|
|
FPGA - 现场可编程门阵列 XC7A50T-2CSG324I
- XC7A50T-2CSG324I
- AMD / Xilinx
-
1:
¥1,245.0453
-
20预期 2027/9/13
|
Mouser 零件编号
217-XC7A50T-2CSG324I
|
AMD / Xilinx
|
FPGA - 现场可编程门阵列 XC7A50T-2CSG324I
|
|
20预期 2027/9/13
|
|
最低: 1
倍数: 1
|
|
|
XC7A50T
|
52160 LE
|
8150 ALM
|
2.64 Mbit
|
210 I/O
|
950 mV
|
1.05 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
CSBGA-324
|
|
|
|
|
|
FPGA - 现场可编程门阵列 XC7K160T-2FF676I
- XC7K160T-2FF676I
- AMD / Xilinx
-
1:
¥9,661.3079
-
10预期 2027/8/26
|
Mouser 零件编号
217-XC7K160T-2FF676I
|
AMD / Xilinx
|
FPGA - 现场可编程门阵列 XC7K160T-2FF676I
|
|
10预期 2027/8/26
|
|
最低: 1
倍数: 1
|
|
|
XC7K160T
|
162240 LE
|
25350 ALM
|
11.43 Mbit
|
400 I/O
|
970 mV
|
1.03 V
|
- 40 C
|
+ 100 C
|
12.5 Gb/s
|
8 Transceiver
|
SMD/SMT
|
FCBGA-676
|
|
|
|
|
|
FPGA - 现场可编程门阵列 XC7K70T-2FBG484I
- XC7K70T-2FBG484I
- AMD / Xilinx
-
1:
¥2,732.3626
-
8预期 2027/8/26
|
Mouser 零件编号
217-XC7K70T-2FBG484I
|
AMD / Xilinx
|
FPGA - 现场可编程门阵列 XC7K70T-2FBG484I
|
|
8预期 2027/8/26
|
|
最低: 1
倍数: 1
|
|
|
XC7K70T
|
65600 LE
|
10250 ALM
|
4.75 Mbit
|
285 I/O
|
970 mV
|
1.03 V
|
- 40 C
|
+ 100 C
|
12.5 Gb/s
|
4 Transceiver
|
SMD/SMT
|
FCBGA-484
|
|
|
|
|
|
FPGA - 现场可编程门阵列 XC7S25-1CSGA324I
- XC7S25-1CSGA324I
- AMD / Xilinx
-
1:
¥554.4458
-
141在途量
|
Mouser 零件编号
217-XC7S25-1CSGA324I
|
AMD / Xilinx
|
FPGA - 现场可编程门阵列 XC7S25-1CSGA324I
|
|
141在途量
在途量:
65 预期 2027/7/6
76 预期 2027/8/11
|
|
最低: 1
倍数: 1
|
|
|
XC7S25
|
23360 LE
|
3650 ALM
|
1.58 Mbit
|
150 I/O
|
950 mV
|
1.05 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
CSGA-324
|
|
|
|
|
|
FPGA - 现场可编程门阵列 XC7S25-1FTGB196Q
- XC7S25-1FTGB196Q
- AMD / Xilinx
-
1:
¥554.4458
-
194在途量
|
Mouser 零件编号
217-XC7S25-1FTGB196Q
|
AMD / Xilinx
|
FPGA - 现场可编程门阵列 XC7S25-1FTGB196Q
|
|
194在途量
在途量:
111 预期 2027/5/10
83 预期 2027/5/26
|
|
最低: 1
倍数: 1
|
|
|
XC7S25
|
23360 LE
|
3650 ALM
|
1.58 Mbit
|
100 I/O
|
950 mV
|
1.05 V
|
- 40 C
|
+ 125 C
|
|
|
SMD/SMT
|
CSBGA-196
|
|
|
|
|
|
FPGA - 现场可编程门阵列 XC7S25-2CSGA225I
- XC7S25-2CSGA225I
- AMD / Xilinx
-
1:
¥610.20
-
259在途量
|
Mouser 零件编号
217-XC7S25-2CSGA225I
|
AMD / Xilinx
|
FPGA - 现场可编程门阵列 XC7S25-2CSGA225I
|
|
259在途量
在途量:
150 预期 2027/5/5
109 预期 2027/5/20
|
|
最低: 1
倍数: 1
|
|
|
XC7S25
|
23360 LE
|
3650 ALM
|
1.58 Mbit
|
150 I/O
|
950 mV
|
1.05 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
CSBGA-225
|
|
|
|
|
|
FPGA - 现场可编程门阵列 XC7S50-1FTGB196I
- XC7S50-1FTGB196I
- AMD / Xilinx
-
1:
¥654.7785
-
104在途量
|
Mouser 零件编号
217-XC7S50-1FTGB196I
|
AMD / Xilinx
|
FPGA - 现场可编程门阵列 XC7S50-1FTGB196I
|
|
