多协议模块

结果: 240
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 产品 封装
Embedded Artists 多协议模块 2DL M.2 Module 无库存
¥434.4285
最低: 1,000
倍数: 1
2.4 GHz to 5 GHz SPI 3 V 3.6 V - 40 C + 85 C WiFi Modules Bulk
Silicon Labs 多协议模块 EFR32MG13 Mesh SiP Module, 2.4GHz, 512kB Flash, +10 dBm 无库存
¥103.7227
¥102.8187
最低: 260
倍数: 260
MGM13S 2.4 GHz Mesh Network Modules Tray
Silicon Labs 多协议模块 MGM13S12F512GN Mighty Gecko SiP Module for Zigbee and Thread 802.15.4 Mesh and Multiprotocol Connec 无库存
¥97.1122
¥94.6262
¥91.982
最低: 260
倍数: 260
MGM13S 2.4 GHz Network Modules Tray
Silicon Labs 多协议模块 PMOD Card 802.11abgn BT4.0 + ZigBee 无库存
¥411.9415
¥382.1434
¥358.1761
¥347.1473
最低: 10
倍数: 1
RS9113 2.4 GHz, 5 GHz 18 dBm SDIO, SPI, UART, USB 3 V 3.6 V - 40 C + 85 C Integrated, u.FL 16 mm x 27 mm x 3.1 mm Bluetooth 4.0 802.11 a/b/g/n 802.15.4 (ANT, Thread, Zigbee) Bulk
Silicon Labs 多协议模块 1band nlink Wifi BT4.0 zigbee 无库存
¥237.978
最低: 490
倍数: 490
RS9113 2.4 GHz 17 dBm SDIO, USB 3 V 3.6 V - 40 C + 85 C u.FL 15 mm x 14 mm x 2.1 mm Bluetooth 4.0 Cellular 802.11 a/b/g/n ANT, Thread WiFi Transceiver Modules Tray
Ezurio SU60-2230C-P
Ezurio 多协议模块 60 Series, Summit Module w/u.FL, PCIE/UART, (NXP Cortex A5, 88W8997) 无库存
¥419.2865
最低: 100
倍数: 100
60-2230C Bluetooth 5.1 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 5.1 Tray
Ezurio SU60-2230C-PU
Ezurio 多协议模块 60 Series, Summit Module w/u.FL, PCIE/USB, (NXP Cortex A5, 88W8997) 无库存
¥434.259
最低: 100
倍数: 100
60-2230C Bluetooth 5.1 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 5.1 Tray
Ezurio SU60-2230C-U
Ezurio 多协议模块 60 Series, Summit Module w/u.FL, USB/UART, (NXP Cortex A5, 88W8997, 88PG823) 无库存
¥419.2865
最低: 100
倍数: 100
60-2230C Bluetooth 5.1 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 5.1 Tray
Kaga FEI WYSEGVGXG
Kaga FEI 多协议模块 WiFi 11ac/a/b/g/n, Bluetooth V4.2. Size 24.0 x 11.5 x2.0mm module with RF connector. 无库存
¥179.9073
最低: 960
倍数: 960
Tray
Infineon Technologies CYW89820BWMLG
Infineon Technologies 多协议模块 BTBLE AUTO 无库存交货期 13 周
¥32.4197
最低: 2,600
倍数: 2,600
WiFi Modules Tray
NXP Semiconductors IW620HN/B1CPK
NXP Semiconductors 多协议模块 IW620HN/B1CP 无库存交货期 16 周
¥142.1088
最低: 840
倍数: 840
IW620 Tray
Ezurio WH-M2US50NBT
Ezurio 多协议模块 USB 802.11a/b/g/n M2 Module and Bluetoot 无库存
¥488.5216
最低: 75
倍数: 1
Bluetooth Tray
Silex Technology 多协议模块 2x2 Dual Band 802.11 ac WLAN+BT PCIe 无库存交货期 42 周
¥409.4442
最低: 100
倍数: 100
SX-PCEAC2 2.4 GHz, 5 GHz Serial 3.3 V 3.3 V 0 C + 70 C 30 mm x 26.8 mm x 3.4 mm Bluetooth 5.0 PCIe 802.11 a/b/g/n/ac WiFi Modules Tray
Silex Technology 多协议模块 [Bulk SKU] SX-PCEAC2 is a 2.4 GHz / 5GHz dual band IEEE802.11 a/b/g/n/ac WLAN, Bluetooth 5.0 BR/EDR/LE module based and Low power PCI express interface on Qualcomm QCA6174A-5 chipset. This SKU is the M.2 1630 PCI-E card type. 无库存交货期 32 周
¥409.4442
最低: 100
倍数: 100
SX-PCEAC2 2.4 GHz, 5 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 70 C MHF4 30 mm x 16.5 mm x 2.34 mm Bluetooth 5.0 802.11 a/b/g/n/ac Tray
