ARM Cortex-M33 核心 RF片上系统 - SoC

结果: 23
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数量 RoHS ECAD模型 类型
核心
工作频率
最大数据速率
输出功率
灵敏度
电源电压-最小
电源电压-最大
接收供电电流
传输供电电流
程序存储器大小
最小工作温度
最大工作温度
封装 / 箱体
封装
Nordic Semiconductor RF片上系统 - SoC Ultra-low power SOC + advanced security features, a range of peripherals & multiprotocol 2.4 GHz transceiver
11,990预期 2027/2/5
最低： 1
倍数： 1
: 6,000

ARM Cortex-M33 2.4 GHz 4 MB/s 8 dBm -104 dBm 1.7 V 3.5 V 2 MB - 40 C + 85 C FCCSP Reel, Cut Tape
Nordic Semiconductor RF片上系统 - SoC Ultra-low power SOC + advanced security features, a range of peripherals & multiprotocol 2.4 GHz transceiver
数据表
2,935预期 2027/1/20
最低： 1
倍数： 1
: 3,000

ARM Cortex-M33 2.4 GHz 4 MB/s 8 dBm -104 dBm 1.7 V 3.5 V 2 MB - 40 C + 85 C QFN Reel, Cut Tape
Nordic Semiconductor RF片上系统 - SoC Ultra-low power SOC + advanced security features, a range of peripherals & multiprotocol 2.4 GHz transceiver
1,465预期 2026/10/30
最低： 1
倍数： 1
: 1,500

ARM Cortex-M33 2.4 GHz 4 MB/s 8 dBm -104 dBm 1.7 V 3.5 V 2 MB - 40 C + 85 C FCCSP Reel, Cut Tape
Nordic Semiconductor RF片上系统 - SoC Ultra-low power SOC + advanced security features, a range of peripherals & multiprotocol 2.4 GHz transceiver
938预期 2027/1/20
最低： 1
倍数： 1
: 1,000

ARM Cortex-M33 2.4 GHz 4 MB/s 8 dBm -104 dBm 1.7 V 3.5 V 2 MB - 40 C + 85 C QFN Reel, Cut Tape
Silicon Labs RF片上系统 - SoC BG29, 1024kB Flash, 256kB RAM, +8 dBm, +125C, 26 GPIO, QFN40
数据表

ARM Cortex-M33 2 Mb/s 8 dBm - 96.1 dBm 1.8 V 3.8 V 3.6 mA 11 mA 1 MB - 40 C + 125 C QFN-40 Tray
Silicon Labs RF片上系统 - SoC BG29, 1024kB Flash, 256kB RAM, +8 dBm, +125C, 26 GPIO, QFN40
数据表

ARM Cortex-M33 2 Mb/s 8 dBm - 96.1 dBm 1.8 V 3.8 V 3.6 mA 11 mA 1 MB - 40 C + 125 C QFN-40 Reel
Silicon Labs RF片上系统 - SoC BG29, 1024kB Flash, 256kB RAM, +4 dBm, DCDC Boost, +55C, 19 GPIO, WLCSP45
数据表

ARM Cortex-M33 2 Mb/s 4 dBm - 96.1 dBm 1.2 V 1.7 V 3.6 mA 1 MB - 20 C + 55 C WLCSP-45 Reel
Silicon Labs RF片上系统 - SoC BG29, 1024kB Flash, 256kB RAM, +6 dBm, DCDC Boost, +55C, 25 GPIO, QFN40
数据表

ARM Cortex-M33 2 Mb/s 6 dBm - 96.1 dBm 1.2 V 1.7 V 3.6 mA 9 mA 1 MB - 20 C + 55 C QFN-40 Reel
Silicon Labs RF片上系统 - SoC BG29, 1024kB Flash, 256kB RAM, +6 dBm, DCDC Boost, +55C, 25 GPIO, QFN40
数据表

ARM Cortex-M33 2 Mb/s 6 dBm - 96.1 dBm 1.2 V 1.7 V 3.6 mA 9 mA 1 MB - 20 C + 55 C QFN-40 Tray
Silicon Labs RF片上系统 - SoC MG29, 1024kB Flash, 256kB RAM, +8 dBm, +125C, 26 GPIO, QFN40
数据表

ARM Cortex-M33 2 Mb/s 8 dBm - 96.1 dBm 1.8 V 3.8 V 3.6 mA 11 mA 1 MB - 40 C + 125 C QFN-40 Tray
Silicon Labs RF片上系统 - SoC MG29, 1024kB Flash, 256kB RAM, +8 dBm, +125C, 26 GPIO, QFN40
数据表

