ADLINK Technology 工程技术开发工具

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数量 RoHS
ADLINK Technology 开发板与工具包 - x86 Starterkit-COM Express 7 with Express-BD7-D1577, 10GbE SFP+ Card w/Cage (no SFP+ module), Active heatsink, 2x16GB DDR4 2400 non-ECC SODIMMs, power supply and accessory 无库存
最低： 1
倍数： 1

ADLINK Technology 开发板与工具包 - x86 STARTER KIT FOR TYPE 6 COM EXPRESS
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无库存
最低： 1
倍数： 1

ADLINK Technology Starterkit-COM Express 7-Full Copper
ADLINK Technology 开发板与工具包 - x86 无库存
最低： 1
倍数： 1
ADLINK Technology Starterkit-COM Express 7 PLUS-Full Fiber
ADLINK Technology 开发板与工具包 - x86 COM Express formfactor starterkit with Express-BASE7 carrier, 10GbE Full SFP+ Card, power supply and accessory (order COM Express module, memory and thermal solution separately) 无库存
最低： 1
倍数： 1
ADLINK Technology I-COM HPC Ampere Altra DEV Kit-128
ADLINK Technology 开发板和工具包 - ARM COM HPC Ampere Altra development kit with module, with M128-26CPU, with carrier, heatsink and accessories
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无库存
最低： 1
倍数： 1

ADLINK Technology nanoX Starter Kit PLUS
ADLINK Technology 开发板与工具包 - x86 nanoX Starter Kit PLUSCOM Express formfactor starterkit with MiniBase-10R carrier board, power supply, and accessory kit (order COM Express module, LVDS panel and thermal solution separately!) 无库存
最低： 1
倍数： 1

ADLINK Technology Phoenix GM Lite License Key
ADLINK Technology 开发软件 Phoenix GM Lite License Key 无库存
最低： 1
倍数： 1
ADLINK Technology Q7-Starterkit R1
ADLINK Technology 开发板与工具包 - x86 Q7-Starterkit with Q7-BASE carrier board, SD card, USB stick and ATX and power supply (without Q7 module and cooling solution). 无库存
最低： 1
倍数： 1

ADLINK Technology Starterkit-cKL-i7-7600U-M16G
ADLINK Technology 开发板与工具包 - x86 Starterkit-COM Express 6 PLUS with cExpress-KL-i7-7600U Compact size Type 6 module, H/P passive heatsink, 16GB DDR4 2133 non-ECC SODIMM, operating temperature 0C to 60C degree
3库存量
最低： 1
倍数： 1

ADLINK Technology 开发板和工具包 - ARM I-Pi SMARC Plus Prototype Kit for AIOT and robotics with LEC-MTK-I1200-4G-32G-BW-CT, low profile heatsink and i2s WM890 Audio (US 110/220V to 19V Adapter, USB debug cable)
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ADLINK Technology 界面开发工具 PCIe-833216Axis EtherCAT Master Motion Controller
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ADLINK Technology 界面开发工具 ADi-BACC-G2FThe ADi-BACC-G2F is IO extender breakout board by SPI and I2C interface. This board has below functions 32x GPI/32x GPO/8x 3A HC GPO/4x User LEDs/8x Meter sense/ 24x LED driver/1 wire bus/2x FS
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ADLINK Technology 界面开发工具 The ADi-BACC-G3 is IO extender breakout board by SPI interface. This board has below functions 32x GPI/32x GPO/8x 3A HC GPO/9x Meter sense/1 wire bus/EP_FAIL
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ADLINK Technology 界面开发工具 cBP-30643U CPCI-BP for Four 47-PinRedumdant PSU91-33318-002 REV:B1
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ADLINK Technology 界面开发工具 PCIe-8154 PCIe-8154 4-Axis Motion Controller
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ADLINK Technology I-Pi LEC-EL-6425E-4G-64G/US
ADLINK Technology 开发板与工具包 - x86 I-Pi SMARC Plus X Prototype Kit for AIOT with LEC-EL-6425E-4G-64G-CT, low profile heatsink and HDA ALC888 Audio (US 110/220V to 19V Adapter)
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ADLINK Technology I-PI WIFI DEV KIT w/ M.2 2242 AX210
ADLINK Technology 多协议开发工具 Wi-Fi 6E (6GHz), 2x2, Bluetooth 5.2, M.2 2230 module with antenna kit. The module supports dual-stream Wi-Fi in the 2.4GHz, 5GHz and 6GHz bands as well as Bluetooth 5.3. It also supports Wi-Fi 6 R2 features, including UL MU-MIMO1
ADLINK Technology WiFi kit-AW-CM276MA-PUR-PCIe
ADLINK Technology 多协议开发工具 WiFi kit-AW-CM276MA-PUR-PCIe
ADLINK Technology 2011 Socket SINK
ADLINK Technology 插座和适配器 LGA2011 2U Cooler Size:89.7 89.7 64.3 mm Inculding : fan,screw,sink....
ADLINK Technology COM HPC Ampere Altra DEV Kit-64
ADLINK Technology 开发板和工具包 - ARM COM HPC Ampere Altra development kit with module, with Q64-22 CPU, with carrier, heatsink and accessories
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ADLINK Technology COM HPC Ampere Altra DEV Kit-32
ADLINK Technology 开发板和工具包 - ARM COM HPC Ampere Altra development kit with module, with Q32-17 CPU, with carrier, heatsink and accessories
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ADLINK Technology COM-HPC Server Carrier
ADLINK Technology 开发板和工具包 - ARM COM-HPC Server type Prototype/Evaluation Carrier Board with Extend-ATX formfactor
ADLINK Technology DB30
ADLINK Technology 硬件调试器 DB30 Multi Purpose Debug Board for SMARC
ADLINK Technology DB30 x86
ADLINK Technology 硬件调试器 Multi purpose Debug Board for 4th BMC equipped COM Express
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ADLINK Technology DLAP-411-Orin Dev Kit
ADLINK Technology 开发板和工具包 - ARM w. Jetson AGX Orin module, 1xHDMI, 4x USB 3.2 Gen2 + 1x OTG, 4x GbE w/o PSE, 1x Audio, 1x COM, 1x MicroSD slot, 1x M.2 M key slot, 1x M.2 B key slot,, 1x M.2 E key slot 1x CANBUS,( GPIO, I2C,SPI) 24Vdc input
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