CA 多协议模块

结果: 1,630
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 资格 产品 封装
Telit Cinterion 多协议模块
784在途量
¥217.9544
¥196.4505
¥186.5291
¥172.8787
最低: 1
倍数: 1
1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm Cellular, NBIoT, LTE GPS Multiprotocol Module Tray
Digi 多协议模块 Digi XBee 3 Low-Power LTE-M/NB-IoT, GNSS, Telit ME310G1-W1, No SIM
2,657在途量
¥676.2824
最低: 1
倍数: 1
XBee 3 I2C, SPI, UART 3.3 V 4.3 V - 40 C + 85 C u.FL 24.38 mm x 32.94 mm
Embedded Artists 多协议模块 1YN M.2 Wi-Fi 4 b/g/n, Bluetooth 5.2 with CYW43439 chipset and LBEE5KL1YN
700预期 2026/11/19
¥414.9812
¥372.0525
¥364.2781
¥364.199
最低: 1
倍数: 1
2.4 GHz 4-Wire UART, SDIO 3 V 3.5 V - 30 C + 85 C u.FL 22 mm x 44 mm Bluetooth 5.2 802.11 a/b/g/n WiFi Modules Bulk
Embedded Artists 多协议模块 2EL M.2 Wi-Fi 6 a/b/g/n/ac/ax, Bluetooth 5.3 with IW612 chipset and LBES5PL2EL
320预期 2026/11/5
¥415.5688
最低: 1
倍数: 1
2.4 GHz to 2.484 GHz 2.6 dBm SPI - 40 C + 85 C 802.11 a/b/g/n/ac/ax Bulk
Nordic Semiconductor 多协议模块 Low Power Cellular IoT SIP, LTE-M, NB-IoT, GNSS wireless modem
2,500预期 2026/10/26
剪切带
¥276.6014
¥254.3517
¥230.9381
¥214.8921
卷轴
¥195.5352
最低: 1
倍数: 1
: 2,500
700 MHz to 2.2 GHz 23 dBm I2C, I2S, SPI, UART 3 V 5.5 V - 40 C + 85 C 16 mm x 10.5 mm x 1.04 mm DECT NR+, LTE Cat-M1/NB1/NB2 GPS, QZSS DECT NR+, GPS, LTE CatM1/NB1/NB2, QZSS Reel, Cut Tape
Intel BE200.NGWG.NV
Intel 多协议模块 Intel Wi-Fi 7 BE200, 2230, 2x2 BE+BT, No vPro
5,937预期 2026/11/4
¥211.3439
¥189.7496
¥175.1952
¥162.5392
¥153.4427
最低: 1
倍数: 1
BE200 WiFi Modules
Telit Cinterion 多协议模块
2,352在途量
¥262.5442
¥236.8932
¥217.8753
¥202.0779
¥190.9135
最低: 1
倍数: 1
1.4 MHz 23 dBm I2C, SPI, UART 2.6 V 4.5 V - 40 C + 85 C 18 mm x 15 mm x 2.6 mm Cellular, NBIoT, LTE GPS Multiprotocol Module Tray
Fanstel 多协议模块 Opensource remote USB dongle with BT840XE,ANT000, and an USB cable for remote mounting to avoid obstruction.
85预期 2026/10/13
剪切带
¥435.0048
¥389.0138
¥365.0239
卷轴
¥365.0239
¥340.7854
最低: 1
倍数: 1
: 32
Reel, Cut Tape
Espressif Systems 多协议模块 ESP32-S31-WROOM-3 modules are powerful, generic Wi-Fi, Bluetooth 5.4 (LE), Bluetooth Classic and IEEE 802.15.4 MCUs that have a rich set of peripherals. They are an ideal choice for a wide variety of application scenarios related to Internet of Thi
1,991预期 2026/11/16
¥60.3872
¥52.3642
¥49.5505
¥45.5729
最低: 1
倍数: 1
GPIO, SPI, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.4 IEEE 802.11ax
Seeed Studio 多协议模块 Seeed Studio XIAO ESP32-C5
380在途量
¥57.0763
最低: 1
倍数: 1
Development Boards
CEL 多协议模块 WiFi bgn BT5 BT Mesh PCB Antenna BULK 20库存量
¥202.4056
¥176.5964
最低: 1
倍数: 1
CMP4010 2.4 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3.3 V 3.3 V PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Mesh 802.11 b/g/n Bulk
CEL 多协议模块 WiFi bgn BT5 BT Mesh RF Connector BULK 20库存量
¥211.6716
¥184.6194
最低: 1
倍数: 1
CMP4010 2.4 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3.3 V 3.3 V PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Mesh 802.11 b/g/n Bulk
CEL 多协议模块 RTL8721, Dual Band, WiFi+BLE, MFH4, BULK 5库存量
