|
|
FPGA - 现场可编程门阵列 XC7A75T-2FGG484C
- XC7A75T-2FGG484C
- AMD / Xilinx
-
1:
¥1,873.766
-
50在途量
|
Mouser 零件编号
217-XC7A75T-2FGG484C
|
AMD / Xilinx
|
FPGA - 现场可编程门阵列 XC7A75T-2FGG484C
|
|
50在途量
在途量:
7 预期 2027/4/21
8 预期 2027/4/28
16 预期 2027/7/12
19 预期 2027/7/28
|
|
|
¥1,873.766
|
|
|
¥1,595.1758
|
|
最低: 1
倍数: 1
|
|
|
XC7A75T
|
75520 LE
|
11800 ALM
|
3.69 kbit
|
285 I/O
|
950 mV
|
1.05 V
|
0 C
|
+ 85 C
|
6.6 Gb/s
|
4 Transceiver
|
SMD/SMT
|
FCBGA-484
|
|
|
|
|
|
FPGA - 现场可编程门阵列 XC7K70T-1FBG676C
- XC7K70T-1FBG676C
- AMD / Xilinx
-
1:
¥2,686.2021
-
21在途量
|
Mouser 零件编号
217-XC7K70T-1FBG676C
|
AMD / Xilinx
|
FPGA - 现场可编程门阵列 XC7K70T-1FBG676C
|
|
21在途量
在途量:
11 预期 2027/8/12
10 预期 2027/8/19
|
|
|
¥2,686.2021
|
|
|
¥2,316.2175
|
|
最低: 1
倍数: 1
|
|
|
XC7K70T
|
65600 LE
|
10250 ALM
|
4.75 Mbit
|
300 I/O
|
970 mV
|
1.03 V
|
0 C
|
+ 85 C
|
12.5 Gb/s
|
8 Transceiver
|
SMD/SMT
|
FCBGA-676
|
|
|
|
|
|
FPGA - 现场可编程门阵列 XC7S15-2FTGB196C
- XC7S15-2FTGB196C
- AMD / Xilinx
-
1:
¥330.864
-
417在途量
|
Mouser 零件编号
217-XC7S15-2FTGB196C
|
AMD / Xilinx
|
FPGA - 现场可编程门阵列 XC7S15-2FTGB196C
|
|
417在途量
在途量:
123 预期 2027/8/23
294 预期 2027/8/25
|
|
|
¥330.864
|
|
|
¥267.9117
|
|
|
¥252.2047
|
|
|
¥243.2664
|
|
最低: 1
倍数: 1
|
|
|
XC7S15
|
12800 LE
|
2000 ALM
|
360 kbit
|
100 I/O
|
950 mV
|
1.05 V
|
0 C
|
+ 85 C
|
|
|
SMD/SMT
|
CSBGA-196
|
|
|
|
|
|
FPGA - 现场可编程门阵列 XC7S25-2CSGA225C
- XC7S25-2CSGA225C
- AMD / Xilinx
-
1:
¥334.9998
-
62在途量
|
Mouser 零件编号
217-XC7S25-2CSGA225C
|
AMD / Xilinx
|
FPGA - 现场可编程门阵列 XC7S25-2CSGA225C
|
|
62在途量
在途量:
25 预期 2027/5/31
37 预期 2027/6/29
|
|
最低: 1
倍数: 1
|
|
|
XC7S25
|
23360 LE
|
3650 ALM
|
1.58 Mbit
|
150 I/O
|
950 mV
|
1.05 V
|
0 C
|
+ 85 C
|
|
|
SMD/SMT
|
CSBGA-225
|
|
|
|
|
|
FPGA - 现场可编程门阵列 XC7S50-2FGGA484C
- XC7S50-2FGGA484C
- AMD / Xilinx
-
1:
¥934.2727
-
86在途量
|
Mouser 零件编号
217-XC7S50-2FGGA484C
|
AMD / Xilinx
|
FPGA - 现场可编程门阵列 XC7S50-2FGGA484C
|
|
86在途量
在途量:
38 预期 2027/5/10
33 预期 2027/5/13
15 预期 2027/5/19
|
|
|
¥934.2727
|
|
|
¥781.4176
|
|
|
¥751.563
|
|
最低: 1
倍数: 1
|
|
|
XC7S50
|
52160 LE
|
8150 ALM
|
2.64 Mbit
|
250 I/O
|
950 mV
|
1.05 V
|
0 C
|
+ 85 C
|
|
|
