新款半导体
Navitas Semiconductor 3300V and 2300V Silicon Carbide (SiC) MOSFETs are based on the latest GeneSiC™ trench-assisted planar (TAP) technology and feature flexible packaging formats, including power module, discrete, and known good die (KGD). For high-power density and high-reliability systems, the MOSFETs are integrated into an advanced SiCPAK™ G+ power module package, in half-bridge and full-bridge circuit configurations. The proprietary TAP SiC MOSFET technology offers improved performance, reliability, and avalanche robustness. The TAP architecture performs a multi-step e-field management profile to significantly reduce voltage stress and improve voltage blocking capabilities compared to trench and traditional-planar SiC MOSFETs. Navitas 3300V and 2300V SiC MOSFETs are ideal for AI data centers, grid and energy infrastructure, and industrial electrification, including energy storage, renewable, and megawatt-scale fast-charging applications.
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Navitas Semiconductor 3300V & 2300V Silicon Carbide (SiC) MOSFETsBased on latest GeneSiC™ trench-assisted planar (TAP) technology, offers flexible packaging formats.2026/6/18
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Quectel FGA66X Wi-Fi 6, BLE 5.4 & IEEE 802.15.4 ModulesHigh-performance module in an LGA package and supports the IEEE 802.11ax standard protocol.2026/6/17 -
Ezurio Veda™ IF913 Development KitDesigned for the evaluation of the Veda™ IF913 Wi-Fi® 6E + Bluetooth® LE 5.4 modules.2026/6/17 -
Diodes Incorporated PI6CG33A06 6-Output PCIe® Clock GeneratorAn ultra-low jitter clock generator designed to meet the demands of the PCIe 7.0 specification.2026/6/16 -
Mikroe IR Sense 7 ClickNon-contact IR temperature sensing for precision thermal monitoring systems.2026/6/15 -
Alif Semiconductor DK-8 Ensemble E8 Development KitBrings all device signals to easily accessible pins for power & performance profiling, prototyping.2026/6/15 -
Mikroe Pressure 25 ClickHigh-res pressure & temperature sensing for barometers & nav systems based on the PSD0401120 sensor.2026/6/15 -
Mikroe HVAC 2 ClickIndoor air quality monitoring for smart HVAC and connected building systems.2026/6/15 -
Microchip Technology PIC18F-Q35 微控制器可扩展8位MCU平台，适用于需要灵活外设集成的嵌入式设计。2026/6/12 -
Microchip Technology PIC18F56Q35 Curiosity Nano评估套件为PIC18F56Q35 MCU提供紧凑型原型设计、板载调试和快速CLB访问。2026/6/12 -
Infineon Technologies EasyPACK™ S模块紧凑型、易于集成的封装设计，适用于现代电源设计，可实现高效电源转换。2026/6/12 -
Infineon Technologies CYT6BJ TRAVEO™ T2G 32位汽车MCU用于汽车车身电子设备，具有强大的处理能力和可靠的网络连接性2026/6/12 -
Xsens Sirius RTK GNSS/INS Development KitsDesigned for centimeter-level positioning and orientation in the most challenging environments.2026/6/12 -
STMicroelectronics EVLSTGAP3S3IF半桥评估板该评估板用于评估STGAP3S3IF隔离式单通道栅极驱动器。2026/6/12 -
STMicroelectronics EVLSTGAP3S3S半桥评估板该评估板用于评估STGAP3S3S隔离式单通道栅极驱动器。2026/6/12 -
u-blox EVK-ANNA-B5 评估套件ANNA-B5独立蓝牙®低功耗模块评估套件。2026/6/12 -
Particle Muon Developer KitCombines the M404MEA M-SoM & MUONCB board in a dev platform designed for easy prototyping.2026/6/12 -
Diodes Incorporated PI3DPX1225AZLBEX ReDriver13.5Gbps USB Type-C® DP2.1/USB3 6:4 crossbar linear redriver with low equalizer option.2026/6/10 -
Diodes Incorporated AP22975AQ Power Switch ICsSingle-channel 6V/6A low RON load switches with adjustable soft-start.2026/6/10 -
Diodes Incorporated APK43070Q单片同步降压控制器集成有USB Type‑C® 电源传输 (PD3.1) 源控制器。2026/6/9 -
Nexperia NPS3005A单通道负载开关工作输入电压范围为0.5V至5.5V，并配有可调节的软起动功能。2026/6/9 -
Nexperia NEVB-NPS3005A/NEVB-NPS3005B 评估板专用印刷电路板（PCB），带有NPS3005A或NPS3005B、负载开关IC。2026/6/9 -
Espressif Systems ESP32-P4X-EYE Vision Development BoardThis development board is based on the ESP32-P4 chip and mainly targets camera applications.2026/6/5 -
M5Stack Atom-Matrix v1.1 IMU SensorImproves attitude detection accuracy and response speed compared to the previous generation.2026/6/5 -
Mikroe 150PD TPS Pressure ClickFeatures the TE Connectivity TPS-150PD-CA1N-00-T low-pressure MEMS pressure sensor.2026/6/4