Reel 多协议模块

结果: 756
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 资格 产品 封装
Quectel 多协议模块 Wi-Fi 6 and Bluetooth 5.4, Max data rate 600.5Mbps, LCC form factor, -20C to +80C

FCS960K 2.4 GHz, 5 GHz 4 dBm, 18 dBm UART 3 V 3.6 V - 20 C + 80 C 12 mm x 12 mm x 2 mm Bluetooth Wi-Fi, IEEE 802.11 a/b/g/n/ac/ax Multiprotocol Module Reel
Quectel 多协议模块 Wi-Fi 6 and Bluetooth 5.4, Max data rate 600.5Mbps, LCC form factor, -40C to +85C

FCS960K 2.4 GHz, 5 GHz 4 dBm, 18 dBm UART, USB 3 V 3.6 V - 40 C + 85 C 12 mm x 12 mm x 2 mm Bluetooth Wi-Fi, IEEE 802.11 a/b/g/n/ac/ax Multiprotocol Module Reel
Quectel 多协议模块 Wi-Fi 6 and Bluetooth 5.4, Max data rate 286.8Mbps, LCC form factor, -20C to +80C

FCS960K 2.4 GHz, 5 GHz 4.5 dBm, 19 dBm UART 3 V 3.6 V - 20 C + 80 C 12 mm x 12 mm x 2 mm Bluetooth Wi-Fi, IEEE 802.11 a/b/g/n/ac/ax Multiprotocol Module Reel
Quectel 多协议模块 Wi-Fi 6 and Bluetooth 5.4, Max data rate 286.8Mbps, LCC form factor, -20C to +80C

FCS960K 2.4 GHz, 5 GHz 4 dBm, 18 dBm UART, USB 3 V 3.6 V - 20 C + 80 C 12 mm x 12 mm x 1.9 mm Bluetooth Wi-Fi, IEEE 802.11 a/b/g/n/ac/ax Multiprotocol Module Reel
Quectel 多协议模块 Wi-Fi 7, triple-band support, BLE 5.3, module w/ filter
2.4 GHz, 5 GHz, 6 GHz PCIe, PCM, UART 3 V 3.6 V - 20 C + 70 C 20 mm x 16 mm x 1.8 mm BLE 5.3 802.11 a/b/g/n/ac/ax/be 802.11 a/b/g/n/ac/ax/be, BLE 5.3 Reel
Quectel 多协议模块 Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: Pin, extended temp -40-105C, 2MB flash
2.4 GHz - 40 C + 105 C Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: IPEX-1, extended temp -40-105C, 2MB flash
2.4 GHz - 40 C + 105 C BLE 5.2 Reel, Cut Tape
Quectel 多协议模块 5G Sub-6
ADC, I2C, PCIe, SPI, UART, USB 2.0, USB 3.0 3.3 V 4.3 V - 30 C + 70 C 44 mm x 41 mm x 2.75 mm 5G BDS, Galileo, GLONASS, GPS 5G, BDS, Galileo, GLONASS, GPS Reel
Quectel 多协议模块 SC200E with discrete memory
Reel
Quectel 多协议模块 SC200E with discrete memory(EAU >2000pcs)
Reel
Quectel 多协议模块 SC200E with eMCP memory. Recommended to use discrete memory option for better pricing(EAU >2000pcs)
2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, SPI, UART, USB 2.0, USB 3.1, Video 3.55 V 4.4 V - 35 C + 75 C 40.5 mm x 40.5 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 LTE Cat 4 BDS, Galileo, GLONASS, GPS, QZSS, SBAS 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, BDS, Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0, Galileo, GLONASS, GPS, LTE Cat 4, QZSS, SBAS Reel
Quectel 多协议模块 Global version, 4+64GB eMCP memory from Samsung (EAU >2000pcs)
Reel
Quectel 多协议模块 SC200E with discrete memory
Reel
Quectel 多协议模块 SC200E with discrete memory
Reel
Quectel 多协议模块 SC200E with eMCP memory. Recommended to use discrete memory option for better pricing(EAU >2000pcs)
2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, SPI, UART, USB 2.0, USB 3.1, Video 3.55 V 4.4 V - 35 C + 75 C 40.5 mm x 40.5 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 LTE Cat 4 BDS, Galileo, GLONASS, GPS, QZSS, SBAS 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, BDS, Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0, Galileo, GLONASS, GPS, LTE Cat 4, QZSS, SBAS Reel
Quectel 多协议模块 SC200E with discrete memory
Reel
Quectel 多协议模块 SC200E with discrete memory(EAU >2000pcs)
Reel
Quectel 多协议模块 SC200E with eMCP memory(EAU >2000pcs)
2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, SPI, UART, USB 2.0, USB 3.1, Video 3.55 V 4.4 V - 35 C + 75 C 40.5 mm x 40.5 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 Reel
Quectel 多协议模块 Cat 1bis + 2G, 8M, w/ GNSS, w/ BT4.2, Latin America
Reel
Quectel 多协议模块 Cat 1bis + 2G, 8M, w/ GNSS, w/ BT4.2, EMEA/ Australia/ New Zealand
Reel, Cut Tape
Quectel 多协议模块 Longevity till 2030, Linux version (EAU >2000pcs)
2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, MIPI-DSI, PWM, SDIO, UART, USB 2.0, USB 3.1 3.55 V 4.4 V - 35 C + 75 C 40.5 mm x 40.5 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 LTE Cat 4 Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0, LTE Cat 4 Reel
Quectel 多协议模块 cloud enabled, Cat 1 + 3G + 2G, MQTT, 1Gbit ROM+1Gbit RAM, Global
33 dBm ADC, I2C, PCM, SGMII, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C 32 mm x 29 mm x 2.4 mm LTE Cat 1 BDS, Galileo, GPS, GLONASS, QZSS BDS, Galileo, GPS, GLONASS, QZSS, LTE Cat 1 Reel
Quectel 多协议模块 No connectivity. 2+32GB variant. Consumer temperature range(EAU >2000pcs)
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.3 V 3.5 V - 10 C + 75 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 4.2 Reel
Quectel 多协议模块 No connectivity. 4+32GB variant. Consumer temperature range(EAU >2000pcs)
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.3 V 3.5 V - 10 C + 75 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 4.2 Reel
Quectel 多协议模块 No connectivity. 1+8GB - Industrial temperature range(EAU >2000pcs)
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.3 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 4.2 Reel