SMD/SMT
|
FBGA-484
|
|
|
|
|
|
FPGA - 现场可编程门阵列 XC7S6-2FTGB196C
- XC7S6-2FTGB196C
- AMD / Xilinx
-
1:
¥190.4163
-
103预期 2027/5/17
|
Mouser 零件编号
217-XC7S6-2FTGB196C
|
AMD / Xilinx
|
FPGA - 现场可编程门阵列 XC7S6-2FTGB196C
|
|
103预期 2027/5/17
|
|
|
¥190.4163
|
|
|
¥185.1957
|
|
最低: 1
倍数: 1
|
|
|
XC7S6
|
6000 LE
|
938 ALM
|
180 kbit
|
100 I/O
|
950 mV
|
1.05 V
|
0 C
|
+ 85 C
|
|
|
SMD/SMT
|
CSBGA-196
|
|
|
|
|
|
FPGA - 现场可编程门阵列 XC7S75-2FGGA484C
- XC7S75-2FGGA484C
- AMD / Xilinx
-
1:
¥1,052.143
-
44在途量
|
Mouser 零件编号
217-XC7S75-2FGGA484C
|
AMD / Xilinx
|
FPGA - 现场可编程门阵列 XC7S75-2FGGA484C
|
|
44在途量
在途量:
24 预期 2027/6/28
20 预期 2027/8/20
|
|
最低: 1
倍数: 1
|
|
|
XC7S75
|
76800 LE
|
12000 ALM
|
3.16 Mbit
|
338 I/O
|
950 mV
|
1.05 V
|
0 C
|
+ 85 C
|
|
|
SMD/SMT
|
FBGA-484
|
|
|
|
|
|
FPGA - 现场可编程门阵列 XCAU10P-1SBVB484E
- XCAU10P-1SBVB484E
- AMD / Xilinx
-
1:
¥1,182.8388
-
55在途量
|
Mouser 零件编号
217-XCAU10P1SBVB484E
|
AMD / Xilinx
|
FPGA - 现场可编程门阵列 XCAU10P-1SBVB484E
|
|
55在途量
在途量:
30 预期 2027/5/24
25 预期 2027/5/27
|
|
最低: 1
倍数: 1
|
|
|
XCAU10P
|
96250 LE
|
5500 ALM
|
3.5 Mbit
|
216 I/O
|
850 mV
|
850 mV
|
0 C
|
+ 100 C
|
12.5 Gb/s
|
12 Transceiver
|
SMD/SMT
|
BGA-484
|
|
|
|
|
|
FPGA - 现场可编程门阵列 XCAU15P-1UBVA368E
- XCAU15P-1UBVA368E
- AMD / Xilinx
-
1:
¥1,956.5611
-
25在途量
|
Mouser 零件编号
217-XCAU15P1UBVA368E
|
AMD / Xilinx
|
FPGA - 现场可编程门阵列 XCAU15P-1UBVA368E
|
|
25在途量
在途量:
4 预期 2027/5/10
10 预期 2027/5/12
11 预期 2027/7/13
|
|
|
¥1,956.5611
|
|
|
¥1,549.5238
|
|
最低: 1
倍数: 1
|
|
|
XCAU15P
|
170100 LE
|
9720 ALM
|
5.1 Mbit
|
136 I/O
|
850 mV
|
850 mV
|
0 C
|
+ 100 C
|
12.5 Gb/s
|
12 Transceiver
|
SMD/SMT
|
BGA-368
|
|
|
|
|
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 3KLEs
- A3P250-FGG144
- Microchip Technology
-
1:
¥176.845
-
480预期 2026/12/18
|
Mouser 零件编号
494-A3P250-FGG144
|
Microchip Technology
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 3KLEs
|
|
480预期 2026/12/18
|
|
最低: 1
倍数: 1
|
|
|
A3P250
|
3000 LE
|
|
36 kbit
|
97 I/O
|
1.425 V
|
1.575 V
|
0 C
|
+ 85 C
|
|
|
SMD/SMT
|
FBGA-144
|
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 ProASICPlus FPGA, 150K System Gates
