SPA2000-0.015-AC-52

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Mouser编号：

951-SPA20000.015AC52

制造商编号：

SPA2000-0.015-AC-52

制造商：

Bergquist Company

说明：

导热接口产品 Insulator, 0.015" Thickness, 1 Side Adhesive, Sil-Pad TSPA3000/A2000

此产品将直接从制造商发送给您。您可立即订购此产品。 Mouser 将通知您估计的发货日期。

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数据表:

SPA2000-0.015-AC-52 数据表 (PDF)

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产品属性	属性值	选择属性
制造商:	Bergquist Company
产品种类:	导热接口产品
交货限制:	Mouser 目前在您所在地区不销售该产品。
RoHS:
产品:	Thermally Conductive Insulators
封装 / 箱体:	Non-standard
材料:	Silicone Elastomer
击穿电压:	4 kVAC
颜色:	White
最小工作温度:	- 60 C
最大工作温度:	+ 200 C
厚度:	0.015 in
可燃性等级:	UL 94 V-0
系列:	A2000 / TSP A3000
商标:	Bergquist Company
产品类型:	Thermal Interface Products
工厂包装数量:	1
子类别:	Thermal Management
商标名:	Sil-Pad

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Shelf Life on this Product: Silicone Adhesives: Six (6) months from date of manufacture when stored in original packaging at 70 Degrees Farhenheit (21 Degrees Celsius) and 50 percent relative humidity.
Please contact a Mouser Technical Service Representative for further assistance.
5-1120-5

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合规代码

USHTS:: 8541600060

原产地分类

原产国:: 不可用
组装原产国/地区:: 不可用
扩散国家:: 不可用

发货时，国家/地区可能会发生变化。

TSP A3000 High Performance SIL PAD®

Bergquist Company TSP A3000 High-Performance SIL PAD^® are conformable elastomers with ultra-high 3W/m.K thermal conductivity that acts as a thermal interface between electrical components and heat sinks. These inductors are designed for applications where optimal heat transfer is required. These thermally conductive silicone elastomers offer a thermal impedance of 0.32°C-in²/W (at 50psi). They are formulated to maximize the thermal and dielectric performance of the filler/binder matrix. This results in a grease-free, conformable material capable of meeting or exceeding the thermal and electrical requirements of high-reliability electronic packaging applications. Bergquist Company SIL PAD TSP A3000 High-Reliability Insulators are ideal for use in motor drive controls, avionics applications, high-voltage power supplies, and power transistor/heat sink interfaces.

Thermal SIL PAD® Materials

Bergquist Company Thermal SIL PAD^® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The Bergquist SIL PAD materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible. The SIL PAD materials feature reinforcements to resist cut-through, a wide range of thermal conductivities and dielectric strengths, and excellent thermal performance with minimized thermal resistance. These cost-effective materials are resistant to electrical shorting and enhance performance for high-heat compacted assemblies.