Cut Tape 多协议模块

结果: 435
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 资格 产品 封装
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 998库存量
最低: 1
倍数: 1
: 1,000

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Reel, Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
1,000预期 2026/9/25
最低: 1
倍数: 1
: 1,000

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Reel, Cut Tape
Silicon Labs 多协议模块 SiWN917Y NCP Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 4MB Flash in IC package?
200在途量
最低: 1
倍数: 1

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Cut Tape
Murata Electronics 多协议模块 Type 1SJ Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 6.2
999预期 2027/12/8
最低: 1
倍数: 1
: 1,000

1SJ 868 MHz, 915 MHz 21.5 dBm UART - 40 C + 85 C 10 mm x 8 mm x 1.6 mm LoRa/LoRaWAN LoRa/LoRaWAN Reel, Cut Tape
Silicon Labs 多协议模块 MGM220P wireless gecko
188预期 2026/9/18
最低: 1
倍数: 1

2.4 GHz 8 dBm Bluetooth, GPIO, I2C, UART 1.8 V 3.8 V - 40 C + 105 C Built-In 15 mm x 12.9 mm Bluetooth 5.2, Bluetooth Mesh Zigbee Bluetooth 5.4, Bluetooth Mesh, Zigbee Cut Tape
Silicon Labs 多协议模块 Multiprotocol module, 2,4 GHz w/PCB antenna, +10 dBm, 1.5MB Flash, 192kB RAM, Secure Vault Mid, Certified
99预期 2026/9/17
最低: 1
倍数: 1

MGM240L 2.4 GHz Cut Tape
NXP Semiconductors 多协议模块 IW611HN/A1C
25预期 2026/10/29
最低: 1
倍数: 1
: 2,000

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Bluetooth Modules Reel, Cut Tape
NXP Semiconductors 多协议模块 IW612HN/A1I
100预期 2026/10/29
最低: 1
倍数: 1
: 2,000

IW612HN 2.4 GHz, 5 GHz I2S Bluetooth 5.2 Bluetooth Modules Reel, Cut Tape
Murata Electronics 多协议模块 Type 2DL-921, Shielded Small Wi-Fi 11a/b/g/n/ac/ax + Bluetooth 5.3 Module
2,675在途量
最低: 1
倍数: 1
: 1,000

2DL 2.4 GHz, 5 GHz 18 dBm UART 1.71 V 3.46 V - 40 C + 85 C u.FL 8.8 mm x 7.7 mm x 1.3 mm Bluetooth 5.3 Bluetooth Modules Reel, Cut Tape, MouseReel
Murata Electronics 多协议模块 Type 1MW Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.0 Combo
2,000预期 2026/12/31
最低: 1
倍数: 1
: 1,000

MW 2.4 GHz, 5 GHz 17 dBm I2S, SDIO, UART 1.62 V 3.63 V - 30 C + 85 C External 7.9 mm x 7.3 mm x 1.1 mm Bluetooth 5.0 802.11 a/b/g/n/ac Reel, Cut Tape, MouseReel
Quectel 多协议模块 Cat 4 + 3G + 2G, 4Gbit ROM+2Gbit RAM, Support B5, EMEA, South Korea, Thailand, India
250在途量
最低: 1
倍数: 1
: 250

700 MHz to 960 MHz 33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.8 V 3.8 V - 35 C + 75 C External 32 mm x 29 mm x 2.4 mm LTE Cat 4 GNSS GNSS, LTE Cat 4 Reel, Cut Tape
Quectel 多协议模块 Cat 4 + 3G + 2G module, mPCIe form factor, EMEA, South Korea, Thailand, India
375在途量
最低: 1
倍数: 1
: 100

698 MHz to 960 MHz, 1.561 GHz, 1.575 GHz, 1.7 GHz to 2.7 GHz, 2.4 GHz to 2.5 GHz I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C External 30 mm x 51 mm x 4.9 mm LTE Cat 4 GNSS GNSS, LTE Cat 4 Reel, Cut Tape
Quectel 多协议模块 Cat 1 + 3G + 2G, 1Gbit ROM+1Gbit RAM, Global
250在途量
最低: 1
倍数: 1
: 250

33 dBm ADC, I2C, PCM, SD Card, SGMII, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 GNSS GNSS, LTE Cat 1 Reel, Cut Tape
Quectel 多协议模块 Cat 4 + 3G + 2G, 1Gbit ROM+1Gbit RAM, EMEA only
743在途量
最低: 1
倍数: 1
: 250

