ATS-UC-DFLOW-VC-200

Advanced Thermal Solutions
984-ATS-UCDFLOWVC200
ATS-UC-DFLOW-VC-200

制造商:

说明:
散热片 Ultra Cool DualFLOW Heat Sink, 1U, Vapor Chamber

ECAD模型:
下载免费库加载程序,将此文件转换,以供您的ECAD工具使用。了解详情。

库存量: 4

库存:
4 可立即发货
生产周期:
13 周 大于所示数量的预计工厂生产时间。
数量大于4的订购须受最低订购要求的限制。
最少: 1   倍数: 1
单价:
¥-.--
总价:
¥-.--
预估关税:

定价 (含13% 增值税)

数量 单价
总价
¥1,578.4744 ¥1,578.47

产品属性 属性值 选择属性
Advanced Thermal Solutions
产品种类: 散热片
RoHS:  
Heat Sinks
LGA2011, LGA2066
Screw
0.2 C/W
92.38 mm
92.11 mm
29 mm
商标: Advanced Thermal Solutions
封装: Bulk
产品类型: Heat Sinks
系列: ATS-UC
工厂包装数量: 5
子类别: Heat Sinks
商标名: DualFLOW
类型: Component
单位重量: 479 g
找到的产品:
要显示类似产品,至少选中一个复选框
要显示该类别下的类似产品,请至少选中上方的一个复选框。
已选择的属性: 0

CAHTS:
8473309000
USHTS:
8473305100
JPHTS:
847330090
MXHTS:
8473300499
ECCN:
EAR99

dualFLOW™/quadFLOW™ CPU Coolers for Servers

Advanced Thermal Solutions dualFLOW™/quadFLOW™ CPU Coolers for Servers are designed for 1U and 2U applications where space and airflow are restricted. These heat sinks have a Pulse Width Modulation-enabled blower with 10.8VDC to 13.2VDC operating voltage. A vapor chamber base option improves heat spreading when the heat source is small or not uniform while an optional standard backing plate accommodates the cooling of any high-powered device. ATS dualFLOW/quadFLOW CPU Coolers offer at least 20% improvement over comparable products on the market. These devices have a nickel-plated finish.