EPC EPC23108 & EPC23109 100V 35A ePower™ Stage ICs
Efficient Power Conversion (EPC) EPC23108 and EPC23109 100V 35A ePower™ Stage Integrated Circuits (ICs) feature integrated high-side and low-side eGaN® FETs with an internal gate driver and level shifter. These ICs offer 35A continuous power-stage load current, 100V absolute maximum input voltage, and 5V nominal bias supply voltage in a 3.5mm x 5mm package. The thermally enhanced QFN package has an exposed top for low thermal resistance from the junction to the top-side heatsink. The EPC23108 and EPC23109 series are both designed using EPC's proprietary GaN® IC technology. The result is a power-stage IC that translates logic-level control signals into a high-voltage and high-current power stage, which is more efficient to operate while being smaller in size, simpler to design, and easier to manufacture.
Features
- Integrated high-side and low-side eGaN FET with internal gate driver and level shifter
- Independent high-side and low-side control inputs
- Logic lockout commands both FETs off when inputs are both high at same time
- External resistors to tune SW switching times
- Robust level shifter operation for hard and soft switching conditions
- Synchronous charging for high-side bootstrap supplies
- Standby function for low quiescent current mode
- Fast PWM shutdown when (SD/STB) pulled low
- Power-on-reset for low-side and high-side power supplies
- Power stage high impedance guaranteed in absence of VDRV/VBOOT supplies
- 0% and 100% duty capable
Applications
- Motor drive inverters
- Buck, boost, and buck-boost converters
- Half-bridge, full-bridge LLC converters
- Class D audio amplifiers
Specifications
- 35A continuous power stage load current TJ = +25°C
- 3MHz maximum operating PWM frequency
- 100V absolute maximum input voltage
- 80V operating input voltage range
- 5V nominal bias supply voltage
- 5.2mΩ + 5.2mΩ typical RDS(on)
- 3.3V or 5V CMOS input logic levels
- Thermally enhanced QFN package with exposed top for low thermal resistance from junction to top-side heatsink
- 3.5mm x 5mm package size
Typical Application