ADC, I2C, PCM, SPI, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C 29 mm x 25 mm x 2.3 mm LTE Cat 4 GNSS GNSS, LTE Cat 4 Reel, Cut Tape
Silex Technology 多协议模块 Wi-Fi+BLE Mod 2 ufl connect SamPck
173在途量
最低: 1
倍数: 1

SX-SDMAC 2.4 GHz, 5 GHz Bluetooth 5.0 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 5.0 Cut Tape
Murata Electronics 多协议模块 Type 1LV Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.0
1,000预期 2027/6/9
最低: 1
倍数: 1
: 1,000

1LV 2.4 GHz, 5 GHz 17 dBm SDIO, UART 1.62 V 1.98 V - 20 C + 70 C External 10 mm x 7.2 mm x 1.4 mm Bluetooth 5.0 802.11 a/b/g/n Reel, Cut Tape, MouseReel
Murata Electronics 多协议模块 RF TXRX MODULE 5.4/WIFI 6
1,000预期 2027/1/13
最低: 1
倍数: 1
: 1,000

17 dBm SPI 1.71 V 3.46 V - 40 C + 85 C 8.8 mm x 7.7 mm x 1.3 mm 802.11 a/b/g/n/ac/ax Multiprotocol Modules Reel, Cut Tape
Quectel 多协议模块 CAT 4
250在途量
最低: 1
倍数: 1
: 250

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.8 V 3.8 V - 35 C + 75 C 32 mm x 29 mm x 2.4 mm LTE Cat 4 GNSS GNSS, LTE Cat 4 Reel, Cut Tape
Quectel 多协议模块 Global LTE Cat 1bis w/ GNSS
228预期 2026/10/15
最低: 1
倍数: 1
: 250

ADC, I2C, PCM, SPI, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C 26.5 mm x 22.5 mm x 2.4 mm LTE Cat 1 GNSS GNSS, LTE Cat 1 Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 + 2 2, 2.4/ 5 GHz dual-band, Bluetooth 5.2, DBS
100在途量
最低: 1
倍数: 1
: 500

2.4 GHz, 5 GHz 7 dBm, 17 dBm PCIe, PCM, UART 950 mV 1.95 V 19.9 mm x 18 mm x 2.1 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax IEEE 802.11 a/b/g/n/ac/ax, Bluetooth 5.2 Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 6E, 802.11a/ b/ g/ n/ ac/ ax, 2 2 + 2 2, 2.4/ 5/ 6 GHz triple-band, Bluetooth 5.2, DBS
100预期 2027/8/16
最低: 1
倍数: 1
: 500

2.4 GHz, 5 GHz, 6 GHz PCIe, PCM, UART 1 V 1 V - 30 C + 75 C 19.9 mm x 18 mm x 2.1 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax IEEE 802.11 a/b/g/n/ac/ax, Bluetooth 5.2 Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: LCC(ANT_WIFI/BT), 2MB flash
100预期 2027/7/21
最低: 1
倍数: 1
: 500

2.4 GHz 6 dBm, 13 dBm, 14 dBm, 15 dBm, 16 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 20 mm x 18 mm x 2.6 mm Bluetooth 5.2 Wi-Fi 4 Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 6 (2.4GHz/5GHz), ?IEEE 802.11a/b/g/n/ac/ax, BLE 5.4, Thread 802.15.4, Antenna 1 1 (1T1R), 2 antennas, Wi-Fi application: SDIO 3.0, -40C +85C
90预期 2026/9/11
最低: 1
倍数: 1
: 500
2.4 GHz, 5 GHz SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 23 mm x 14 mm x 2.2 mm BLE 5.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Murata Electronics 多协议模块 Type 2BZ Shielded Small Wi-Fi 11a/b/g/n/ac/ax 2x2 MIMO Bluetooth 5.2 Mod 154工厂有库存
最低: 1
倍数: 1
: 1,000

2BZ 2.4 GHz, 5 GHz SDIO Interface, HCI 3 V 4.8 V - 40 C + 85 C u.FL 11.4 mm x 8.9 mm x 1.4 mm Bluetooth 5.2 Reel, Cut Tape, MouseReel
Murata Electronics 多协议模块 Type 2DS Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 406工厂有库存
最低: 1
倍数: 1
: 500

2DS 2.4 GHz USB 3 V 3.6 V - 40 C + 85 C 25 mm x 14 mm x 2.4 mm WiFi Modules Reel, Cut Tape