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库存量 RoHS

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ARM Cortex-M33 核心无线模块

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各种射频模块

列表图片

结果: 54

已应用过滤器:

核心 = ARM Cortex-M33

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库存量

正常库存

在售

新产品

符合RoHS

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选择	图像	零件编号	制造商	描述	数据表	供货情况	单价（含13%增值税）根据您的数量，按照单价筛选表格中的结果。	数量	RoHS
	多协议模块 Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: PCB KCMA32SABMD-0P Quectel 受限供货情况新产品	制造商零件编号 KCMA32SABMD-0P Mouser 零件编号 277-KCMA32SABMD-0P 新产品	Quectel	多协议模块 Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: PCB	数据表			受限供货情况
	多协议模块 Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax KCMA32SABMD-1X Quectel 受限供货情况新产品	制造商零件编号 KCMA32SABMD-1X Mouser 零件编号 277-KCMA32SABMD-1X 新产品	Quectel	多协议模块 Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax	数据表			受限供货情况
	多协议模块 Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: 4th gen RF coax, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm FCM363XABMD-4X-08 Quectel 受限供货情况新产品	制造商零件编号 FCM363XABMD-4X-08 Mouser 零件编号 277FCM363XABMD4X08 新产品	Quectel	多协议模块 Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: 4th gen RF coax, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm	数据表			受限供货情况
	多协议模块 Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM + 8MB PSRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm FCM363XACMD-0P-08 Quectel 受限供货情况新产品	制造商零件编号 FCM363XACMD-0P-08 Mouser 零件编号 277FCM363XACMD0P08 新产品	Quectel	多协议模块 Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM + 8MB PSRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm	数据表			受限供货情况