Quectel 无线模块

多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, -40 85C, 2MB flash

多协议模块 Wi-Fi 6, dual band (2.4 GHz/5 GHz) + Zigbee/Thread + BLE 5.3, ARM Cortex-M33, 260MHz, 8MB Flash, 1.2MB RAM, Antenna: PCB, -40 85C, ultra-compact LCC

多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ax, 2 2 (2T2R), SDIO interface, 2 antennas (BT5.4 shares 1 Wi-Fi antenna), -20 C to +70 C, support LE Audio and Auracast

多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ax, 2 2 (2T2R), SDIO interface, 3 antennas (BT5.4 has a separate antenna), -20 C to +70 C support LE Audio and Auracast

多协议模块 Wi-Fi 5 & Bluetooth 4.2, dual band 2.4/5GHz, 1x antenna, -40 C to +85 C

WiFi模块 - 802.11 Wi-Fi 4, dual band 2.4/5GHz, 1x antenna, -20 C to +70 C, ultra-compact LCC package, USB 2.0 interface only, 1.gen RF coax antenna

多协议模块 Dual-band, Wi-Fi 6 module, Bluetooth 5.4,2.4GHz+5GHz,-20 C +80 C

多协议模块 Dual-band, Wi-Fi 6 module, Bluetooth 5.4,pin antenna,D40L,with Shielding_Cover,2.4GHz+5GHz,-20 C +80 C

多协议模块 Wi-Fi 6 (2.4GHz/5GHz), IEEE 802.11a/b/g/n/ac/ax, BLE 5.4, Thread 802.15.4, Antenna 1 1 (1T1R), 2 antennas, Wi-Fi & Bluetooth application: USB 2.0, -40C +85C

多协议模块 Wi-Fi 7, triple-band support, DBS, BLE 5.3, module w/ filter?

WiFi模块 - 802.11 Wi-Fi Halow, IEEE 802.11ah, 920.5-928.1 MHz, 11 dBm, TELEC variant for Japan, -30 ? to +85 ?

多协议模块 Wi-Fi 6 (802.11ax), 2.4/5 GHz Dual-Band 1x1 + BT 5.2 + 802.15.4 Tri-Radio, Higher performance for Wi-Fi 4 and 6