EPC EPC23108 & EPC23109 100V 35A ePower™ Stage ICs

Efficient Power Conversion (EPC) EPC23108 and EPC23109 100V 35A ePower™ Stage Integrated Circuits (ICs) feature integrated high-side and low-side eGaN® FETs with an internal gate driver and level shifter. These ICs offer 35A continuous power-stage load current, 100V absolute maximum input voltage, and 5V nominal bias supply voltage in a 3.5mm x 5mm package. The thermally enhanced QFN package has an exposed top for low thermal resistance from the junction to the top-side heatsink. The EPC23108 and EPC23109 series are both designed using EPC's proprietary GaN® IC technology. The result is a power-stage IC that translates logic-level control signals into a high-voltage and high-current power stage, which is more efficient to operate while being smaller in size, simpler to design, and easier to manufacture.

Features

  • Integrated high-side and low-side eGaN FET with internal gate driver and level shifter
  • Independent high-side and low-side control inputs
  • Logic lockout commands both FETs off when inputs are both high at same time
  • External resistors to tune SW switching times
  • Robust level shifter operation for hard and soft switching conditions
  • Synchronous charging for high-side bootstrap supplies
  • Standby function for low quiescent current mode
  • Fast PWM shutdown when (SD/STB) pulled low
  • Power-on-reset for low-side and high-side power supplies
  • Power stage high impedance guaranteed in absence of VDRV/VBOOT supplies
  • 0% and 100% duty capable

Applications

  • Motor drive inverters
  • Buck, boost, and buck-boost converters
  • Half-bridge, full-bridge LLC converters
  • Class D audio amplifiers

Specifications

  • 35A continuous power stage load current TJ = +25°C
  • 3MHz maximum operating PWM frequency
  • 100V absolute maximum input voltage
  • 80V operating input voltage range
  • 5V nominal bias supply voltage
  • 5.2mΩ + 5.2mΩ typical RDS(on)
  • 3.3V or 5V CMOS input logic levels
  • Thermally enhanced QFN package with exposed top for low thermal resistance from junction to top-side heatsink
  • 3.5mm x 5mm package size

Typical Application

Application Circuit Diagram - EPC EPC23108 & EPC23109 100V 35A ePower™ Stage ICs
发布日期: 2026-05-26 | 更新日期: 2026-09-22