627-11W1224-1N1

EDAC
587-627-11W1224-1N1
627-11W1224-1N1

制造商：

说明：
D-Sub混合触点连接器 627 Series vertical Combo' D-Sub plug connector, 11W1 layout, gold flash plating, PCB tails, nickel plated shell

数据表:
ECAD模型:
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库存量: 249

库存：
249 可立即发货
生产周期：
16 周 大于所示数量的预计工厂生产时间。
最少： 1   倍数： 1
单价:
¥-.--
总价:
¥-.--
预估关税:

定价 (含13% 增值税)

数量 单价
总价
¥56.6582 ¥56.66
¥48.0589 ¥480.59
¥45.0757 ¥1,126.89
¥42.9287 ¥2,146.44
¥38.4652 ¥3,846.52
¥38.2957 ¥9,573.93
¥37.2222 ¥18,611.10
¥34.7362 ¥34,736.20
¥32.5892 ¥81,473.00

产品属性 属性值 选择属性
EDAC
产品种类: D-Sub混合触点连接器
REACH - SVHC:
11W1
11 Position
Through Hole
Vertical
Solder Cup
商标: EDAC
触点材料: Copper
触点电镀: Gold
电流额定值: 10 A
过滤: Unfiltered
型式: Male
绝缘: Insulated
绝缘材料: Thermoplastic Polyester
最大工作温度: + 125 C
最小工作温度: - 55 C
产品类型: Mixed Contact D-Sub Connectors
系列: 627
外壳材质: Steel
外壳电镀: Nickel
工厂包装数量: 1
子类别: D-Sub Connectors
电压额定值: 125 V
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已选择的属性: 0

数据表

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Models

合规代码
USHTS:
8536694040
TARIC:
8536693000
ECCN:
EAR99
原产地分类
原产国:
中国台湾
组装原产国/地区:
不可用
扩散国家:
不可用
发货时，国家/地区可能会发生变化。

Agricultural Technology Interconnect Solutions

EDAC Agricultural Technology (Agritech) Interconnect products offer reliable and durable connector solutions that can withstand harsh agricultural environments, including moisture, dust, and UV radiation exposure. These ruggedized solutions, such as IP67-rated connectors like Inline, D-sub, USB, and HDMI, ensure stable connections for sensor modules and heavy machinery. Increased efficiency, productivity, and yield in agricultural operations are achieved due to this reliability and durability. EDAC Agritech Interconnect Solutions support integrating advanced technologies like IoT and machine learning.

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.

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