新款插座和适配器
Chip Quik DFN-6 to DIP-6/10 SMT Adapters are built on FR-4 material and include surface-mount male vertical headers, wire wrap, or machine pins. These adapters are designed with a top-side footprint for surface-mount components, while the bottom side includes pads for two single-row surface-mount vertical headers. The SMT adapters offer a UL 94V-0 flammability rating and comply with IPC-A-610 Class II standards. These adapters operate from -40°C to +130°C temperature range and withstand a maximum reflow temperature of +260°C. The SMT adapters are lead-free and are RoHS compliant. These adapters feature a PCB size of 25.4mm x 7.62mm x 1.6mm (IPC0272) and 25.4mm x 12.7mm x 1.6mm (IPC0273).
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Chip Quik DFN-6 to DIP-6/10 SMT AdaptersConstructed using FR-4 material and offer a UL 94V-0 flammability rating.2026/8/3
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Chip Quik Extra-Narrow SMT-to-DIP AdaptersDesigned to replace obsolete DIP ICs with newer surface-mount components.2026/7/29 -
NXP Semiconductors KITPF09FRDMPGM编程板开发插座板，采用PF09 9通道电源管理IC (PMIC)。2026/4/10 -
Grinn AstraADA-1680 Core Module AdapterIntegrates the AstraSOM‑1680 with the Synaptics Astra Machina Foundation Series demo board.2026/4/7 -
Renesas Electronics ForgeFPGA™插座卡开发套件实现ForgeFPGA™引脚与Go Configure开发板之间的连接。2026/1/19 -
Trenz Electronic CR00240-01-A CRUVI HDMI AdapterIncludes a high-speed level shifter and is based on active DDC Puffer PTN3363BSMP.2025/11/13 -
FRAMOS FPA-4.A/AGX-Kit Processor Adapter KitConnects FSM:GO and the FSM Ecosystem to the NVIDIA Jetson AGX family.2025/1/30 -
FRAMOS FPA-A/P22-Kit Processor Adapter KitConnects FSM:GO and the FSM Ecosystem to the NVIDIA Jetson Orin Nano/NX Devices and Raspberry Pi 5.2025/1/30 -
FRAMOS FPA-A/NDK-Kit Processor Adapter KitConnects FSM:GO and the FSM Ecosystem to the NXP i.MX8M Plus Developer Kit.2025/1/30 -
FRAMOS FSM:FSA Embedded Image Sensor EcosystemEvaluation and customization with dual-board sensor modules.2025/1/29 -
FRAMOS FPA-A/P24-Kit Processor Adapter KitConnects FSM:GO and the FSM Ecosystem to the Toradex Verdin, Mallow, and Dahlia carrier boards.2025/1/28 -
Renesas Electronics GreenPAK™ SLG4752x混合信号矩阵设计用于在各种应用中实现高效混合信号功能。2024/10/21 -
Microchip Technology EV88N31A适配器板设计用于评估AVR16EB32-CNANO MPPB适配器。2024/7/23 -
Chip Quik Socket to DIP AdaptersAvailable in MSOP to DIP, QFN to DIP, and SOIC to DIP configurations.2024/5/31 -
Chip Quik DIP600 SOIC AdaptersFeature-wide and narrow-bodied adapters are available in 8 to 28 Dual In-Line Package (DIP) range.2024/5/14 -
Microchip Technology AC69T88A 5“ LVDS WVGA LCD显示模块套件通过电容式触摸传感器增强MPU Curiosity板。2023/11/5 -
ProGrAnalog X-Pod for Xilinx Power Test AdaptorForm Factor Equivalent Device (FFED) for testing AMD Xilinx Versal ACAP VC1902-VSVA2197 FPGAs.2023/10/9 -
ProGrAnalog FFED-VC1902-VSVA2197 AMD Xilinx Power Test AdaptorOffers rapid testing to validate power delivery solutions.2023/10/9 -
ProGrAnalog LSP-Kit-OracADJ-X Kit for XilinxPowered through a 24V barrel jack and connected via a Mini-B USB.2023/10/5 -
Chip Quik Dual Row AdaptersInclude DIP-08 Adapters to dual row 0.35mm pitch stencils to compact series adapters.2023/8/16 -
ProGrAnalog Xilinx功率检测适配器设计具有支持瞬态、脉冲序列、阻抗和3D绘图的GUI。2023/3/20 -
TE Connectivity LGA 4677插座设计用于满足高带宽需求，可提供PCIe（第5代）和DDR5 8通道支持。2023/1/10 -
Renesas Electronics SLG47115V-SKT插座板使用户能够使用SLG4DVKADV开发板配置SLG47115V HVPAK™设备 。2022/9/15