¥255.5947
最低: 1
倍数: 1
CMP4020 2.4 GHz, 5 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.1 Bulk
CEL 多协议模块 CMP4020-2 BULK 20库存量
¥268.4089
¥211.8411
最低: 1
倍数: 1
CMP4020 2.4 GHz, 5 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.1 Bulk
CEL 多协议模块 ZB/Thread/BT, +20dBm, 1.64Mb, Antenna BULK 3库存量
¥257.1654
最低: 1
倍数: 1
2.4 GHz 20 dBm ADC, GPIO, I2C, QSPI, SPI, UART, USB 3.3 V 3.3 V - 40 C + 85 C PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Thread, Zigbee Bulk
CEL 多协议模块 Wi-Fi 6 BT/BLE5.2 SDIO I-Temp PCB Antenna 39库存量
¥413.6591
¥363.7809
¥362.956
最低: 1
倍数: 1
CMP961X 2.4 GHz, 5 GHz SPI, UART Bluetooth Bulk
Silicon Labs 多协议模块 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules
1,387预期 2026/12/25
¥202.2361
¥176.3478
¥167.3304
¥155.0134
最低: 1
倍数: 1
2.4 GHz, 5 GHz 18 dBm SDIO, UART, USB 1.85 V 3.3 V - 40 C + 85 C External 9.8 mm x 9.1 mm x 1.6 mm Bluetooth 5.0 802.11 a/b/g/n WiFi Modules Tray
Silicon Labs 多协议模块 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules
836预期 2027/1/1
¥212.4965
¥185.2861
¥175.7715
¥162.8669
最低: 1
倍数: 1
2.4 GHz, 5 GHz 18 dBm SDIO, UART, USB 3 V 3.63 V - 40 C + 85 C External 9.1 mm x 9.8 mm x 1.6 mm Bluetooth 5.0 WiFi Modules Tray
u-blox 多协议模块 M.2 card with JODY-W377, single package
49在途量
¥405.3084
最低: 1
倍数: 1
JODY-W3 2.4 GHz, 5 GHz 16 dBm, 19 dBm GPIO, UART 3.135 V 3.465 V - 40 C + 85 C 30 mm x 22 mm x 3.21 mm 802.11 a/b/g/n Multiradio Modules Tray
Ezurio 多协议模块 Sterling LWB+, MHF4, Tape and Reel
900预期 2026/10/20
剪切带
¥70.2295
卷轴
¥70.2295
最低: 1
倍数: 1
: 800
Sterling-LWB+ 2.4 GHz SDIO, UART 3.3 V 3.3 V - 40 C + 85 C 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Reel, Cut Tape
Ezurio 多协议模块 Module, BL54L15, Bluetooth LE, Trace Pin, Cut Tape
750预期 2027/7/28
¥39.1206
¥37.968
最低: 1
倍数: 1
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C Chip Antenna 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Multiprotocol Modules Cut Tape
Ezurio 多协议模块 60 Series, Sterling Module w/u.FL, USB/UART
200预期 2027/3/1
¥377.6234
最低: 1
倍数: 1
60-2230C 2.4 GHz, 5 GHz 18 dBm UART, USB 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Adapters Tray

Espressif Systems 多协议模块 Highly-integrated, Small-sized Wi-fi + Bluetooth + Bluetooth Le Mcu Modules
1,793预期 2026/11/2
剪切带
¥35.6515
¥30.849
¥28.9506
¥26.8827
¥25.4815
卷轴
¥21.5943
最低: 1
倍数: 1
: 650
2.4 GHz 19.5 dBm I2C, I2S, SDIO, SPI, PWM, UART 3 V 3.6 V - 40 C + 85 C PCB 13.2 mm x 19 mm x 2.4 mm BLE, Bluetooth 4.2 802.11 b/g/n Reel, Cut Tape
u-blox 多协议模块 RW612, 802.11ax+BLE+802.15.4, ant pin, open CPU, 16MB
495预期 2027/1/18
剪切带
¥133.8372
¥129.7014
¥129.5319
¥117.7912
卷轴
¥117.7912
最低: 1
倍数: 1
: 250
2.4 GHz, 5 GHz 11 dBm 3.15 V 3.45 V - 40 C + 85 C Antenna Pin Bluetooth LE/IEEE 802.15.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape, MouseReel
u-blox 多协议模块 M.2 card with JODY-W377, in tray, SDIO interface
139预期 2027/3/1
¥336.2428
最低: 1
倍数: 1
2.5 GHz, 5 GHz 16 dBm, 19 dBm I2S, UART 3.135 V 3.465 V - 40 C + 85 C u.FL 30 mm x 22 mm x 3.21 mm 802.11 a/b/g/n Multiradio Modules Tray