LIS3L02AS4 多协议模块

结果: 4
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - Sub GHz 协议 - ANT、Thread、Zigbee - 802.15.4 产品 封装
Telink 多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this 3库存量
剪切带
¥124.074
¥109.9264
¥102.4006
¥94.7053
最低: 1
倍数: 1
ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 26 mm x 11.3 mm x 2.6 mm Wireless Modules Reel
iVativ 多协议模块 Bluetooth LE, Bluetooth 5.4, Zigbee,Thread, NFC, MHF4 antenna 180库存量
¥78.6593
¥74.1958
¥70.2295
¥68.0712
最低: 1
倍数: 1
NILE 13.56 MHz, 2.402 GHz to 2.48 GHz 8 dBm I2C, I2S, PDM, PWM, SPI, UART, USB 2.0 1.8 V 3.3 V - 40 C + 85 C MHF4 15 mm x 10 mm x 1.6 mm Bluetooth 5.4, Bluetooth Mesh NFC-A 802.15.4, Thread 802.15.4, Bluetooth 5.4, Bluetooth Mesh, NFC-A, Thread Bulk
Telink 多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this N/A
剪切带
¥55.3361
¥50.7031
¥46.1605
¥41.5275
最低: 1
倍数: 1
ML3 2.4 GHz to 2.483 GHz 8.4 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 125 C 26 mm x 11.3 mm x 2.6 mm Zigbee Wireless Modules Reel
Telink 多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Mouser 目前在您所在地区不销售该产品。
ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 35.29 mm x 18 mm x 2.6 mm Wireless Modules Reel