多协议模块

结果: 246
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 产品 封装
Espressif Systems 多协议模块 SMD module, ESP32-S3, 8 MB SPI flash, IPEX antenna connector 793库存量
6,500预期 2026/12/16
最低: 1
倍数: 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
Espressif Systems 多协议模块 SMD Module ESP32-WROVER-E, ESP32-D0WD-V3, 3.3V 64Mbit PSRAM, 4 MB SPI flash, PCB Antenna 1,440库存量
6,500预期 2026/9/21
最低: 1
倍数: 1

ESP32-WROVER 2.4 GHz 20 dBm ADC, DAC, GPIO, I2C, I2S, PWM, SD Card, SDIO, SPI, TWAI, UART 3 V 3.6 V - 40 C + 85 C PCB 18 mm x 31.4 mm x 3.3 mm BLE, Bluetooth 4.2 802.11 b/g/n Tray
Microchip Technology 多协议模块 b/g/n + Bluetooth 4 Module U.FL Antenna 46库存量
最低: 1
倍数: 1

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Embedded Artists 多协议模块 1ZM M.2 Wi-Fi 5 a/b/g/n/ac, Bluetooth 5.1 with 88W8987 chipset and LBEE5QD1ZM 14库存量
最低: 1
倍数: 1

2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.6 V - 30 C + 85 C u.FL 22 mm x 44 mm Bluetooth 5.1 802.11 a/b/g/n/ac WiFi Modules Bulk
Embedded Artists 多协议模块 1XK M.2 Wi-Fi 4 a/b/g/n, Bluetooth 5.2 with IW416 chipset and LBEE5CJ1XK module 1库存量
4预期 2026/9/10
最低: 1
倍数: 1

2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.5 V - 40 C + 85 C Integrated 22 mm x 44 mm Bluetooth 5.2 802.11 b/g/n Bulk
Embedded Artists 多协议模块 2XS M.2 Wi-Fi 6 a/b/g/n/ac/ax MIMO, Bluetooth 5.3 with 88W9098 and LBEE5ZZ2XS 无库存交货期 4 周
最低: 1
倍数: 1

2.4 GHz, 5 GHz UART, USB 3.14 V 3.46 V - 40 C + 85 C u.FL 22 mm x 30 mm x 1.5 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax 802.11 a/b/g/n/ac/ax, Bluetooth 5.3 Bulk
Espressif Systems 多协议模块 SMD module, ESP32-C3FH4, IPEX antenna connector, -40 C +105 C 3,343库存量
最低: 1
倍数: 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 2.7 V 3.6 V - 40 C + 105 C External 13.2 mm x 12.5 mm x 2.4 mm Bluetooth Tray
Espressif Systems 多协议模块 SMD module, ESP32-S3R8 with 8 MB Octal PSRAM die inside, 4 MB Quad SPI flash, IPEX antenna connector 165库存量
6,500预期 2026/11/23
最低: 1
倍数: 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 65 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
Espressif Systems 多协议模块 SMD module, ESP32-S3, 16 MB SPI flash, IPEX antenna connector 242库存量
4,550预期 2026/11/20
最低: 1
倍数: 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
Microchip Technology 多协议模块 ATWILC3000 802.11 b/g/n + Bluetooth 5 Module U.FL Antenna 26库存量
864预期 2026/11/23
最低: 1
倍数: 1

2.4 GHz 18.5 dBm SDIO, SPI, UART 1.62 V 3.6 V - 40 C + 85 C u.FL 22.4 mm x 14.7 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Microchip Technology 多协议模块 Wi-Fi + Bluetooth LE Module,u.FL Antenna 26库存量
最低: 1
倍数: 1

2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Microchip Technology 多协议模块 ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna 22库存量
最低: 1
倍数: 1
2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 Tray

Silicon Labs 多协议模块 Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), MVP, 78 MHz, 10 dBm 7库存量
1,300预期 2026/9/25
最低: 1
倍数: 1

xGM240S 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C Built-In, RF 7 mm x 7 mm x 1.18 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Tray
HMS Networks 多协议模块 Wireless Sunbolt-Serial 1库存量
最低: 1
倍数: 1

Anybus Wireless 2.4 GHz, 5 GHz 18 dBm Bluetooth, Ethernet, Serial, WiFi 9 V 30 V - 40 C + 65 C Built-In 68 mm x 75 mm Bluetooth 2.1 802.11 a/b/g/n/d Multiprotocol Modules Bulk
Embedded Artists 多协议模块 2AE M.2 Wi-Fi 5 a/b/g/n/ac, Bluetooth 5.2 with CYW4373E chipset and LBEE5PK2AE 20库存量
33预期 2026/10/30
最低: 1
倍数: 1