104在途量
在途量:
28 预期 2027/1/25
76 预期 2027/6/30
|
|
最低: 1
倍数: 1
|
|
|
XC7S50
|
52160 LE
|
8150 ALM
|
2.64 Mbit
|
100 I/O
|
950 mV
|
1.05 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
CSBGA-196
|
|
|
|
|
|
FPGA - 现场可编程门阵列 XC7S50-2FTGB196I
- XC7S50-2FTGB196I
- AMD / Xilinx
-
1:
¥895.4798
-
38在途量
|
Mouser 零件编号
217-XC7S50-2FTGB196I
|
AMD / Xilinx
|
FPGA - 现场可编程门阵列 XC7S50-2FTGB196I
|
|
38在途量
在途量:
8 预期 2027/6/3
30 预期 2027/6/18
|
|
最低: 1
倍数: 1
|
|
|
XC7S50
|
52160 LE
|
8150 ALM
|
2.64 Mbit
|
100 I/O
|
950 mV
|
1.05 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
CSBGA-196
|
|
|
|
|
|
FPGA - 现场可编程门阵列 XC7S6-2CSGA225I
- XC7S6-2CSGA225I
- AMD / Xilinx
-
1:
¥298.0262
-
77预期 2027/5/20
|
Mouser 零件编号
217-XC7S6-2CSGA225I
|
AMD / Xilinx
|
FPGA - 现场可编程门阵列 XC7S6-2CSGA225I
|
|
77预期 2027/5/20
|
|
最低: 1
倍数: 1
|
|
|
XC7S6
|
6000 LE
|
938 ALM
|
180 kbit
|
100 I/O
|
950 mV
|
1.05 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
CSBGA-225
|
|
|
|
|
|
FPGA - 现场可编程门阵列 XC7S6-2FTGB196I
- XC7S6-2FTGB196I
- AMD / Xilinx
-
1:
¥298.0262
-
258在途量
|
Mouser 零件编号
217-XC7S6-2FTGB196I
|
AMD / Xilinx
|
FPGA - 现场可编程门阵列 XC7S6-2FTGB196I
|
|
258在途量
在途量:
16 预期 2027/8/26
242 预期 2027/8/27
|
|
最低: 1
倍数: 1
|
|
|
XC7S6
|
6000 LE
|
938 ALM
|
180 kbit
|
100 I/O
|
950 mV
|
1.05 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
CSBGA-196
|
|
|
|
|
|
FPGA - 现场可编程门阵列 XC7S75-1FGGA676I
- XC7S75-1FGGA676I
- AMD / Xilinx
-
1:
¥1,453.067
-
76在途量
|
Mouser 零件编号
217-XC7S75-1FGGA676I
|
AMD / Xilinx
|
FPGA - 现场可编程门阵列 XC7S75-1FGGA676I
|
|
76在途量
在途量:
22 预期 2027/1/25
23 预期 2027/5/31
31 预期 2027/8/18
|
|
最低: 1
倍数: 1
|
|
|
XC7S75
|
76800 LE
|
12000 ALM
|
3.16 Mbit
|
400 I/O
|
950 mV
|
1.05 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
FBGA-676
|
|
|
|
|
|
FPGA - 现场可编程门阵列 XCAU15P-1SBVB484I
- XCAU15P-1SBVB484I
- AMD / Xilinx
-
1:
¥2,531.5277
-
21在途量
|
Mouser 零件编号
217-XCAU15P1SBVB484I
|
AMD / Xilinx
|
FPGA - 现场可编程门阵列 XCAU15P-1SBVB484I
|
|
21在途量
在途量:
10 预期 2027/8/26
11 预期 2027/8/27
|
|
最低: 1
倍数: 1
|
|
|
XCAU15P
|
170100 LE
|
9720 ALM
|
5.1 Mbit
|
204 I/O
|
825 mV
|
876 mV
|
- 40 C
|
+ 100 C
|
12.5 Gb/s
|
12 Transceiver
|
SMD/SMT
|
BGA-484
|
|
|
|
|
|
FPGA - 现场可编程门阵列 XCAU20P-1FFVB676I
- XCAU20P-1FFVB676I
- AMD / Xilinx
-
1:
¥3,394.746
-
17预期 2027/3/1
|
Mouser 零件编号
217-XCAU20P1FFVB676I
|
AMD / Xilinx
|
FPGA - 现场可编程门阵列 XCAU20P-1FFVB676I
|
|
17预期 2027/3/1
|
|
最低: 1
倍数: 1
|
|
|
XCAU20P
|
238437 LE
|
13625 ALM
|
7 Mbit
|
240 I/O
|
850 mV
|
850 mV
|
- 40 C
|
+ 100 C
|
12.5 Gb/s
