Cut Tape 多协议模块

结果: 435
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 资格 产品 封装
Silicon Labs 多协议模块 SiWG917Y SoC Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 4MB Flash in IC package 147库存量
最低: 1
倍数: 1
SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Cut Tape
Murata Electronics 多协议模块 Compact LoRa Edge module 659库存量
最低: 1
倍数: 1
: 1,000

2DT 860 MHz to 930 MHz, 2.412 GHz to 2.484 GHz 21 dBm GPIO, Serial 1.8 V 3.6 V - 40 C + 85 C 9.98 mm x 8.7 mm x 1.74 mm BPS, BeiDou LoRa Edge 802.11 b/g/n Multiprotocol Modules Reel, Cut Tape
Murata Electronics 多协议模块 Multi-band LoRa connectivity module 462库存量
1,000预期 2027/3/25
最低: 1
倍数: 1
: 1,000

2GT 2.4 GHz GPIO, Serial - 40 C + 85 C 9.98 mm x 8.7 mm x 1.74 mm Multiprotocol Modules Reel, Cut Tape
Murata Electronics 多协议模块 Qorvo UWB MODULE Type 2AB 259库存量
1,000预期 2027/3/22
最低: 1
倍数: 1
: 1,000

2AB-828 I2C, SPI, UART, USB - 40 C + 85 C 10.5 mm x 8.3 mm x 1.44 mm Reel, Cut Tape
Ezurio 多协议模块 Module, Sterling-EWB, SIP, Cut Tape 124库存量
最低: 1
倍数: 1

Sterling-EWB 2.4 GHz 17.5 dBm SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 10 mm x 10 mm Bluetooth 5.1 802.11 b/g/n Cut Tape
Ezurio 多协议模块 BL5340 series - Multi-Core / Protocol Bluetooth + 802.15.4 + NFC Module (Nordic nRF52340) - Trace Pad (Cut Tape) 25库存量
250预期 2026/12/21
最低: 1
倍数: 1

BL5340 2.4 GHz 3 dBm ADC, GPIO, I2C, I2S, SPM, UART, USB 1.7 V 5.5 V - 40 C + 105 C External 15 mm x 10 mm x 2 mm Bluetooth LE NFC 802.15.4 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Ezurio 多协议模块 BL653 module (Nordic nRF52833) Trace pin (Cut Tape) 119库存量
最低: 1
倍数: 1

BL653 2.4 GHz 8 dBm ADC, GPIO, I2C, I2S, SPM, UART, USB 1.7 V 5.5 V - 40 C + 105 C External 6.3 mm x 5.6 mm x 1.6 mm Bluetooth LE NFC 802.15.4 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Ezurio 多协议模块 Bluetooth v4.2 Module with NFC (Integrated Antenna) 113库存量
400预期 2026/12/15
最低: 1
倍数: 1

BL65x 2.4 GHz 4 dBm GPIO, I2C, SPI, UART 1.8 V 3.6 V - 40 C + 85 C Chip 14 mm x 10 mm x 2.1 mm Bluetooth LE NFC Cut Tape
Espressif Systems 多协议模块 SMD module, ESP32-PICO-V3-02 with 8 MB flash and 2 MB PSRAM die inside, ESP32 ECO V3, PCB antenna
188库存量
12,350在途量
最低: 1
倍数: 1
: 650

2.4 GHz 19.5 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 13.2 mm x 16.6 mm x 2.4 mm Bluetooth 4.2 Reel, Cut Tape
Espressif Systems 多协议模块 SMD module, ESP32-S3R8 with 8 MB Octal PSRAM die inside, 8 MB Quad SPI flash, IPEX antenna connector 95库存量
7,800在途量
最低: 1
倍数: 1
: 650

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 65 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape
Microchip Technology 多协议模块 Wi-Fi + Bluetooth LE Module,u.FL Antenna 41库存量
最低: 1
倍数: 1
: 500

2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape

Silicon Labs 多协议模块 Mighty Gecko ARM Cortex-M4 512 kB flash, 64 kB RAM module 44库存量
最低: 1
倍数: 1
: 1,000

MGM13P 2.4 GHz I2C, UART, USART 1.8 V 3.8 V - 40 C + 85 C 12.9 mm x 17.8 mm x 2.3 mm Network Modules Reel, Cut Tape
Silicon Labs 多协议模块 Wireless gecko multi-protocol module, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified. 8库存量
最低: 1
倍数: 1

MGM210P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Bluetooth Modules Cut Tape
Silicon Labs 多协议模块 MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin 30库存量
最低: 1
倍数: 1

2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Bluetooth Modules Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 98库存量
200预期 2026/10/2
最低: 1
倍数: 1

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 35库存量
1,100在途量
最低: 1
倍数: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 287库存量
400预期 2026/9/17
最低: 1
倍数: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 100库存量
最低: 1
倍数: 1

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Cut Tape
Silicon Labs 多协议模块 SiWG917 SoC Module Wi-Fi 6 Bluetooth LE 5.4 2.4 GHz Integrated Antenna, 8MB Flash in IC package 13库存量
最低: 1
倍数: 1
SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Cut Tape
Renesas / Dialog 多协议模块 Wi-Fi/BLE Combo Module (Chipset antenna) 105库存量
500预期 2026/10/1
最低: 1
倍数: 1
: 500

DA16600 2.4 GHz 18 dBm I2C, I2S, PWM, SPI, SWD, JTAG, UART 1.8 V 3.3 V - 40 C + 85 C Chip 14.3 mm x 24.3 mm x 3 mm Bluetooth 5.1 802.11 b/g/n WiFi Modules Reel, Cut Tape
Microchip Technology 多协议模块 ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna T&R 60库存量
500预期 2026/12/24
最低: 1
倍数: 1
: 500

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape
Microchip Technology 多协议模块 ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna T&R 25库存量
最低: 1
倍数: 1
: 500

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape
Silicon Labs 多协议模块 SiWG917Y SoC Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 2MB PSRAM in package 50库存量
500预期 2026/10/9
最低: 1
倍数: 1
SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Cut Tape
Espressif Systems 多协议模块 SMD module, ESP32-C3FH4, PCB antenna, -40 C +105 C 3库存量
最低: 1
倍数: 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 2.7 V 3.6 V - 40 C + 105 C PCB 13.2 mm x 16.6 mm x 2.4 mm Bluetooth 802.11 b/g/n Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 + 2 2, 2.4/ 5 GHz dual-band, DBS, 2.4/ 5 GHz FEM, Bluetooth 5.2, 3 antennas, supports cellular module coexistence, -30 + 75 C 100库存量
最低: 1
倍数: 1
: 250

2.4 GHz, 5 GHz PCIe, PCM, UART 1.95 V 950 mV - 30 C + 75 C 25.5 mm x 22 mm x 2.25 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax 802.11 a/b/g/n/ac/ax, Bluetooth 5.2 Reel, Cut Tape