- APA150-TQG100
- Microchip Technology
-
1:
¥922.9501
-
89预期 2026/10/13
|
Mouser 零件编号
494-APA150-TQG100
|
Microchip Technology
|
FPGA - 现场可编程门阵列 ProASICPlus FPGA, 150K System Gates
|
|
89预期 2026/10/13
|
|
最低: 1
倍数: 1
|
|
|
APA150
|
|
|
36 kbit
|
66 I/O
|
2.3 V
|
2.7 V
|
0 C
|
+ 70 C
|
|
|
SMD/SMT
|
TQFP-100
|
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 7.8Mb 8 TransCh 250Mbps-12.7Gbps
- MPF100T-FCG484E
- Microchip Technology
-
1:
¥1,202.1166
-
21预期 2026/12/21
|
Mouser 零件编号
494-MPF100T-FCG484E
|
Microchip Technology
|
FPGA - 现场可编程门阵列 7.8Mb 8 TransCh 250Mbps-12.7Gbps
|
|
21预期 2026/12/21
|
|
最低: 1
倍数: 1
|
|
|
MPF100T
|
109000 LE
|
|
7.6 Mbit
|
296 I/O
|
970 mV
|
1.08 V
|
0 C
|
+ 100 C
|
12.5 Gb/s
|
4 Transceiver
|
SMD/SMT
|
BGA-484
|
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 6864 LUTs 207 I/O 3.3V 4 SPEED
- LCMXO2-7000HC-4BG256C
- Lattice
-
1:
¥239.3792
-
119预期 2027/6/30
|
Mouser 零件编号
842-27000HC4BG256C
|
Lattice
|
FPGA - 现场可编程门阵列 6864 LUTs 207 I/O 3.3V 4 SPEED
|
|
119预期 2027/6/30
|
|
|
¥239.3792
|
|
|
¥201.4112
|
|
|
¥191.7384
|
|
最低: 1
倍数: 1
|
|
|
LCMXO2
|
6864 LE
|
3432 ALM
|
240 kbit
|
206 I/O
|
2.375 V
|
3.6 V
|
0 C
|
+ 85 C
|
|
|
SMD/SMT
|
CABGA-256
|
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 6864 LUTs 335 I/O 3.3V 4 SPEED
- LCMXO2-7000HC-4FG484C
- Lattice
-
1:
¥403.071
-
60预期 2027/4/8
|
Mouser 零件编号
842-27000HC4FG484C
|
Lattice
|
FPGA - 现场可编程门阵列 6864 LUTs 335 I/O 3.3V 4 SPEED
|
|
60预期 2027/4/8
|
|
最低: 1
倍数: 1
|
|
|
LCMXO2
|
6864 LE
|
3432 ALM
|
240 kbit
|
334 I/O
|
2.375 V
|
3.6 V
|
0 C
|
+ 85 C
|
|
|
SMD/SMT
|
FTBGA-484
|
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 6864 LUTs 207 I/O 3.3V 4 SPEED
- LCMXO2-7000HC-4FTG256C
- Lattice
-
1:
¥225.8192
-
90预期 2027/9/7
|
Mouser 零件编号
842-27000HC4FTG256C
|
Lattice
|
FPGA - 现场可编程门阵列 6864 LUTs 207 I/O 3.3V 4 SPEED
|
|
90预期 2027/9/7
|
|
|
¥225.8192
|
|
|
¥196.8686
|
|
|
¥189.2524
|
|
最低: 1
倍数: 1
|
|
|
LCMXO2
|
6864 LE
|
3432 ALM
|
240 kbit
|
206 I/O
|
2.375 V
|
3.6 V
|
0 C
|
+ 85 C
|
|
|
SMD/SMT
|
FTBGA-256
|
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 6864 LUTs 207 I/O 3.3V 6 SPEED