|
12 Transceiver
|
SMD/SMT
|
BGA-676
|
|
|
|
|
|
FPGA - 现场可编程门阵列 XCAU20P-2SFVB784I
- XCAU20P-2SFVB784I
- AMD / Xilinx
-
1:
¥5,351.1489
-
21预期 2027/5/24
|
Mouser 零件编号
217-XCAU20P2SFVB784I
|
AMD / Xilinx
|
FPGA - 现场可编程门阵列 XCAU20P-2SFVB784I
|
|
21预期 2027/5/24
|
|
最低: 1
倍数: 1
|
|
|
XCAU20P
|
238437 LE
|
13625 ALM
|
7 Mbit
|
240 I/O
|
850 mV
|
850 mV
|
- 40 C
|
+ 100 C
|
12.5 Gb/s
|
12 Transceiver
|
SMD/SMT
|
BGA-784
|
|
|
|
|
|
FPGA - 现场可编程门阵列 XCAU25P-2SFVB784I
- XCAU25P-2SFVB784I
- AMD / Xilinx
-
1:
¥6,702.2334
-
11预期 2027/5/10
|
Mouser 零件编号
217-XCAU25P2SFVB784I
|
AMD / Xilinx
|
FPGA - 现场可编程门阵列 XCAU25P-2SFVB784I
|
|
11预期 2027/5/10
|
|
最低: 1
倍数: 1
|
|
|
XCAU25P
|
308437 LE
|
17625 ALM
|
10.5 Mbit
|
316 I/O
|
850 mV
|
850 mV
|
- 40 C
|
+ 100 C
|
12.5 Gb/s
|
12 Transceiver
|
SMD/SMT
|
BGA-784
|
|
|
|
|
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 330LEs
- A3P030-VQG100I
- Microchip Technology
-
1:
¥70.3877
-
257库存量
-
360预期 2026/10/7
|
Mouser 零件编号
494-A3P030-VQG100I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 330LEs
|
|
257库存量
360预期 2026/10/7
|
|
最低: 1
倍数: 1
|
|
|
A3P030
|
330 LE
|
|
0 bit
|
77 I/O
|
1.425 V
|
1.575 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
VQFP-100
|
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 11KLEs
- A3P1000-FGG484I
- Microchip Technology
-
1:
¥958.6807
-
57库存量
-
60预期 2026/10/1
|
Mouser 零件编号
494-A3P1000-FGG484I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 11KLEs
|
|
57库存量
60预期 2026/10/1
|
|
最低: 1
倍数: 1
|
|
|
A3P1000
|
11000 LE
|
|
144 kbit
|
300 I/O
|
1.425 V
|
1.575 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
FBGA-484
|
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 3KLEs
- A3P250-FGG256I
- Microchip Technology
-
1:
¥248.5661
-
180预期 2027/3/5
|
Mouser 零件编号
494-A3P250-FGG256I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 3KLEs
|
|
180预期 2027/3/5
|
|
最低: 1
倍数: 1
|
|
|
A3P250
|
3000 LE
|
|
36 kbit
|
157 I/O
|
1.425 V
|
1.575 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
FBGA-256
|
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 16KLEs
- A3PE1500-FGG484I
- Microchip Technology
-
1:
¥2,129.937
-
38预期 2027/1/25
|
Mouser 零件编号
494-A3PE1500-FGG484I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 16KLEs
|
|
38预期 2027/1/25
|
|
最低: 1
倍数: 1
|
|
|
A3PE1500
|
16000 LE
|
|
270 kbit
|
280 I/O
|
1.425 V
|
1.575 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
FBGA-484
|
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 7KLEs
