ATS012012025-MF-2X

Advanced Thermal Solutions
984-ATS012012025MF2X
ATS012012025-MF-2X

制造商:

说明:
散热片 maxiFLOW BGA Heat Sink, High Aspect Ratio, Slant Fin, No TIM, 12x12x25mm

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库存量: 83

库存:
83 可立即发货
生产周期:
13 周 大于所示数量的预计工厂生产时间。
最少: 1   倍数: 1
单价:
¥-.--
总价:
¥-.--
预估关税:

定价 (含13% 增值税)

数量 单价
总价
¥75.823 ¥75.82
¥67.2237 ¥672.24
¥64.0145 ¥1,280.29
¥62.9636 ¥3,148.18
¥59.0651 ¥5,906.51
¥56.0141 ¥11,202.82
¥54.5451 ¥27,272.55
¥52.545 ¥52,545.00
2,000 报价

产品属性 属性值 选择属性
Advanced Thermal Solutions
产品种类: 散热片
RoHS:  
Heat Sinks
maxiFLOW BGA
PCB
Aluminum
Slanted Vane
9.03 C/W
12 mm
12 mm
25 mm
商标: Advanced Thermal Solutions
颜色: Black
封装: Bulk
产品类型: Heat Sinks
系列: BGA High Aspect Ratio
工厂包装数量: 100
子类别: Heat Sinks
商标名: Value-Line Platform/maxiFLOW
类型: Component
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CAHTS:
8542900000
USHTS:
8542900000
JPHTS:
854290000
TARIC:
8542900000
MXHTS:
8542900100
ECCN:
EAR99

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.

Slant Fin Value-Line Heat Sinks

Advanced Thermal Solutions Slant Fin Value-Line Heat Sinks are fabricated from extruded aluminum to minimize thermal resistance from the base to the fins. This method reduces weight and keeps the cost low. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm, and height ranges from 2mm to 25mm with 1mm increments. The slant fin design offers additional surface area and, as a result, superior performance for applications that can accommodate larger fin-to-fin spacing. These slant fin value-line heat sinks can be attached to the devices with double-sided thermal adhesives, Z-clip, or maxiGRIP™ technologies. The higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks.