SMD/SMT 多协议模块

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数量 RoHS ECAD模型 系列
频率
输出功率
接口类型
电源电压-最小
电源电压-最大
最小工作温度
最大工作温度
天线连接器类型
尺寸
协议 - 蓝牙、BLE - 802.15.1
协议 - 蜂窝、Nbiot、LTE
协议 - GPS、GLONASS
协议 - Sub GHz
协议 - WiFi - 802.11
协议 - ANT、Thread、Zigbee - 802.15.4
产品
封装
NXP Semiconductors 多协议模块 IW610FUK/A1ZDI
数据表

IW610FUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Multiprotocol Modules Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 6 (dual band 2.4/5GHz) & Bluetooth 5.4 (Bluetooth LE Audio and BLE Long Range), SDI 3.0 interface, 1x antenna, -40 C to +85 C
数据表
2.4 GHz, 5 GHz UART 3 V 4.8 V - 40 C + 85 C 12 mm x 12 mm x 1.55 mm Bluetooth 5.4 WiFi 6, IEEE 802.11a/b/g/n/ac/ax Reel, Cut Tape
Espressif Systems 多协议模块 ESP32-S31-WROOM-3 modules are powerful, generic Wi-Fi, Bluetooth 5.4 (LE), Bluetooth Classic and IEEE 802.15.4 MCUs that have a rich set of peripherals. They are an ideal choice for a wide variety of application scenarios related to Internet of Thi
数据表
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GPIO, SPI, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.4 IEEE 802.11ax
Kaga FEI 多协议模块 WLAN module for NXP IW611. WiFi 6 1x1 dual band, BT, BLE 5.4
数据表
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SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Multiprotocol Modules Tray
Kaga FEI 多协议模块 WLAN + ARM M33 MCU module for NXP RW612. WiFi 6 1x1 dual band, BT, BLE 5.4.
数据表
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SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Multiprotocol Modules Tray
GigaDevice 多协议模块 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 15 x 12.4 / 21 GPIO / -40-105 degC
数据表
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23.4 dBm 3 V 3.6 V - 40 C + 105 C 9.6 mm x 12.4 mm x 2.4 mm Wireless Module
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 15 x 12.4 / 21 GPIO / -40-105 degC / onboard PCB antenna
数据表
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RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 105 C 15 mm x 12.4 mm x 2.4 mm BLE WiFi Module
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / external IPEX connection
数据表
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RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi Module
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / onboard PCB antenna
数据表
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RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi Module
u-blox 多协议模块 Dual-band Wi-Fi 6, BLE Stand-alone module, antenna pin, Open CPU, 16MB, NXP RW610 chip
数据表
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IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Multiprotocol Modules Reel, Cut Tape
u-blox 多协议模块 Dual-band Wi-Fi 6, BLE Stand-alone module, PCB antenna, Open CPU, 16MB, NXP RW610 chip
数据表
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IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Multiprotocol Modules Reel, Cut Tape
NXP Semiconductors 多协议模块 IW610BHN/A1ZDI
数据表
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IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Multiprotocol Modules Tray
NXP Semiconductors 多协议模块 IW610CHN/A1ZDI
数据表
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IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Multiprotocol Modules Tray
NXP Semiconductors 多协议模块 IW610FHN/A1ZDI
数据表
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IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Multiprotocol Modules Reel, Cut Tape
Quectel 多协议模块 2.4 GHz + 5 GHz + 6 GHz,Triple-band Wi-Fi 7, BT6.0 dual-mode
数据表
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2.4 GHz, 5 GHz, 6 GHz 3 V 3.6 V - 30 C + 85 C 15 mm x 13 mm x 1.8 mm Bluetooth WiFi, 802.11 a/b/g/n/ac/ax/be Multiprotocol Module Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 (2T2R), 2.4/ 5 GHz dual-band, PCIe interface, 2 antennas (BT 5.2 shares 1 Wi-Fi antenna), -40 C to +85 C
数据表
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2.4 GHz, 5 GHz 3.1 V 3.6 V' - 40 C + 85 C 15 mm x 13 mm x 2.2 mm Bluetooth 5.2 Wi-Fi 6, IEEE 802.11a/b/g/n/ac/ax Multiprotocol Modules Reel, Cut Tape
Telink 多协议模块 The ML9118A module is designed based on Telink WiFi 6 multiprotocol SoC, the TLSR9118. It features WiFi 6 + Bluetooth 5.4, tailored for lowpower IoT applications.
数据表

ML9118 I2C, SPI, QSPI, UART 3 V 3.6 V - 40 C + 105 C 18 mm x 25.5 mm x 3.1 mm BLE 802.11 b/g/n ANT, Thread, Zigbee Wireless Modules
Ezurio 多协议模块 Module, Sona MT320, MIMO, M.2 1420, MHF4,Tape and Reel
数据表
2.4 GHz, 5 GHz - 40 C + 85 C 20 mm x 14 mm Wireless Modules Reel
Ezurio 多协议模块 Module, Sona MT320, MIMO, M.2 1420, MHF4, Tape and Reel
数据表
2.4 GHz, 5 GHz - 40 C + 85 C 20 mm x 14 mm Wireless Modules Reel
Ezurio 多协议模块 Module, Veda SL917, 4MB Flash, NCP, Trace Pad, Cut Tape
数据表
Veda SL917 2.4 GHz I2C, SPI, UART 1.8 V 3.3 V - 40 C + 85 C Chip 21.1 mm x 16 mm x 2.3 mm Bluetooth 5.4, Bluetooth LE WiFi 6, 802.11 b/g/n/ax Modules Reel
Ezurio 多协议模块 Module, Veda SL917, 8MB Flash, SoC, Trace Pad, Cut Tape
数据表
Veda SL917 2.4 GHz I2C, SPI, UART 1.8 V 3.3 V - 40 C + 85 C Chip 21.1 mm x 16 mm x 2.3 mm Bluetooth 5.4, Bluetooth LE WiFi 6, 802.11 b/g/n/ax Modules Reel, Cut Tape, MouseReel
Ezurio 多协议模块 Module, Veda SL917, 4MB Flash, NCP, Integrated Antenna, Cut Tape
数据表
Veda SL917 2.4 GHz I2C, SPI, UART 1.8 V 3.3 V - 40 C + 85 C Chip 21.1 mm x 16 mm x 2.3 mm Bluetooth 5.4, Bluetooth LE WiFi 6, 802.11 b/g/n/ax Modules Reel
Ezurio 多协议模块 Module, Veda SL917, 8MB Flash, SoC, Integrated Antenna, Cut Tape
数据表
Veda SL917 2.4 GHz I2C, SPI, UART 1.8 V 3.3 V - 40 C + 85 C Chip 21.1 mm x 16 mm x 2.3 mm Bluetooth 5.4, Bluetooth LE WiFi 6, 802.11 b/g/n/ax Modules Reel
Ezurio 多协议模块 Module, BL54L15, Bluetooth LE, Trace Pin, Tape and Reel
数据表
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Multiprotocol Modules Reel, Cut Tape
Ezurio 多协议模块 Module, BL54L10, Bluetooth LE, Trace ANT, Tape and Reel
数据表
BL54L10 2.402 GHz to 2.48 GHz 8 dBm I2S, SPI, UART 1.7 V 2.7 V - 40 C + 105 C Trace 14 mm x 10 mm x 1.6 mm Bluetooth LE 802.15.4 Multiprotocol Modules Reel, Cut Tape