
最低: 1
倍数: 1

AIW-173BQ 6 GHz UART, USB 3 V 3.3 V - 40 C + 85 C MHF4 802.11 b/g/n/ac/ax/be, WiFi 7 Multiprotocol Module
Murata Electronics 多协议模块 RF TXRX MODULE 5.4/WIFI 6
1,000预期 2027/1/13
最低: 1
倍数: 1
: 1,000

17 dBm SPI 1.71 V 3.46 V - 40 C + 85 C 8.8 mm x 7.7 mm x 1.3 mm 802.11 a/b/g/n/ac/ax Multiprotocol Modules Reel, Cut Tape
Quectel 多协议模块 Global LTE Cat 1bis w/ GNSS
228预期 2026/10/15
最低: 1
倍数: 1
: 250

ADC, I2C, PCM, SPI, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C 26.5 mm x 22.5 mm x 2.4 mm LTE Cat 1 GNSS GNSS, LTE Cat 1 Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 6 (2.4GHz/5GHz), ?IEEE 802.11a/b/g/n/ac/ax, BLE 5.4, Thread 802.15.4, Antenna 1 1 (1T1R), 2 antennas, Wi-Fi application: SDIO 3.0, -40C +85C
90在途量
最低: 1
倍数: 1
: 500
2.4 GHz, 5 GHz SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 23 mm x 14 mm x 2.2 mm BLE 5.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape