Reel 多协议模块

结果: 756
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 资格 产品 封装
Murata Electronics 多协议模块

2.412 GHz to 2.484 GHz 5 dBm I2C, SPI, GPIO, UART 2 V 4.3 V - 30 C + 85 C 17.5 mm x 17 mm x 2.15 mm Bluetooth WiFi Multiprotocol Module Reel
Telit Cinterion 多协议模块 WE310G4-I (Wi-Fi a/b/g/n+BLE) 47.00.003
5 GHz 8 dBm, 18 dBm, 19 dBm I2C, SPI, UART - 40 C + 85 C 14.3 mm x 13.1 mm x 2.6 mm Bluetooth 5.0 802.11 a/b/g/n Bluetooth Modukes Reel, Cut Tape
Telit Cinterion 多协议模块 WE310G4-P (Wi-Fi a/b/g/n+BLE) 47.00.003
5 GHz 8 dBm, 18 dBm, 19 dBm I2C, SPI, UART - 40 C + 85 C 18 mm x 15 mm x 2.6 mm Bluetooth 5.0 802.11 a/b/g/n Bluetooth Modukes Reel, Cut Tape
Telit Cinterion 多协议模块 WE866C6-P Wi-Fi 11ac + BT/BLE-5 MODULE
2.4 GHz, 5 GHz UART - 40 C + 85 C 15 mm x 13 mm x 2.2 mm Bluetooth LTE 802.11 a/b/g/n/ac Bluetooth Modules Reel
Nordic Semiconductor 多协议模块 Ultra Low Power Cellular IoT SIP, LTE-M,NB-IoT, GNSS WL modem

Reel
Fanstel 多协议模块 nRF5340 BLE 5.4 and nRF7002 WiFi 6 combo modules, 2 chip antennas

2.4 GHz, 5 GHz 3 dBm, 19 dBm GPIO, I2C, QSPI, SPI, SWD, UART, USB 2.0 3.3 V 3.3 V - 40 C + 85 C Chip 24.5 mm x 15.5 mm BLE 802.11 a/b/g/n/ac/ax 802.15.4 802.11 a/b/g/n/ac/ax, 802.15.4, BLE Reel
Texas Instruments 多协议模块 SimpleLink Wi-Fi 6 c ompanion module
CC3300MOD 2.412 GHz to 2.472 GHz 18.4 dBm SPI, UART 1.62 V, 2.97 V 1.98 V, 3.63 V - 40 C + 85 C 11 mm x 11 mm Bluetooth Wi-Fi 6, 802.11ax Reel, Cut Tape, MouseReel
Texas Instruments 多协议模块 SimpleLink dual-band (2.4GHz and 5GHz) W
CC3351MOD 2.41 GHz to 2.47 GHz 18.3 dBm SPI - 40 C + 85 C 10.9 mm x 10.9 mm x 2.1 mm Bluetooth WiFi Multiprotocol Module Reel, Cut Tape, MouseReel
Silicon Labs 多协议模块 SiWG917Y SoC Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 2MB PSRAM in package

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Reel, Cut Tape
Inventek ISM4343-WBU-L151
Inventek 多协议模块

Reel
Inventek ISM43439-WB-L151
Inventek 多协议模块

Reel
Inventek ISM43439-WBP-L151
Inventek 多协议模块

2.4 GHz 17 dBm I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C BLE, Bluetooth 5.2 802.11 b/g/n 802.11 b/g/n, BLE, Bluetooth 5.2 Reel
u-blox JODY-W263-01B
u-blox 多协议模块 88W8987, 802.11ac+BT, 2 ant pins, -40 to +85C, LTE filter

Reel
u-blox JODY-W683-00B
u-blox 多协议模块 AW693, 802.11ax 2x2+BT/LE 5.3, 3 antenna pins

Reel
Silicon Labs RS916NS00AC0A3R
Silicon Labs 多协议模块

Reel
Silicon Labs RS916NS00AC1A3R
Silicon Labs 多协议模块

Reel
Silicon Labs RS916WS00AC0A3R
Silicon Labs 多协议模块

Reel
Silicon Labs RS916WS00AC1A3R
Silicon Labs 多协议模块

Reel
NXP Semiconductors AW693PUK/A1ZDAZ
NXP Semiconductors 多协议模块 AW693PUK/A1ZDA

Reel
Silex Technology 多协议模块 Based on NXP's RW610, IM-100 is a small, stand-alone, dual-band Wi-Fi 6

260 MHz I2C, SPI, UART - 40 C + 85 C MHF 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Multiprotocol Modules Reel
Silex Technology 多协议模块 the option to attach an antenna via a trace. does not include the u.Fl connector

260 MHz I2C, SPI, UART - 40 C + 85 C 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Multiprotocol Modules Reel
Silex Technology 多协议模块 [Bulk SKU] SX-PCEBE-SMT is a Wi-Fi7 2x2 Tri-band IEEE802.11 be WLAN, Bluetooth 5.3 BR/EDR/HS/LE module in an M.2 LGA Type 1620 Surface Mount form factor. It is based on Qualcomm's QCC2076 chipset.

SX-PCEBE 2.4 GHz, 5 GHz, 6 GHz USB - 40 C + 85 C MHF4 Bluetooth WiFi Multiprotocol Module Reel
Quectel 多协议模块 Wi-Fi /BT variant.2+16GB - Consumer temperature range. Do Not promote
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 10 C + 75 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 4.2 Reel
Quectel 多协议模块 CPU: 2 + 6 Kyro CPU, GPU: Adreno 613, Wi-Fi: 2 2 11ax DBS; Bluetooth 5.2, Modem: 5G Sub 6/ LTE Cat 16, GNSS: L1
Reel
Quectel 多协议模块 cloud enabled, Cat 1 + 2G, Cat1, 8M, w/ GNSS, w/ BT4.2, EMEA/ Australia/ New Zealand
Reel