CC30222 多协议模块

结果: 96
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数量 RoHS ECAD模型 系列
频率
输出功率
接口类型
电源电压-最小
电源电压-最大
最小工作温度
最大工作温度
天线连接器类型
尺寸
协议 - 蓝牙、BLE - 802.15.1
协议 - 蜂窝、Nbiot、LTE
协议 - GPS、GLONASS
协议 - Sub GHz
协议 - WiFi - 802.11
协议 - ANT、Thread、Zigbee - 802.15.4
产品
封装
Ezurio 多协议模块 Module, BL54L10, Bluetooth LE, MHF4, Tape and Reel
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数据表
BL54L10 2.402 GHz to 2.48 GHz 8 dBm I2S, SPI, UART 1.7 V 2.7 V - 40 C + 105 C MHF4 14 mm x 10 mm x 1.6 mm Bluetooth LE 802.15.4 Multiprotocol Modules Reel
Fanstel 多协议模块 nRF5340 BLE 5.4 and nRF7002 WiFi 6 combo modules, 2 chip antennas
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数据表
2.4 GHz, 5 GHz 3 dBm, 19 dBm GPIO, I2C, QSPI, SPI, SWD, UART, USB 2.0 3.3 V 3.3 V - 40 C + 85 C Chip 24.5 mm x 15.5 mm BLE 802.11 a/b/g/n/ac/ax 802.15.4 802.11 a/b/g/n/ac/ax, 802.15.4, BLE Reel
ADLINK Technology Wi-Fi/BT M.2 Card Wireless-AX210 Ind.
ADLINK Technology 多协议模块 Wi-Fi 6E, Wave 2, 2x2, Bluetooth 5.2,non-Vpro. PCIe, USB, M.2 2230 Operating Temperature -40 85 MPN: AX210.NGWGII.NV
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2.4 GHz, 5 GHz, 6 GHz PCIe, USB - 40 C + 85 C 30 mm x 22 mm x 2.4 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax 802.11 a/b/g/n/ac/ax, Bluetooth 5.3
Silex Technology 多协议模块 [Bulk SKU] SX-PCEBE-M2 is a Wi-Fi7 2x2 Tri-band IEEE802.11 be WLAN, Bluetooth 5.3 BR/EDR/HS/LE module in a M.2 card form factor (M.2 Card Type 2230-S3-A-E). It is based on Qualcomm's QCC2076 chipset.
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数据表
SX-PCEBE 2.4 GHz, 5 GHz, 6 GHz Bluetooth, USB, UART 3.3 V - 40 C + 85 C MHF4 Tray
CEL 多协议模块 HOSTED DB Wi-Fi 6 + BT5.4 for IoT Connectivity (Bulk)
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数据表
2.4 GHz, 5 GHz - 40 C + 85 C Bluetooth WiFi Multiprotocol Modules
Quectel 多协议模块
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2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 12 mm x 12 mm x 2.35 mm Bluetooth 4.2 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 4.2
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: IPEX-4, 2MB flash
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2.4 GHz UART 3 V 3.6 V - 40 C + 85 C IPEX-4 20 mm x 18 mm x 2.6 mm BLE 5.2 802.11 b/g/n 802.11 b/g/n, BLE 5.2 Reel, Cut Tape
Quectel 多协议模块
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2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 12 mm x 12 mm x 2.35 mm Bluetooth 4.2 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 4.2
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ax, 2 2 (2T2R), SDIO interface, 3 antennas (BT5.4 has a separate antenna), -20 C to +70 C support LE Audio and Auracast
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数据表
2.4 GHz, 5 GHz UART 3 V 3.6 V - 20 C + 70 C 15 mm x 13 mm x 2 mm Bluetooth 5.2 802.11a/b/g/n/ac/ax Modules Reel
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 (2T2R), 2.4/ 5 GHz dual-band, PCIe interface, 3 antennas (BT 5.2 via separate antenna), -20 C to +70 C
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数据表
2.4 GHz, 5 GHz PCIe 3.1 V 3.6 V - 20 C + 70 C 15 mm x 13 mm x 2.2 mm Bluetooth 5.2 802.11a/b/g/n/ac/ax Modules Reel
Quectel 多协议模块
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2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 15 mm x 13 mm x 2 mm BLE 5.2 802.11 a/b/g/n/ac/ax 802.11 a/b/g/n/ac/ax, BLE 5.2
Quectel 多协议模块
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2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 15 mm x 13 mm x 2 mm BLE 5.2 802.11 a/b/g/n/ac/ax 802.11 a/b/g/n/ac/ax, BLE 5.2
Quectel 多协议模块 Acceronics variant turn key
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数据表
Reel
Quectel 多协议模块 Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM + 8MB PSRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
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数据表
2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 25.5 mm x 18 mm x 3.16 mm Modules Reel
Quectel 多协议模块 Wi-Fi 5, 802.11a/ b/ g/ n/ ac, 2 2, DBDC, 2.4/ 5 GHz dual-band, Bluetooth 5.1 (CYW54591) - Replacement for FC80AABMD
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数据表
2.4 GHz, 5 GHz 1.7 V 4.5 V - 40 C + 85 C 15 mm x 13 mm x 2.2 mm Bluetooth 5.1 802.11a/b/g/n/ac Modules Reel
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ax, 2 2 (2T2R), SDIO interface, 2 antennas (BT5.4 shares 1 Wi-Fi antenna), -20 C to +70 C, support LE Audio and Auracast
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数据表
2.4 GHz, 5 GHz UART 3 V 3.6 V - 20 C + 70 C 15 mm x 13 mm x 2 mm Bluetooth 5.2 802.11a/b/g/n/ac/ax Modules Reel
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ax, 2 2 (2T2R), SDIO interface, 3 antennas (BT 5.2 has a separate antenna), -20 C to +70 C
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数据表
2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 15 mm x 13 mm x 2 mm BLE 5.2 802.11 a/b/g/n/ac/ax 802.11 a/b/g/n/ac/ax, BLE 5.2 Reel
Quectel 多协议模块 Wi-Fi 6 (2.4GHz/5GHz), IEEE 802.11a/b/g/n/ac/ax, BLE 5.4, Thread 802.15.4, Antenna 1 1 (1T1R), 2 antennas, Wi-Fi & Bluetooth application: USB 2.0, -40C +85C
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数据表
2.4 GHz, 5 GHz SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 23 mm x 14 mm x 2.2 mm BLE 5.4 802.11 a/b/g/n/ac/ax Reel
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 + 2 2, 2.4/ 5 GHz dual-band, DBS, 2.4/ 5 GHz FEM, Bluetooth 5.2, 3 antennas, cellular module coexistence not supported, -30 + 75 C
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数据表
2.4 GHz, 5 GHz PCle, UART - 30 C + 75 C 25.5 mm x 22 mm x 2.25 mm Bluetooth 5.2 802.11a/b/g/n/ac/ax Reel
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, extended temp -40 105C, 4MB flash
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数据表
2.4 GHz UART 3 V 3.6 V - 40 C + 105 C PCB 24 mm x 16 mm x 2.6 mm BLE 5.2 802.11 b/g/n 802.11 b/g/n, BLE 5.2 Reel
Quectel 多协议模块 Wi-Fi /BT variant. 8+64GB - Consumer temperature range Do Not promote
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数据表
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 10 C + 75 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 4.2 Reel