ATS-KRA-3567-C1-R0

Advanced Thermal Solutions
984-ATS-KRA-3567C1R1
ATS-KRA-3567-C1-R0

制造商:

说明:
散热片 Heat Sink for AMD Xilinx Kria K26 SoM Device, Active, Straight, 54x68x10mm

寿命周期:
新产品:
此制造商的新产品。
ECAD模型:
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库存量: 352

库存:
352 可立即发货
生产周期:
13 周 大于所示数量的预计工厂生产时间。
最少: 1   倍数: 1
单价:
¥-.--
总价:
¥-.--
预估关税:

定价 (含13% 增值税)

数量 单价
总价
¥296.625 ¥296.63
¥243.7636 ¥2,437.64
¥223.2541 ¥4,465.08
¥211.5925 ¥10,579.63

产品属性 属性值 选择属性
Advanced Thermal Solutions
产品种类: 散热片
RoHS:  
BGA Heat Sink
54 mm
68 mm
20 mm
商标: Advanced Thermal Solutions
封装: Tray
产品类型: Heat Sinks
系列: ATS-KR
工厂包装数量: 100
子类别: Heat Sinks
商标名: AMD Xilinx Kria
单位重量: 45 g
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已选择的属性: 0

CNHTS:
8548000090
CAHTS:
8473309000
USHTS:
8473305100
JPHTS:
847330090
MXHTS:
8473300499
ECCN:
EAR99

Heat Sinks for AMD Kria™ K26 SOMs

Advanced Thermal Solutions Heat Sinks for AMD Kria™ K26 SOMs are designed to fit the K26 System-On-Module (SOM). These heatsinks are engineered to mount seamlessly to the K26 SOM’s standard heat spreader plate. These heat sinks include high-performance Thermal Interface Material (TIM) and necessary hardware and maximize heat dissipation to keep the device below critical thermal thresholds. These modules are used with AMD’s two starter kits (Robotics and Vision AI). Typical applications include robotics, industrial communications and control, retail analytics, security, smart cameras, and machine vision.