- LCMXO2-7000HC-6BG256C
- Lattice
-
1:
¥263.6177
-
119预期 2026/9/17
|
Mouser 零件编号
842-27000HC6BG256C
|
Lattice
|
FPGA - 现场可编程门阵列 6864 LUTs 207 I/O 3.3V 6 SPEED
|
|
119预期 2026/9/17
|
|
|
¥263.6177
|
|
|
¥236.8141
|
|
|
¥236.735
|
|
最低: 1
倍数: 1
|
|
|
LCMXO2
|
6864 LE
|
3432 ALM
|
240 kbit
|
206 I/O
|
2.375 V
|
3.6 V
|
0 C
|
+ 85 C
|
|
|
SMD/SMT
|
CABGA-256
|
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 1280 LUTs
- LCMXO3LF-1300C-5BG256C
- Lattice
-
1:
¥125.7238
-
357在途量
|
Mouser 零件编号
842-3LF1300C5BG256C
|
Lattice
|
FPGA - 现场可编程门阵列 1280 LUTs
|
|
357在途量
在途量:
119 预期 2027/2/23
238 预期 2027/6/23
|
|
|
¥125.7238
|
|
|
¥109.5987
|
|
|
¥105.3838
|
|
最低: 1
倍数: 1
|
|
|
LCMXO3LF
|
1280 LE
|
640 ALM
|
64 kbit
|
206 I/O
|
2.375 V
|
3.465 V
|
0 C
|
+ 85 C
|
|
|
SMD/SMT
|
CSFBGA-256
|
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 2112 LUTs
- LCMXO3LF-2100C-5BG256C
- Lattice
-
1:
¥162.5392
-
426在途量
|
Mouser 零件编号
842-3LF2100C5BG256C
|
Lattice
|
FPGA - 现场可编程门阵列 2112 LUTs
|
|
426在途量
在途量:
69 预期 2027/3/19
357 预期 2027/5/10
|
|
|
¥162.5392
|
|
|
¥132.3456
|
|
|
¥131.1026
|
|
最低: 1
倍数: 1
|
|
|
LCMXO3LF
|
2112 LE
|
1056 ALM
|
74 kbit
|
206 I/O
|
2.375 V
|
3.465 V
|
0 C
|
+ 85 C
|
|
|
SMD/SMT
|
CSFBGA-256
|
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 2112 LUTs
- LCMXO3LF-2100C-6BG256C
- Lattice
-
1:
¥163.7822
-
119在途量
|
Mouser 零件编号
842-3LF2100C6BG256C
|
Lattice
|
FPGA - 现场可编程门阵列 2112 LUTs
|
|
119在途量
|
|
|
¥163.7822
|
|
|
¥142.267
|
|
|
¥137.1481
|
|
最低: 1
倍数: 1
|
|
|
LCMXO3LF
|
2112 LE
|
1056 ALM
|
74 kbit
|
206 I/O
|
2.375 V
|
3.465 V
|
0 C
|
+ 85 C
|
|
|
SMD/SMT
|
CSFBGA-256
|
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 4320 LUTs
- LCMXO3LF-4300C-5BG400C
- Lattice
-
1:
¥192.891
-
296在途量
|
Mouser 零件编号
842-3LF4300C5BG400C
|
Lattice
|
FPGA - 现场可编程门阵列 4320 LUTs
|
|
296在途量
在途量:
26 预期 2027/6/18
180 预期 2027/7/8
90 预期 2027/7/16
|
|
|
¥192.891
|
|
|
¥172.212
|
|
|
¥155.6688
|
|
最低: 1
倍数: 1
|
|
|
LCMXO3LF
|
4320 LE
|
2160 ALM
|
92 kbit
|
335 I/O
|
2.375 V
|
3.465 V
|
0 C
|
+ 85 C
|
|
|
SMD/SMT
|
CABGA-400
|
