ATS-59007-C1-R0

Advanced Thermal Solutions
984-ATS-59007-C1-R0
ATS-59007-C1-R0

制造商：

说明：
散热片 maxiGRIP Heat Sink Assembly, Black-Anodized, T766, 35mm Comp, 35x46x16mm

数据表:
ECAD模型:
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库存量: 100

库存：
100 可立即发货
生产周期：
13 周 大于所示数量的预计工厂生产时间。
数量大于100的订购须受最低订购要求的限制。
最少： 1   倍数： 1
单价:
¥-.--
总价:
¥-.--
预估关税:

定价 (含13% 增值税)

数量 单价
总价
¥189.7496 ¥189.75
¥167.918 ¥1,679.18
¥159.895 ¥3,197.90
¥154.0981 ¥7,704.91
¥150.7872 ¥15,078.72
¥140.0409 ¥28,008.18
¥136.3119 ¥68,155.95

产品属性 属性值 选择属性
Advanced Thermal Solutions
产品种类: 散热片
RoHS:  
Heat Sink Assemblies
BGA
Snap On
Aluminum
Angled Fin
2.42 C/W
46 mm
35 mm
16 mm
商标: Advanced Thermal Solutions
颜色: Black
封装: Bulk
产品类型: Heat Sinks
系列: maxiGRIP HS ASM - Custom
工厂包装数量: 100
子类别: Heat Sinks
商标名: maxiFLOW maxiGRIP
类型: Component
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已选择的属性: 0

数据表

Test/Quality Data

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CNHTS:
7616991090
CAHTS:
8542900000
USHTS:
8542900000
JPHTS:
854290000
TARIC:
8542900000
MXHTS:
8542900100
ECCN:
EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. This heat sink design provides high thermal performance for the physical volume that they occupy as compared to other heat sink designs. The maxiFLOW heat sinks feature three attachment methods: maxiGRIP™, thermal tape, or push pin. The maxiGRIP™ heat sink attachment applies steady, even pressure to the component and does not require holes in the PCB. The thermal tape mounts the heat sink using a thermally conductive adhesive strip, while the push pin attachment requires holes in the PCB to anchor the heat sink. 

BGA High-Performance Heat Sinks for NXP

Advanced Thermal Solutions, Inc. (ATS) BGA High-Performance Heat Sinks are designed for NXP MPC flip-chip processors. The BGA heat sinks feature the maxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heat sink comes pre-assembled with a high-performance phase change thermal interface material for ease of installation.

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