WiFi 多协议模块

结果: 52
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数量 RoHS ECAD模型 系列
频率
输出功率
接口类型
电源电压-最小
电源电压-最大
最小工作温度
最大工作温度
天线连接器类型
尺寸
协议 - 蓝牙、BLE - 802.15.1
协议 - 蜂窝、Nbiot、LTE
协议 - WiFi - 802.11
协议 - ANT、Thread、Zigbee - 802.15.4
封装
Embedded Artists 多协议模块 2LL M.2 Module
数据表
7库存量
23预期 2026/9/18
最低： 1
倍数： 1

UART 3.3 V 3.46 V - 40 C + 85 C U.FL Bluetooth WiFi Bulk
Espressif Systems 多协议模块 ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules. The rich set of peripherals and high performance make the module an ideal choice for
数据表
984库存量
3,250预期 2026/11/2
最低： 1
倍数： 1

2.4 GHz, 5 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm Bluetooth WiFi Thread, Zigbee
STMicroelectronics 多协议模块 NB-IoT module with extra ADC. Supported LTE FDD frequency bands: B1, B3, B5, B8, B20, B2
数据表
595库存量
2,400在途量
MouseReel 提供服务支持
最低： 1
倍数： 1
: 800

ST67W 2.412 GHz to 2.484 GHz 10 dBm SPI, UART 2.97 V 3.63 V - 40 C + 85 C RF Bluetooth WiFi Reel, Cut Tape, MouseReel
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, Integrated Antenna, 32KHz XTAL Pins, MVP
数据表
195库存量
最低： 1
倍数： 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, 2MB PSRAM, Integrated Antenna, 32KHz XTAL Pins, MVP
数据表
200库存量
最低： 1
倍数： 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 4MB Flash, Integrated Antenna, 32KHz XTAL Pins
数据表
150库存量
最低： 1
倍数： 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Murata Electronics 多协议模块 Type 2FP is NXP RW610 based Hostless dual band Wi-Fi 6 + BLE 5.4 Module
数据表
76库存量
最低： 1
倍数： 1
: 1,000
260 MHz 12 dBm 3.14 V 3.46 V - 40 C + 85 C 12 mm x 11 mm x 1.55 mm Bluetooth WiFi Reel, Cut Tape
DFRobot 多协议模块 M.2 E Key WiFi7 Bluetooth 5.4 Intel BE200 Wireless Network Card for LattePanda IOTA / Sigma 11库存量
14预期 2026/9/15
最低： 1
倍数： 1

Bluetooth WiFi Bulk
Telit Cinterion 多协议模块
540在途量
最低： 1
倍数： 1

I2C, SPI, UART 3.4 V 4.2 V - 40 C + 85 C 28.2 mm x 28.2 mm x 2.2 mm Bluetooth LTE WiFi Tray
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 4MB Flash, No Antenna, 32KHz XTAL Pins
数据表

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, No Antenna, 32KHz XTAL Pins, MVP
数据表

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, 2MB PSRAM, No Antenna, 32KHz XTAL Pins, MVP
数据表

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (NCP), Bluetooth LE, 672KB RAM, 4MB Flash, Integrated Antenna, 32KHz XTAL Pins
数据表

2.4 GHz SPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (NCP), Bluetooth LE, 672KB RAM, 4MB Flash, No Antenna, 32KHz XTAL Pins
数据表

2.4 GHz SPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (RCP), Bluetooth LE, 672KB RAM, 0MB Flash, Integrated Antenna, 32KHz XTAL Pins
数据表

2.4 GHz SDIO 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (RCP), Bluetooth LE, 672KB RAM, 0MB Flash, No Antenna, 32KHz XTAL Pins
数据表

2.4 GHz SDIO 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi
Silex Technology 多协议模块 [Sample Pack] SX-PCEBE-M2-SP is a Wi-Fi7 2x2 Tri-band IEEE802.11 be WLAN, Bluetooth 5.3 BR/EDR/HS/LE module in a M.2 card form factor (M.2 Card Type 2230-S3-A-E). It is based on Qualcomm's QCC2076 chipset. This is ideal for low quantity purchases fo
数据表

SX-PCEBE 2.4 GHz, 5 GHz, 6 GHz USB - 40 C + 85 C MHF4 Bluetooth WiFi Bulk
Kaga FEI 多协议模块 WLAN module for NXP IW611. WiFi 6 1x1 dual band, BT, BLE 5.4
数据表
更多信息可用

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Tray
Kaga FEI 多协议模块 WLAN + ARM M33 MCU module for NXP RW612. WiFi 6 1x1 dual band, BT, BLE 5.4.
数据表
更多信息可用

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Tray
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 15 x 12.4 / 21 GPIO / -40-105 degC / onboard PCB antenna
数据表
更多信息可用

RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 105 C 15 mm x 12.4 mm x 2.4 mm BLE WiFi
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / external IPEX connection
数据表
更多信息可用

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / onboard PCB antenna
数据表
更多信息可用

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
u-blox 多协议模块 M.2 Type 2230 Key E card with MAYA-W472 Wi-Fi 6 Dual-Band, Bluetooth 5.4, 802.15.4 module
更多信息可用

MAYA-W4 2.405 GHz to 2.48 GHz 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Tray
u-blox 多协议模块
数据表
更多信息可用

MAYA-W3 UART 1.71 V 3.6 V - 40 C + 85 C 14.3 mm x 10.4 mm Bluetooth WiFi Reel, Cut Tape
u-blox 多协议模块
数据表
更多信息可用

MAYA-W4 2.4 GHz, 5 GHz 18 dBm SPI, UART 3.13 V 3.46 V - 40 C + 85 C U.FL 14.3 mm x 10.4 mm x 1.9 mm Bluetooth WiFi Reel, Cut Tape