Silex Technology 多协议模块 [Sample Pack] SX-PCEAX-HMC-SP is a sample pack SKU ideal for small quantities used for evaluation and small pilot builds. SX-PCEAX-HMC-SP is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in a half-height Mini P 无库存交货期 50 周
¥810.4473
¥755.6084
¥701.0181
最低: 1
倍数: 1
SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 65 C MHF4 29.85 mm x 26.65 mm x 2.9 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Bulk
Silex Technology 多协议模块 [Bulk SKU] SX-PCEAX-M2 is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 Card Type 2230-S3-A-E form factor. It is based on Qualcomm's QCA2066 chipset. 无库存交货期 50 周
¥642.8683
最低: 100
倍数: 100
SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe 3.3 V 3.3 V - 20 C + 65 C 22 mm x 30 mm x 2.7 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Tray
Silex Technology 多协议模块 [Sample Pack] SX-PCEBE-M2-SP is a Wi-Fi7 2x2 Tri-band IEEE802.11 be WLAN, Bluetooth 5.3 BR/EDR/HS/LE module in a M.2 card form factor (M.2 Card Type 2230-S3-A-E). It is based on Qualcomm's QCC2076 chipset. This is ideal for low quantity purchases fo 无库存交货期 42 周
¥936.9282
¥883.321
¥829.8042
¥776.2083
最低: 1
倍数: 1
SX-PCEBE 2.4 GHz, 5 GHz, 6 GHz USB - 40 C + 85 C MHF4 Bluetooth WiFi Multiprotocol Module Bulk
Silex Technology 多协议模块 1x1 Wi-Fi+BLE radio /baseband SDIO Card 无库存交货期 32 周
¥575.7011
最低: 100
倍数: 100
SX-SDCAC Bluetooth 5.0 802.11 a/b/g/n/ac WiFi Modules Bulk
Silex Technology 多协议模块 1x1 Wi-Fi+BLE radio /basbnd SDIO EvalMod 无库存交货期 32 周
¥625.3307
¥590.6736
¥532.4447
最低: 1
倍数: 1
SX-SDCAC 2.4 GHz, 5 GHz SDIO 3.135 V 3.465 V - 40 C + 85 C MHF4 24 mm x 51 mm x 5.8 mm Bluetooth 5.0 802.11 a/b/g/n/ac WiFi Modules Bulk
Silex Technology 多协议模块 802.11ac+Bluetooth SDIO card SoC 无库存交货期 32 周
¥665.5361
¥620.5395
¥575.7011
最低: 1
倍数: 1
SX-PCEAC2 2.4 GHz, 5 GHz SDIO 3.135 V 3.465 V - 40 C + 85 C MHF4 24 mm x 51 mm x 5.8 mm Bluetooth 5.0 802.11 a/b/g/n/ac Bulk
Silex Technology 多协议模块 The Silex SX-SDCAC Plus is a next generation 802.11a/b/g/n/ac plus Bluetooth SDIO card based on the QCA9377-3 System-on-Chip (SoC). The SX-SDCAC Plus is mechanically designed in a SD card form factor to provide customers with a vendor independent for 无库存交货期 32 周
¥665.5361
¥620.5395
¥575.7011
最低: 1
倍数: 1
Bulk
Silex Technology 多协议模块 Type A USB Connector 无库存交货期 32 周
¥458.4071
最低: 100
倍数: 100
SX-USBAC 2.4 GHz, 5 GHz USB 3.3 V 3.3 V - 20 C + 85 C MHF1 52 mm x 22 mm x 2.75 mm Bluetooth 5.0 802.11 a/b/g/n/ac Bulk
Quectel 多协议模块 无库存交货期 5 周
¥636.9132
¥627.489
¥612.5956
¥592.4929
最低: 1
倍数: 1
ADC, I2C, PCM, SPI, UART, USB 2.0 3.3 V 4.3 V 29 mm x 25 mm x 2.3 mm LTE Cat 4 GNSS GNSS, LTE Cat 4 Tray
CEL 多协议模块 RTL8721, Dual Band, WiFi+BLE, BULK 无库存
CMP4020 2.4 GHz, 5 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.1 Bulk
CEL 多协议模块 WiFi+BLE, USB, Ant. 无库存交货期 18 周
CMP9377 2.4 GHz, 5 GHz 20 dBm USB 3.3 V 3.3 V - 40 C + 85 C Chip 24 mm x 12 mm x 3 mm Bluetooth 5.0 802.11 a/b/g/n/ac Tray