903-23-1-28-2-B-0

Wakefield Thermal
567-903-23-1-28-2-B
903-23-1-28-2-B-0

制造商:

说明:
散热片 Chipset Heat Sink with Clip, Elliptical, 23mm Chip Size, 27.6mm Height, Aluminum

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产品属性 属性值 选择属性
Wakefield Thermal
产品种类: 散热片
发货限制:
 Mouser 目前在您所在地区不销售该产品。
RoHS:  
Heat Sink Assemblies
Component, 23mm
Clip
Aluminum
Omnidirectional Fin
商标: Wakefield Thermal
颜色: Black
产品类型: Heat Sinks
系列: 900
工厂包装数量: 300
子类别: Heat Sinks
类型: Component
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已选择的属性: 0

USHTS:
8473302000
ECCN:
EAR99

900 Series Elliptical Fin Heat Sinks

Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are designed for airflow applications, including telecom, data centers, networking, cloud computing, and other industries. The heat sinks are constructed of AL 6063 material with a black anodized finish. Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are RoHS compliant and compatible with devices from a wide range of suppliers, including Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and more.