I-PEX 多协议模块

结果: 63
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描述 数据表 供货情况 单价（含13%增值税） 根据您的数量，按照单价筛选表格中的结果。
数量 RoHS ECAD模型 系列
频率
输出功率
接口类型
电源电压-最小
电源电压-最大
最小工作温度
最大工作温度
天线连接器类型
尺寸
协议 - 蓝牙、BLE - 802.15.1
协议 - 蜂窝、Nbiot、LTE
协议 - GPS、GLONASS
协议 - Sub GHz
协议 - WiFi - 802.11
协议 - ANT、Thread、Zigbee - 802.15.4
产品
封装
Quectel 多协议模块 Wi-Fi 6, dual band (2.4 GHz/5 GHz), 1 1 Antenna, 8MB Flash, Antenna: IPEX-1 无库存
卷轴
¥48.5561
¥46.9854
报价
最低： 250
倍数： 250
: 250
2.4 GHz, 5 GHz IPEX-1 Reel
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / external IPEX connection
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数据表
更多信息可用
RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi Module
DFRobot 多协议模块 WiFi Module for LattePanda / NVIDIA Jetson Nano
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2.4 GHz, 5 GHz NGFF IPEX 30 mm x 22 mm x 4.2 mm Bluetooth 4.2 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 4.2 Bulk

Seeed Studio 多协议模块 Wio-S3-N Wireless Module without IPEX, ESP32-S3R8, Dual-core Xtensa LX7 and SX1262 embedded, LoRaWAN, Wi-Fi & BLE, supports EU868 & US915
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数据表
868 MHz, 915 MHz 20.9 dBm I2C, SPI, USB, UART 3 V 3.6 V - 40 C + 85 C IPEX 21.8 mm x 16.5 mm x 3.6 mm BLE WiFi Wireless Modules
Seeed Studio 多协议模块 Realtek8720DN 2.4G/5G Dual Bands Wireless and BLE5.0 Combo Module
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数据表
2.4 GHz, 5 GHz 7 dBm I2C, PWM, SPI, UART 3.3 V 3.3 V - 20 C + 85 C IPEX, PCB 24 mm x 16 mm x 3 mm Bluetooth 5.0 LTE 802.11 a/b/g/n

Seeed Studio 多协议模块 Wio-S3 Wireless LoRa Module with IPEX, ESP32-S3R8, Dual-core Xtensa LX7 and SX1262 embedded, LoRaWAN, Wi-Fi & BLE, supports EU868 & US915
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数据表
868 MHz, 915 MHz 20.9 dBm I2C, SPI, USB, UART 3 V 3.6 V - 40 C + 85 C IPEX 21.6 mm x 16.5 mm x 3.3 mm BLE WiFi LoRa Modules
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: IPEX-4, 2MB flash
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2.4 GHz UART 3 V 3.6 V - 40 C + 85 C IPEX-4 20 mm x 18 mm x 2.6 mm BLE 5.2 802.11 b/g/n 802.11 b/g/n, BLE 5.2 Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: IPEX-1, extended temp -40-105C, 2MB flash
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2.4 GHz - 40 C + 105 C BLE 5.2 Reel, Cut Tape
ADLINK Technology EWK-M2-AX210-ET
ADLINK Technology 多协议模块 Wi-Fi 6E, Wave 2, 2x2, Bluetooth 5.2,non-Vpro. PCIe, USB, M.2 2230 Operating Temperature -40 85 MPN: AX210.NGWGII.NV
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数据表
M.2, PCIe 3.135 V 3.465 V - 40 C + 80 C IPEX MHF4, RP-SMA 30 mm x 22 mm x 2.4 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax 802.11 a/b/g/n/ac/ax, Bluetooth 5.3
ADLINK Technology EWK-M2-AC9260-ET
ADLINK Technology 多协议模块 INTEL AC9260 IND. WIFI w/ mPCIe converter
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数据表
2.4 GHz, 5 GHz M.2, PCIe 3.135 V 3.465 V - 40 C + 75 C IPEX MHF4, RP-SMA 30 mm x 22 mm x 2.4 mm Bluetooth 5.1 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 5.1
Quectel 多协议模块 Wi-Fi 6, single band 2.4GHz, BLE 5.1, Antenna: IPEX-1, -40 85C, 8MB flash
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数据表
2.4 GHz ADC, I2C, I2S, PWM, SPI, UART 3 V 3.6 V - 40 C + 85 C RF Coaxial Connector 25.5 mm x 18 mm x 3.2 mm 802.11b/g/n/ax Modules Reel
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: IPEX-1, -40 85C, 2MB flash
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数据表
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C IPEX-1 24 mm x 16 mm x 2.6 mm BLE 5.2 802.11 b/g/n 802.11 b/g/n, BLE 5.2 Reel
Quectel FCM362KAAMD-1X-04
Quectel 多协议模块 Wi-Fi 6, dual band (2.4 GHz/5 GHz), 1 1 Antenna: IPEX-1, 4MB Flash
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2.4 GHz, 5 GHz UART 3 V 3.6 V - 40 C + 85 C IPEX-1 25.5 mm x 18 mm x 3.15 mm BLE 5.2 802.11 a/b/g/n/ac/ax 802.11 a/b/g/n/ac/ax, BLE 5.2 Reel