-ar 多协议模块

结果: 240
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描述 数据表 供货情况 单价（含13%增值税） 根据您的数量，按照单价筛选表格中的结果。
数量 RoHS ECAD模型 系列
频率
输出功率
接口类型
电源电压-最小
电源电压-最大
最小工作温度
最大工作温度
天线连接器类型
尺寸
协议 - 蓝牙、BLE - 802.15.1
协议 - 蜂窝、Nbiot、LTE
协议 - GPS、GLONASS
协议 - Sub GHz
协议 - WiFi - 802.11
协议 - ANT、Thread、Zigbee - 802.15.4
封装
Silicon Labs 多协议模块 Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 105 C, PCB trace antenna, certified.
数据表

2.4 GHz 12.5 dBm I2C, UART 1.8 V 3.8 V - 40 C + 105 C 22.5 mm x 15.5 mm x 2.25 mm Thread, Zigbee Reel
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, 2MB PSRAM, No Antenna, 32KHz XTAL Pins, MVP
数据表

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Ezurio 多协议模块 Module, Veda IF912, SIP, Dual Band, No Memory, RF Trace Pin, Tape and Reel
数据表
IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Reel
Telit Cinterion 多协议模块 SE250B4-NA 42.00.101
数据表
200 mW I2C, SPI, UART, USB 3.5 V 4.4 V - 30 C + 75 C 41 mm x 43mm Bluetooth Cellular 2G/3G/4G GPS, GLONASS, Galileo, BeiDou 802.11 a/b/g/n/ac Tray
Ezurio 多协议模块 Module, Veda IF912, SIP, Dual Band, 8M PSRAM, 8M Flash, RF Trace Pin, Tape and Reel
数据表
IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Reel
Fanstel 多协议模块 nRF5340 BLE 5.4 and nRF7002 WiFi 6 combo modules, 2 chip antennas
数据表

2.4 GHz, 5 GHz 3 dBm, 19 dBm GPIO, I2C, QSPI, SPI, SWD, UART, USB 2.0 3.3 V 3.3 V - 40 C + 85 C Chip 24.5 mm x 15.5 mm BLE 802.11 a/b/g/n/ac/ax 802.15.4 Reel
Silicon Labs 多协议模块 Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, PCB trace antenna, certified.
数据表

2.4 GHz 12.5 dBm I2C, UART 1.8 V 3.8 V - 40 C + 125 C 22.5 mm x 15.5 mm x 2.25 mm Bluetooth Thread, Zigbee Cut Tape
Telit Cinterion 多协议模块 SE250B4-EU 42.00.001
数据表
200 mW I2C, SPI, UART, USB 3.5 V 4.4 V - 30 C + 75 C 41 mm x 43mm Bluetooth Cellular 2G/3G/4G GPS, GLONASS, Galileo, BeiDou 802.11 a/b/g/n/ac Tray
Ezurio 多协议模块 Module, Veda IF913, SIP, Tri Band, 8M PSRAM, 8M Flash, RF Trace Pin, Tape and Reel
数据表
IF913 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Reel
Ezurio 多协议模块 Module, Veda IF913, SIP, Tri Band, No Memory, RF Trace Pin, Tape and Reel
数据表
IF913 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Reel
Renesas / Dialog 多协议模块 Wi-Fi/BLE combo module, Wi-Fi6 Dual Band 2.4/5GHz 802.11 a/b/g/n/ax, 8Mbyte Flash, RF antenna pin
数据表

RRQ61051 160 MHz GPIO, I2C, I2S, SPI, UART 1.8 V 3.6 V - 40 C + 85 C RF 20 mm x 15 mm x 3 mm Bluetooth 5.1 802.11 a/b/g/n/ax Reel
Silicon Labs 多协议模块 Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, PCB trace antenna, certified.
数据表

2.4 GHz 12.5 dBm I2C, UART 1.8 V 3.8 V - 40 C + 125 C 22.5 mm x 15.5 mm x 2.25 mm Thread, Zigbee Reel
Renesas / Dialog 多协议模块 Wi-Fi/BLE combo module, Wi-Fi6 Dual Band 2.4/5GHz 802.11 a/b/g/n/ax, 8Mbyte Flash, PCB trace antenna
数据表

RRQ61051 160 MHz GPIO, I2C, I2S, SPI, UART 1.8 V 3.6 V - 40 C + 85 C PCB Antenna 20 mm x 15 mm x 3 mm Bluetooth 5.1 802.11 a/b/g/n/ax Reel, Cut Tape
Renesas / Dialog 多协议模块 Wi-Fi/BLE combo module, Wi-Fi6 Dual Band 2.4/5GHz 802.11 a/b/g/n/ax, 8Mbyte Flash, u.FL connector
数据表

RRQ61051 160 MHz GPIO, I2C, I2S, SPI, UART 1.8 V 3.6 V - 40 C + 85 C u.FL 20 mm x 15 mm x 3 mm Bluetooth 5.1 802.11 a/b/g/n/ax Reel
Renesas / Dialog 多协议模块 Wi-Fi4/BLE combo - Single band 2.4GHz, 802.11 b/g/n, 8Mbyte Flash, PCB trace antenna
数据表

RRQ61051 160 MHz GPIO, I2C, I2S, SPI, UART 1.8 V 3.6 V - 40 C + 85 C PCB Antenna 20 mm x 15 mm x 3 mm Bluetooth 5.1 802.11 b/g/n Reel
Renesas / Dialog 多协议模块 Wi-Fi6/BLE combo - Single band 2.4GHz, 802.11 b/g/n/ax, 8Mbyte Flash, PCB trace antenna
数据表

RRQ61051 160 MHz GPIO, I2C, I2S, SPI, UART 1.8 V 3.6 V - 40 C + 85 C PCB Antenna 20 mm x 15 mm x 3 mm Bluetooth 5.1 802.11 a/b/g/n/ax Reel
Silicon Labs 多协议模块 Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 105 C, PCB trace antenna, certified.
数据表

2.4 GHz 12.5 dBm I2C, UART 1.8 V 3.8 V - 40 C + 105 C 22.5 mm x 15.5 mm x 2.25 mm Bluetooth Thread, Zigbee Cut Tape
Telink 多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
数据表

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 35.29 mm x 18 mm x 2.6 mm Reel
Silicon Labs 多协议模块 SiWG917Y SoC Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 2MB PSRAM in package
数据表

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Reel, Cut Tape
Silex Technology 多协议模块 the option to attach an antenna via a trace. does not include the u.Fl connector
数据表

260 MHz I2C, SPI, UART - 40 C + 85 C 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Reel
Silex Technology 多协议模块 the option to attach an antenna via a trace does not include the u.Fl connector
数据表

260 MHz I2C, SPI, UART - 40 C + 85 C 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Cut Tape
Silex Technology 多协议模块 Based on NXP's RW610, IM-100 is a small, stand-alone, dual-band Wi-Fi 6
数据表

260 MHz I2C, SPI, UART - 40 C + 85 C MHF 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Reel
Silex Technology 多协议模块 IM-100 is a small, stand-alone, dual-band Wi-Fi 6 and Bluetooth Low Energy
数据表

260 MHz I2C, SPI, UART - 40 C + 85 C MHF 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Cut Tape
Quectel 多协议模块
850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm ADC, GPIO, I2C, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C 18.7 mm x 16 mm x 2.1 mm EGPRS, LTE Cat-M1, LTE Cat NB2 GNSS
Quectel 多协议模块
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.3 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac