Wakefield Thermal On-Chip Liquid Cold Plates
Wakefield Thermal On-Chip Liquid Cold Plates support Intel Xeon® processors and provide direct liquid cooling for high-power server CPUs in AI, HPC, and hyperscale data center environments. The solution targets Intel Eagle Stream platforms and supports 4th and 5th Gen Intel Xeon Scalable processors, helping manage demanding thermal loads in dense compute racks. The Wakefield Thermal cold plates use an aluminum body with nickel plating and a vacuum-brazed construction. The design supports CPUs up to 700W TDP and delivers 0.0267°C/W thermal resistance under the listed test conditions, supporting sustained performance where air cooling may limit rack density. Wakefield Thermal On-Chip Liquid Cold Plates use Ø10mm OD hose barb inlet and outlet ports, Intel version 2 EGS fasteners, and a recommended 50/50 coolant. The cold plate operates over a recommended -40°C to +100°C temperature range and supports a recommended flow rate of 0LPM to 3.5LPM for server cooling loops.
Features
- Direct on-chip liquid cooling for Intel Eagle Stream platforms
- Support for 4th and 5th Gen Intel Xeon Scalable processors
- Low 0.0267°C/W thermal resistance for sustained processor performance
- Cooling support for high-power CPUs up to 700W TDP
- Higher rack density support for AI and HPC workloads
- Nickel-plated aluminum body with vacuum-brazed construction
- Intel version 2 EGS fastener attachment method
Applications
- AI data centers
- Hyperscale data centers
- High-performance computing workloads
Specifications
- 117.5mm x 77.5mm x 26mm overall size
- Ø10mm OD hose barb inlet and outlet ports
- 700W CPU power test parameter
- +25°C ambient temperature test parameter
- +45°C inlet water temperature test parameter
- 0.6MPa maximum operating pressure
- 1.6LPM flow-rate test parameter
- 50/50 coolant recommended fluid type
- -40°C to +100°C recommended operating temperature range
- 0LPM to 3.5LPM recommended flow-rate range
Thermal Resistance vs. Flowrate
Pressure Drop vs. Flowrate
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