congatec 热管理产品

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选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS
congatec 散热片 Standard heatspreader for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are M2.5x0.45p threaded.
congatec CPU与芯片冷却器 Passive cooling for Pico ITX module conga-PA7*For CPUs with standard silicone die*Four stand-offs M2.5 threaded
congatec CPU与芯片冷却器 Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are M2.5 threaded
JUMPtec 散热片 HSP COMe-mEL10 (E2) THROUGH
JUMPtec 散热片 HSP COMe-mEL10 (E2) SLIM THREAD
JUMPtec 散热片 HSP COMe-mEL10 (E2) SLIM THROUGH
JUMPtec 散热片 HSP COMe-cSL6, thread
JUMPtec 散热片 HSP COMe-cEL6 (E2) THREAD
JUMPtec 散热片 HSP COMe-cEL6 (E2) THROUGH
JUMPtec CPU与芯片冷却器 HSP COMe-cAP6 Cu-core through
JUMPtec CPU与芯片冷却器 COMe Passive Uni Cooler2 slim (w/o HSP)
JUMPtec CPU与芯片冷却器 COMe Passive Uni Cooler2 (w/o HSP)
JUMPtec CPU与芯片冷却器 HSP COMe-bV26 Cu-core threaded
JUMPtec CPU与芯片冷却器 HSP COMe-bV26 Cu-core through
JUMPtec CPU与芯片冷却器 HSP COMe-bTL6 Cu-core threaded
JUMPtec CPU与芯片冷却器 HSP COMe-bTL6 Cu-core through
JUMPtec 散热片 HSP SMARC-sXAL
JUMPtec 散热片 HSP SMARC-sAMX8X
JUMPtec 散热片 HSP SMARC-sXEL
JUMPtec 散热片 HSP COMe-bDV7 (E2) thread
JUMPtec CPU与芯片冷却器 HSP COMe-bID7 (E2) Cu-core threaded
JUMPtec CPU与芯片冷却器 HSP COMe-bID7 (E2) Cu-core through
JUMPtec 散热片 COMh-caAP/RP Heat Spreader threaded
JUMPtec 散热片 COMh-caAP/RP Heat Spreader through
JUMPtec CPU与芯片冷却器 COMh Size D Active Uni Cooler (w/o HSP)