Enter Title

Play Video
Video • Topic Overview

New paths to performance

Explore the emerging technologies that continue to advance computing beyond traditional scaling.

Robot precisely moving around some machinery
Podcast • The Tech Between Us

Innovation at the edge of scale

Explore what comes after Moore's Law as the industry seeks new paths to computing performance.

Listen In

Host: Raymond Yin Mouser Director of Technical Content

For over a decade, Raymond Yin has worked at Mouser as its resident Director of Technical Content. During his tenure, he has collaborated with many manufacturer brands, industry leaders and technology experts to develop the latest content on technology and applications. Managing and expanding Mouser's portfolio of content for new product introductions and technology trends, Raymond stays immersed in the electronic component industry and well-versed in the latest industry developments impacting Mouser's customers.

Earning his Bachelor of Science degree in Electrical Engineering from Southern Methodist University in 1986, Raymond's 20 plus years in the electronics distribution industry, and 7 years as a design engineer, has given him a deep understanding of the capabilities of the latest components as well as the companies that produce them.

Guest: Maurice (Mo) Steinman Senior VP and General Manager, US at Lightelligence

Maurice (Mo) Steinman is a Senior Vice President and US General Manager at Lightelligence. He has enjoyed a forty-year career in the semiconductor industry, working for such companies as Digital, Compaq, HP, Intel and AMD, where he held the title of Senior Fellow before joining Lightelligence in 2018. A veteran of many successful tape outs and product introductions, Steinman has expertise in SoC architecture, SoC interconnect, memory subsystems, and energy management. He graduated from Rensselaer Polytechnic Institute (RPI) with a Bachelor of Science degree in Computer and Systems Engineering and is named as an inventor on over fifty US patents.

3D stacked chip

Next-gen innovation

There is no single path forward. Performance will advance through multiple approaches that work together.

3D architectures

Stacking chips vertically brings components closer together - boosting performance and efficiency.

Engineering consideration

As more layers are added, heat dissipation and manufacturing precision become increasingly difficult.

Chiplets

Next-gen innovation

There is no single path forward. Performance will advance through multiple approaches that work together.

Chiplets & modular design

Smaller, specialized chiplets improve flexibility, performance, and manufacturing yield. This approach allows designers to optimize and scale systems.

Engineering consideration

Maintaining fast, reliable communication between chiplets adds integration complexity and increases packaging demands.

Specialized processors

Next-gen innovation

There is no single path forward. Performance will advance through multiple approaches that work together.

Specialized processors

Custom silicon focuses on specific workloads and delivers higher efficiency with hardware designated for each specific task.

Engineering consideration

Specialized architectures may deliver exceptional performance for targeted tasks, but are less adaptable across broader applications.

Silicon photonics

Next-gen innovation

There is no single path forward. Performance will advance through multiple approaches that work together.

Silicon photonics

Using light instead of electrons could reduce heat and enable faster data transfer between components. This could significantly increase speed while reducing energy loss.

Engineering consideration

Photonics requires new manufacturing approaches and infrastructure that are still evolving across the semiconductor industry.

Explore the next phase of computing

3D architecture of a chip

3D architectures

Stacking chips vertically brings components closer together - boosting performance and efficiency.

Engineering consideration

As more layers are added, heat dissipation and manufacturing precision become increasingly difficult.

Modular chiplets on a chip

Chiplets & modular design

Smaller, specialized chiplets improve flexibility, performance, and manufacturing yield. This approach allows designers to optimize and scale systems.

Engineering consideration

Maintaining fast, reliable communication between chiplets adds integration complexity and increases packaging demands.

Specialized processors on a chip

Specialized processors

Custom silicon focuses on specific workloads and delivers higher efficiency with hardware designated for each specific task.

Engineering consideration

Specialized architectures may deliver exceptional performance for targeted tasks, but are less adaptable across broader applications.

Silicon photonics on a chip

Silicon photonics

Using light instead of electrons could reduce heat and enable faster data transfer between components. This could significantly increase speed while reducing energy loss.

Engineering consideration

Photonics requires new manufacturing approaches and infrastructure that are still evolving across the semiconductor industry.

Unlock More! Subscribe for access to exclusive content — podcasts, videos, articles, reference guides, and more.
Subscribe
Close up of a chip on a board
Article

Rethinking Moore's Law in Modern Semiconductor Design

Chiplets, advanced packaging, GAA transistors, and system-level design drive performance.

Read More
Person handling small components
Use Case

Beyond Moore's law: algorithms and design drive performance

Improving compute performance through software.

Discover More
Robot working on manufacturing
Subscriber-Only

Advanced manufacturing at nanometer scales

Explore lithography, transistor architectures, and innovations in chip fabrication.

Subscribe
Connections between computers
Subscriber-Only

Silicon photonics and faster compute systems

Optical connections improve data movement, bandwidth, and energy efficiency.

Subscribe