HDTM-4-08-1-S-VT-0-2

Samtec
200-HDTM4081SVT02
HDTM-4-08-1-S-VT-0-2

制造商:

说明:
高速/模块连接器 XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

ECAD模型:
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库存量: 12

库存:
12 可立即发货
生产周期:
2 周 大于所示数量的预计工厂生产时间。
最少: 1   倍数: 1
单价:
¥-.--
总价:
¥-.--
预估关税:

定价 (含13% 增值税)

数量 单价
总价
¥110.5931 ¥110.59
¥99.7564 ¥997.56
¥85.1116 ¥2,127.79
¥77.5067 ¥3,875.34
¥73.6195 ¥7,361.95
¥69.0656 ¥17,404.53
¥66.4214 ¥33,476.39

产品属性 属性值 选择属性
Samtec
产品种类: 高速/模块连接器
HDTM
Tray
商标: Samtec
产品类型: High Speed / Modular Connectors
工厂包装数量: 63
子类别: Backplane Connectors
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已选择的属性: 0

合规代码
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99
原产地分类
原产国:
中国
组装原产国/地区:
不可用
扩散国家:
不可用
发货时,国家/地区可能会发生变化。

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options. 

XCede® HD HDTM 1.8mm Vertical Backplane Headers

Samtec XCede® HD HDTM 1.8mm Vertical Backplane Headers feature a 1.8mm column pitch, keying, guidance, and up to 3mm contact wipe on signal pins. These headers consist of three levels of sequencing that enable hot-plugging and are available in 3-, 4-, and 6-pair designs with 4, 6, or 8 columns. Samtech HDTM headers are designed using liquid crystal polymer (LCP) housing material and phosphor bronze contact material. These RoHS-compliant headers operate at -40°C to +105°C temperature range. The XCede HD HDTM vertical backplane headers mate with the XCede HD HDTF right-angle backplane receptacles.