MCL2012V1-R082-R

Eaton Electronics
504-MCL2012V1-R082-R
MCL2012V1-R082-R

制造商：

说明：
射频电感器（SMD型） MCL Chip IND 2012 0.082uH 2 Pads

数据表:
ECAD模型:
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供货情况

库存：
无库存
生产周期：
12 周 预计工厂生产时间。
最少： 1   倍数： 1
单价:
¥-.--
总价:
¥-.--
预估关税:

定价 (含13% 增值税)

数量 单价
总价
¥1.7402 ¥1.74
¥0.74467 ¥7.45
¥0.66218 ¥16.55
¥0.57065 ¥57.07
¥0.52093 ¥130.23
¥0.44635 ¥446.35
¥0.34691 ¥867.28
整卷卷轴（请按4000的倍数订购）
¥0.31414 ¥1,256.56
¥0.28928 ¥2,314.24

类似产品

产品属性 属性值 选择属性
Eaton
产品种类: 射频电感器（SMD型）
RoHS:  
82 nH
2 mm
1.2 mm
0.9 mm
MCL
Reel
Cut Tape
商标: Eaton Electronics
外壳代码 - in: 0805
外壳代码 - mm: 2012
安装风格: PCB Mount
产品: RF Inductors
产品类型: RF Inductors - Leaded
工厂包装数量: 4000
子类别: Inductors, Chokes & Coils
端接类型: SMD/SMT
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已选择的属性: 0

数据表

此功能要求启用JavaScript。

CNHTS:
8504500000
USHTS:
8504508000
TARIC:
8504509590
ECCN:
EAR99

5G Applications

Eaton Electronics offers an expansive portfolio of high-reliability components needed to drive 5G forward. Because 5G telecommunication units are typically placed in rugged environments, continuous uptime requirements for their operation and the reliability of the internal electronics are of great importance. A variety of components, often passives, can be readily added in key locations within 5G communications systems to enhance reliability and mitigate subcircuits susceptible to electrostatic discharge (ESD), electromagnetic interference (EMI), and electromagnetic pulse (EMP). Eaton 5G products can withstand harsh environments while delivering high performance.

MCL Multilayer Chip Inductors

Eaton Electronics MCL Multilayer Chip Inductors feature multilayer monolithic construction for high reliability and are suitable for wave and reflow soldering. These inductors are available in three variants: MCL1005, MCL1608V1, and MCL2012V1. The MCL1005 inductors offer high self-resonant frequency (SRF) and a 1nH to 360nH inductance range. The MCL1608V1 inductors operate at a 0.47µH to 12µH inductance range, and the MCL2012V1 inductors have a 0.047uH to 22uH inductance range. Eaton MCL Multilayer Chip Inductors are moisture sensitivity level (MSL) 1. Typical applications include industrial connectivity, wireless communications, wearable devices, broadband components, and RF transceiver modules.

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