- A3PE600-2FGG484I
- Microchip Technology
-
1:
¥1,022.8647
-
59预期 2026/10/12
|
Mouser 零件编号
494-A3PE600-2FGG484I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 7KLEs
|
|
59预期 2026/10/12
|
|
最低: 1
倍数: 1
|
|
|
A3PE600
|
7000 LE
|
|
108 kbit
|
270 I/O
|
1.425 V
|
1.575 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
FBGA-484
|
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 IGLOO FPGA, 3KLEs
- AGL250V5-FGG144I
- Microchip Technology
-
1:
¥260.7249
-
376在途量
|
Mouser 零件编号
494-AGL250V5-FGG144I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 IGLOO FPGA, 3KLEs
|
|
376在途量
|
|
最低: 1
倍数: 1
|
|
|
AGL250V5
|
3000 LE
|
|
36 kbit
|
97 I/O
|
1.425 V
|
1.575 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
FBGA-144
|
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 IGLOO2 Low Density FPGA, 6KLEs
- M2GL005-TQG144I
- Microchip Technology
-
1:
¥130.3568
-
180预期 2026/10/9
|
Mouser 零件编号
494-M2GL005-TQG144I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 IGLOO2 Low Density FPGA, 6KLEs
|
|
180预期 2026/10/9
|
|
最低: 1
倍数: 1
|
|
|
M2GL005
|
6060 LE
|
|
703 kbit
|
84 I/O
|
1.14 V
|
1.26 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
TQFP-144
|
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 21.12Mb 16 TransCh 250Mbps-12.7Gbps
- MPF300T-1FCG784I
- Microchip Technology
-
1:
¥6,282.5288
-
10预期 2027/1/29
|
Mouser 零件编号
494-MPF300T-1FCG784I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 21.12Mb 16 TransCh 250Mbps-12.7Gbps
|
|
10预期 2027/1/29
|
|
最低: 1
倍数: 1
|
|
|
MPF300T
|
300000 LE
|
|
20.6 Mbit
|
512 I/O
|
970 mV
|
1.08 V
|
- 40 C
|
+ 100 C
|
12.5 Gb/s
|
16 Transceiver
|
SMD/SMT
|
BGA-784
|
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 6864 LUTs 335 I/O 3.3V 4 SPEED
- LCMXO2-7000HC-4FG484I
- Lattice
-
1:
¥422.6765
-
60预期 2027/5/5
|
Mouser 零件编号
842-27000HC4FG484I
|
Lattice
|
FPGA - 现场可编程门阵列 6864 LUTs 335 I/O 3.3V 4 SPEED
|
|
60预期 2027/5/5
|
|
最低: 1
倍数: 1
|
|
|
LCMXO2
|
6864 LE
|
3432 ALM
|
240 kbit
|
334 I/O
|
2.375 V
|
3.6 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
FTBGA-484
|
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 6864 LUTs 207 I/O 3.3V 5 SPEED
- LCMXO2-7000HC-5FTG256I
- Lattice
-
1:
¥260.5554
-
175在途量
|
Mouser 零件编号
842-27000HC5FTG256I
|
Lattice
|
FPGA - 现场可编程门阵列 6864 LUTs 207 I/O 3.3V 5 SPEED
|
|
175在途量
|
|
最低: 1
倍数: 1
|
|
|
LCMXO2
|
6864 LE
|
3432 ALM
|
240 kbit
|
206 I/O
|
2.375 V
|
3.6 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
FTBGA-256
|
|
Tray
|
|