260 多协议模块

结果: 19
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 产品 封装
Murata Electronics 多协议模块 Type 2FR module
1,000预期 2027/7/26
剪切带
¥178.0089
¥155.1716
¥147.239
¥136.3119
卷轴
¥120.6049
最低: 1
倍数: 1
: 1,000
2FR 2.484 GHz 18 dBm SPI 3.14 V 3.46 V - 40 C + 85 C 12 mm x 11 mm x 1.5 mm Modules Reel, Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 177库存量
¥107.9489
¥94.3776
¥88.9197
¥82.2188
最低: 1
倍数: 1
MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C PCB Trace 12.9 mm x 15 mm Bluetooth, BLE Multiprotocol Wireless Module Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 128库存量
¥117.0454
¥98.5925
¥95.4511
¥87.9253
最低: 1
倍数: 1
MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C PCB Trace 12.9 mm x 15 mm Bluetooth, BLE Multiprotocol Wireless Module Cut Tape


Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 29库存量
¥108.5252
¥92.9764
¥92.0611
¥78.6593
最低: 1
倍数: 1
MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C PCB Trace 12.9 mm x 15 mm Bluetooth, BLE Multiprotocol Wireless Module Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 158库存量
¥108.4461
¥91.3153
¥80.3995
¥80.3204
最低: 1
倍数: 1
MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C PCB Trace 12.9 mm x 15 mm Bluetooth, BLE Multiprotocol Wireless Module Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 110库存量
100预期 2026/12/4
¥108.2766
¥94.0499
¥89.1683
¥82.3883
最低: 1
倍数: 1
MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C PCB Trace 12.9 mm x 15 mm Bluetooth, BLE Multiprotocol Wireless Module Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 23库存量
¥109.9264
¥96.1178
¥90.5695
¥83.7104
最低: 1
倍数: 1
MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C PCB Trace 12.9 mm x 15 mm Bluetooth, BLE Multiprotocol Wireless Module Cut Tape
u-blox 多协议模块 IW611, 802.11ax+BT, 2 U.FL connectors
1,500预期 2027/3/29
剪切带
¥106.7059
¥100.3327
¥100.005
卷轴
¥100.005
最低: 1
倍数: 1
: 500
MAYA-W2 18 dBm SPI - 40 C + 85 C u.FL 14.3 mm x 10.4 mm x 1.9 mm Multiprotocol Modules Reel, Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
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MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C PCB Trace 12.9 mm x 15 mm Bluetooth, BLE Multiprotocol Wireless Module Reel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
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MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C PCB Trace 12.9 mm x 15 mm Bluetooth, BLE Multiprotocol Wireless Module Reel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
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MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C PCB Trace 12.9 mm x 15 mm Bluetooth, BLE Multiprotocol Wireless Module Reel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
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MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C PCB Trace 12.9 mm x 15 mm Bluetooth, BLE Multiprotocol Wireless Module Reel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
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MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C PCB Trace 12.9 mm x 15 mm Bluetooth, BLE Multiprotocol Wireless Module Reel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
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MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C PCB Trace 12.9 mm x 15 mm Bluetooth, BLE Multiprotocol Wireless Module Reel
ADLINK Technology EWK-M2-AC9260-ET
ADLINK Technology 多协议模块 INTEL AC9260 IND. WIFI w/ mPCIe converter
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2.4 GHz, 5 GHz M.2, PCIe 3.135 V 3.465 V - 40 C + 75 C IPEX MHF4, RP-SMA 30 mm x 22 mm x 2.4 mm Bluetooth 5.1 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 5.1
ADLINK Technology EWK-M2-AC9260 w/ mPCIe converter
ADLINK Technology 多协议模块 INTEL AC9260 Non-VPRO WIFI/BT KIT2x2 WiFi 802.11a/b/g/n/acBluetooth5.0M.2 2230 with PCIe/USB I/FOperating Temperature: 0-70C Driver for WIN10, Linux2pcs x IPEX MHF4 cables2pcs x Antenna
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2.4 GHz, 5 GHz M.2, PCIe 3.135 V 3.465 V 0 C + 70 C IPEX MHF4, RP-SMA 30 mm x 22 mm x 2.4 mm Bluetooth 5.1 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 5.1
ADLINK Technology EWK-M2-AC9260-ET W MPCIE CONVERTER
ADLINK Technology 多协议模块 INTEL AC9260 IND. WIFI w/ mPCIe converter
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2.4 GHz, 5 GHz M.2, PCIe 3.135 V 3.465 V - 40 C + 75 C 30 mm x 22 mm x 2.4 mm Bluetooth 5.1 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 5.1
ADLINK Technology INTEL AC9260 Non-VPRO WIFI/BT KIT
ADLINK Technology 多协议模块 INTEL AC9260 Non-VPRO WIFI/BT KIT2x2 WiFi 802.11a/b/g/n/acBluetooth5.0M.2 2230 with PCIe/USB I/FOperating Temperature: 0-80C Driver for WIN10, Linux2pcs x IPEX MHF4 cables2pcs x Antenna
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2.4 GHz, 5 GHz PCIe, USB 0 C + 80 C 30 mm x 22 mm x 2.4 mm Bluetooth 5.1 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 5.1
ADLINK Technology WIFI BT M.2 WIRELESS-AC 9260 INDUS
ADLINK Technology 多协议模块 802.11a/b/g/n/ac, Wave 2, 2x2, Bluetooth 5, PCIe, USB, M.2 2230Operating Temperature -40-85Intel,9260.NGWGII.NV
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2.4 GHz, 5 GHz M.2, PCIe, USB - 40 C + 85 C 30 mm x 22 mm x 2.4 mm Bluetooth 5.1 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 5.1