ARM Cortex-M33 2 Mb/s 8 dBm - 96.1 dBm 1.8 V 3.8 V 3.6 mA 11 mA 1 MB - 40 C + 125 C QFN-40 Reel
Silicon Labs RF片上系统 - SoC MG29, 1024kB Flash, 256kB RAM, +6 dBm, DCDC Boost, +55C, 25 GPIO, QFN40
数据表

ARM Cortex-M33 2 Mb/s 6 dBm - 96.1 dBm 1.2 V 1.7 V 3.6 mA 9 mA 1 MB - 20 C + 55 C QFN-40 Tray
Silicon Labs RF片上系统 - SoC MG29, 1024kB Flash, 256kB RAM, +6 dBm, DCDC Boost, +55C, 25 GPIO, QFN40
数据表

ARM Cortex-M33 2 Mb/s 6 dBm - 96.1 dBm 1.2 V 1.7 V 3.6 mA 9 mA 1 MB - 20 C + 55 C QFN-40 Reel
Nordic Semiconductor RF片上系统 - SoC Entry-level, ultra-low-power wireless SoC for Bluetooth LE, Matter, Thread, and Zigbee

Wireless SoC ARM Cortex-M33 2.4 GHz 4 Mb/s 4 dBm - 97 dBm 1.7 V 3.6 V 1 MB - 40 C + 85 C CSP-29
Nordic Semiconductor RF片上系统 - SoC Entry-level, ultra-low-power wireless SoC for Bluetooth LE, Matter, Thread, and Zigbee

Wireless SoC ARM Cortex-M33 2.4 GHz 4 Mb/s 4 dBm - 97 dBm 1.7 V 3.6 V 1 MB - 40 C + 85 C CSP-29
Nordic Semiconductor RF片上系统 - SoC Entry-level, ultra-low-power wireless SoC for Bluetooth LE, Matter, Thread, and Zigbee

Wireless SoC ARM Cortex-M33 2.4 GHz 4 Mb/s 4 dBm - 97 dBm 1.7 V 3.6 V 1 MB - 40 C + 85 C CSP-39
Nordic Semiconductor RF片上系统 - SoC Entry-level, ultra-low-power wireless SoC for Bluetooth LE, Matter, Thread, and Zigbee

Wireless SoC ARM Cortex-M33 2.4 GHz 4 Mb/s 4 dBm - 97 dBm 1.7 V 3.6 V 1 MB - 40 C + 85 C CSP-39
Nordic Semiconductor RF片上系统 - SoC Entry-level, ultra-low-power wireless SoC for Bluetooth LE, Matter, Thread, and Zigbee

Wireless SoC ARM Cortex-M33 2.4 GHz 4 Mb/s 4 dBm - 97 dBm 1.7 V 3.6 V 1 MB - 40 C + 85 C QFN-48
Nordic Semiconductor RF片上系统 - SoC Ultra-low-power, low-voltage wireless SoC for Bluetooth LE, CSP

Wireless SoC ARM Cortex-M33 2.4 GHz 4 Mb/s 4 dBm - 97 dBm 1.2 V 1.7 V 1 MB - 40 C + 85 C CSP-29
Nordic Semiconductor RF片上系统 - SoC Ultra-low-power, low-voltage wireless SoC for Bluetooth LE, CSP

Wireless SoC ARM Cortex-M33 2.4 GHz 4 Mb/s 4 dBm - 97 dBm 1.2 V 1.7 V 1 MB - 40 C + 85 C CSP-29
Nordic Semiconductor RF片上系统 - SoC Ultra-low-power, low-voltage wireless SoC for Bluetooth LE, QFN

Wireless SoC ARM Cortex-M33 2.4 GHz 4 Mb/s 4 dBm - 97 dBm 1.2 V 1.7 V 1 MB - 40 C + 85 C QFN-48
Nordic Semiconductor RF片上系统 - SoC Ultra-low-power, low-voltage wireless SoC for Bluetooth LE, QFN

Wireless SoC ARM Cortex-M33 2.4 GHz 4 Mb/s 4 dBm - 97 dBm 1.2 V 1.7 V 1 MB - 40 C + 85 C QFN-48
Nordic Semiconductor NRF54LC10A-QFAA-R7
Nordic Semiconductor RF片上系统 - SoC Entry-level, ultra-low-power wireless SoC for Bluetooth LE, Matter, Thread, and Zigbee

Wireless SoC ARM Cortex-M33 2.4 GHz 4 Mb/s 4 dBm - 97 dBm 1.7 V 3.6 V 1 MB - 40 C + 85 C QFN-48