conga-HPC/mPTL COM-HPC Mini Module

congatec conga-HPC/mPTL COM-HPC Mini Module is based on an Intel® Core™ Ultra Processor Series 3 (Panther Lake-H) to deliver extreme performance and I/O bandwidth. This computer-on-module (COM) has been developed for designs that optimize size, weight, power, and cost (SWaP-C). With up to 180 TOPS of energy-efficient embedded computing performance, the conga-HPC/mPTL is suitable for AI-intensive markets, both for new designs and for upgrades to existing systems. This congatec conga-HPC/mPTL COM-HPC Mini Module operates in an extended industrial temperature range of -40°C to +85°C. Typical applications include industrial automation, robotics, retail point-of-sale (POS), and medical.

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congatec conga-HPC/mPTL-CSA-B
congatec CPU与芯片冷却器 Standard active cooling solution for COM-HPC module conga-HPC/mPTL with 24.8mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
数据表
congatec conga-HPC/mPTL-CSA-T
congatec CPU与芯片冷却器 Standard active cooling solution for COM-HPC module conga-HPC/mPTL with 24.8mm overall heat sink height and integrated 12V fan. All standoffs are M2.5 threaded.
数据表
congatec conga-HPC/mPTL-CSP-B
congatec CPU与芯片冷却器 Standard passive cooling solution for COM-HPC module conga-HPC/mPTL with 24mm overall heat sink height. All standoffs are with 2.7mm bore hole.
数据表
congatec conga-HPC/mPTL-CSP-T
congatec CPU与芯片冷却器 Standard passive cooling solution for COM-HPC module conga-HPC/mPTL with 24mm overall heat sink height. All standoffs are M2.5 threaded.
数据表
congatec conga-HPC/mPTL-HSP-B
congatec 散热片 Standard heatspreader for COM-HPC module conga-HPC/mPTL. All standoffs are with 2.7mm bore hole.
数据表
congatec conga-HPC/mPTL-HSP-T
congatec 散热片 Standard heatspreader for COM-HPC module conga-HPC/mPTL. All standoffs are M2.5 threaded.
数据表