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 6864 LUTs
- LCMXO3LF-6900C-5BG256C
- Lattice
-
1:
¥183.2182
-
119预期 2027/5/5
|
Mouser 零件编号
842-3LF6900C5BG256C
|
Lattice
|
FPGA - 现场可编程门阵列 6864 LUTs
|
|
119预期 2027/5/5
|
|
|
¥183.2182
|
|
|
¥159.6464
|
|
|
¥153.2732
|
|
最低: 1
倍数: 1
|
|
|
LCMXO3LF
|
6900 LE
|
3450 ALM
|
240 kbit
|
206 I/O
|
2.375 V
|
3.465 V
|
0 C
|
+ 85 C
|
900 Mb/s
|
|
SMD/SMT
|
CSFBGA-256
|
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 6864 LUTs
- LCMXO3LF-6900C-5BG400C
- Lattice
-
1:
¥220.1918
-
90预期 2027/9/7
|
Mouser 零件编号
842-3LF6900C5BG400C
|
Lattice
|
FPGA - 现场可编程门阵列 6864 LUTs
|
|
90预期 2027/9/7
|
|
|
¥220.1918
|
|
|
¥192.4842
|
|
|
¥177.9185
|
|
最低: 1
倍数: 1
|
|
|
LCMXO3LF
|
6900 LE
|
3450 ALM
|
240 kbit
|
335 I/O
|
2.375 V
|
3.465 V
|
0 C
|
+ 85 C
|
900 Mb/s
|
|
SMD/SMT
|
CABGA-400
|
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 6864 LUTs
- LCMXO3LF-6900C-6BG324C
- Lattice
-
1:
¥236.5655
-
126预期 2027/5/6
|
Mouser 零件编号
842-3LF6900C6BG324C
|
Lattice
|
FPGA - 现场可编程门阵列 6864 LUTs
|
|
126预期 2027/5/6
|
|
|
¥236.5655
|
|
|
¥205.6374
|
|
|
¥190.6649
|
|
最低: 1
倍数: 1
|
|
|
LCMXO3LF
|
6900 LE
|
3450 ALM
|
240 kbit
|
279 I/O
|
2.375 V
|
3.465 V
|
0 C
|
+ 85 C
|
900 Mb/s
|
|
SMD/SMT
|
CABGA-324
|
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 256 LUTs 22 I/O 1.2V -1 Speed
- LCMXO2-256ZE-1SG32C
- Lattice
-
1:
¥45.0757
-
980预期 2027/9/7
|
Mouser 零件编号
842-LCXO2256ZE1SG32C
|
Lattice
|
FPGA - 现场可编程门阵列 256 LUTs 22 I/O 1.2V -1 Speed
|
|
980预期 2027/9/7
|
|
|
¥45.0757
|
|
|
¥39.1206
|
|
|
¥36.3973
|
|
|
¥34.7362
|
|
最低: 1
倍数: 1
|
|
|
LCMXO2
|
256 LE
|
128 ALM
|
0 bit
|
21 I/O
|
1.14 V
|
1.26 V
|
0 C
|
+ 85 C
|
|
|
SMD/SMT
|
QFN-32
|
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 17.3K LUTs 222 I/O 1.2V -7 Speed
- LFE3-17EA-7FN484C
- Lattice
-
1:
¥399.0256
-
56预期 2027/4/12
|
Mouser 零件编号
842-LFE3-17EA7FN484C
|
Lattice
|
FPGA - 现场可编程门阵列 17.3K LUTs 222 I/O 1.2V -7 Speed
|
|
56预期 2027/4/12
|
|
最低: 1
倍数: 1
|
|
|
LFE3
|
17000 LE
|
8500 ALM
|
700 kbit
|
222 I/O
|
1.14 V
|
1.26 V
|
0 C
|
+ 85 C
|
3.2 Gb/s
|
|
SMD/SMT
|
FPBGA-484
|
|
Tray
|
|