TGP 40000SF-0.080-00-0606

Bergquist Company
951-TGP400SF.0800066
TGP 40000SF-0.080-00-0606

制造商:

说明:
导热接口产品 GAP PAD, Sil-Free, 40W/m-K, 6x6" Sheet, 0.080" Thickness, Thermexit, IDH 2972781

寿命周期:
新产品:
此制造商的新产品。
ECAD模型:
下载免费库加载程序,将此文件转换,以供您的ECAD工具使用。了解详情。

库存量: 19

库存:
19 可立即发货
生产周期:
5 周 大于所示数量的预计工厂生产时间。
最少: 1   倍数: 1
单价:
¥-.--
总价:
¥-.--
预估关税:

定价 (含13% 增值税)

数量 单价
总价
¥2,177.8942 ¥2,177.89
¥1,971.0138 ¥19,710.14
¥1,834.8262 ¥45,870.66
¥1,810.599 ¥90,529.95
100 报价

产品属性 属性值 选择属性
Bergquist Company
产品种类: 导热接口产品
RoHS:  
Gap Fillers / Gap Pads / Sheets
Thermal Pad
Non-standard
Silicone-Free Polymer
40 W/m-K
Black
- 40 C
+ 150 C
152.4 mm
152.4 mm
2.032 mm
TGP 40000SF
商标: Bergquist Company
设计目的: Silcone Sensitive Applications, Telecommunications, Optical, ASICs/DSPs, Storage, Automotive, Power Converters, Aerospace, LEDs and Lasers
产品类型: Thermal Interface Products
大小: 6 in x 6 in
工厂包装数量: 500
子类别: Thermal Management
商标名: GAP PAD / Thermexit
零件号别名: TGP 40000SF-0.080-00-0606-NA 2972781
单位重量: 46 g
找到的产品:
要显示类似产品,至少选中一个复选框
要显示该类别下的类似产品,请至少选中上方的一个复选框。
已选择的属性: 0

CAHTS:
3920990000
USHTS:
3920995000
ECCN:
EAR99

TGP 40000SF 40W/m-K Silicone Free GAP PAD®

Bergquist TGP 40000SF 40W/m-K Silicone Free GAP PAD® features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity. The GAP PAD thermal interface products, formerly known as Thermexit, are uniquely designed for thermal management applications requiring silicone-free solutions. Due to its oriented filler technology, the TGP 40000SF series delivers excellent thermal performance at 56psi peak pressure. The GAP PAD products offer a higher thermal conductivity rating than previous thermal interface materials (TIMs) with easier handling, lower density, and a more lightweight sheet thickness. The TGP 40000SF 40W/m-K GAP PAD polymer construction allows low liquid migration without silicone outgassing or mobile polymer bleed, and these models include tack on one side. Bergquist TGP 40000SF 40W/m-K Silicone Free GAP PAD products are ideal for various applications, including telecommunications, automotive modules, and aerospace modules.