2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.5 V - 30 C + 85 C u.FL 22 mm x 44 mm Bluetooth 5.2 802.11 a/b/g/n/ac WiFi Modules Bulk
Embedded Artists 多协议模块 2BZ M.2 Wi-Fi 5 a/b/g/n/ac MIMO, Bluetooth 5.2 with CYW54590 and LBEE5XV2BZ 3库存量
最低: 1
倍数: 1

2.4 GHz, 5 GHz UART, USB 3.3 V 3.6 V - 40 C + 85 C u.FL 22 mm x 30 mm x 1.5 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax 802.11 a/b/g/n/ac/ax, Bluetooth 5.2 Bulk
Telit Cinterion 多协议模块 WE310F5-I (Wi-Fi b/g/n + BLE) 39.00.008 53库存量
1,960预期 2026/9/17
最低: 1
倍数: 1
2.4 GHz 8 dBm, 18 dBm SPI, UART - 40 C + 85 C 18 mm x 15 mm x 2.6 mm Bluetooth 802.11 b/g/n Bluetooth Modules Tray
Silex Technology 多协议模块 [Bulk SKU] SX-PCEAX-HMC is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in a half-height Mini PCIe Card form factor. It is based on Qualcomm's QCA2066 chipset. 501库存量
最低: 1
倍数: 1

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe 3.3 V 3.3 V - 20 C + 65 C 29.85 mm x 26.65 mm x 2.9 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Tray
Ezurio 多协议模块 SDIO 802.11a/b/g/n M2 Module and Bluetooth 4.0 UART 8库存量
最低: 1
倍数: 1

2.4 GHz, 5 GHz 18 dBm SDIO, UART 3.2 V 3.46 V - 30 C + 85 C RF 22 mm x 30 mm x 3.3 mm Bluetooth 4.0 802.11 a/b/g/n Tray
InnoPhase IoT 多协议模块 WiFi/BLE5/MCU Module w/ RF Antenna Pin Reduced Footprint 199库存量
最低: 1
倍数: 1

2.4 GHz 17.5 dBm SPI, UART 2.6 V 3.6 V - 40 C + 85 C RF 12.8 mm x 15 mm x 2.5 mm BLE 5.0 802.11 b/g/n 802.11 b/g/n, BLE 5.0 Tray
InnoPhase IoT 多协议模块 WiFi/BLE5/MCU Module w/ U.FL Antenna Connector 93库存量
最低: 1
倍数: 1
2.4 GHz 17.5 dBm SPI, UART 2.6 V 3.6 V - 40 C + 85 C u.FL 12.8 mm x 17 mm x 2.5 mm BLE 5.0 802.11 b/g/n 802.11 b/g/n, BLE 5.0 Tray
Ezurio 多协议模块 Module, Sona IF573, MIMO, M.2, Key E, PCIe, UART
1,252在途量
最低: 1
倍数: 1

Sona IF573 2.4 GHz, 5 GHz, 6 GHz UART 3.13 V 3.47 V - 40 C + 85 C MHF4 Bluetooth Core 6.0, Bluetooth LE WiFi 6E, 802.11 a/b/g/n/ax Tray
Ezurio 多协议模块 Module, Sona NX611, MIMO, M.2 2230, 1 x MHF4, Tray
1,260在途量
最低: 1
倍数: 1

Sona NX611 2.4 GHz, 5 GHz UART 1.8 V 3.3 V - 40 C + 85 C MHF4 Bluetooth 5.4, Bluetooth LE WiFi 6 WiFi Modules with Bluetooth Tray
Ezurio 多协议模块 60 Series, Sterling Module w/u.FL, USB/USB
500预期 2026/9/18
最低: 1
倍数: 1

60-2230C 2.4 GHz, 5 GHz 18 dBm UART, USB 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Adapters Tray
Quectel 多协议模块 Cat 4, 4Gbit ROM+2Gbit RAM, LTE only, Data only application, North America, mPCIe form factor 89库存量
最低: 1
倍数: 1

700 MHz to 960 MHz, 1.71 GHz to 2.69 GHz, 3.3 GHz to 5 GHz I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C SMA 51 mm x 30 mm x 4.9 mm LTE Cat 4 GNSS GNSS, LTE Cat 4 Tray