所有结果 (704)

模块化计算机 - COM COM Express Type 6 Compact module based on Intel Core i7-1185GRE 4-core processor with 1.8GHz up to 4.4GHz turbo boost, 12MB cache, Intel Iris Xe Graphics with 96EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake). Industrial t

模块化计算机 - COM COM Express Type 6 Compact module based on Intel Core i3-1115GRE 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 6MB cache, Intel UHD Graphics with 48EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake). Industrial tempera

模块化计算机 - COM COM Express Type 6 Compact module based on Intel Core i5-1145GRE 4-core processor with 1.5GHz up to 4.1GHz turbo boost, 8MB cache, Intel Iris Xe Graphics with 80EU and 16GByte dual channel LPDDR4X 4266 MT/s memory down (Intel Tiger Lake). Industr

CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole.

散热片 Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole.

模块化计算机 - COM COM Express Type 6 Compact module based on AMD Ryzen Embedded V2748 8-core processorwith 2.9GHz up to 4.25GHz boost freq., 4MB L2 cache, Radeon Vega Graphics with 7 CU and dualchannel DDR4 3200 MT/s memory interface with ECC support. Commercial tem

模块化计算机 - COM COM Express Type 6 Compact module based on AMD Ryzen Embedded V2718 8-core processorwith 1.7GHz up to 4.15GHz boost freq., 4MB L2 cache, Radeon Vega Graphics with 7 CU and dualchannel DDR4 3200 MT/s memory interface with ECC support. Commercial tem

模块化计算机 - COM COM HPC Size A module with Intel Core i7-1185G7E Processor, quad core with 2.8GHz (up to 4.4GHz), 12MB L2 cache, GT96 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP).

模块化计算机 - COM COM HPC Size A module with Intel Core i3-1115G4E Processor, dual core with 3.0GHz (up to 3.9GHz), 6MB L2 cache, GT48 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP).

模块化计算机 - COM COM HPC Size A module with Intel Core i5-1145GRE Processor, quad core with 2.6GHz (up to 4.1GHz), 8MB L2 cache, GT80 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP), no IPU, TCC, TSN, Inband ECC. Support for extended Temp.

CPU与芯片冷却器 Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are M2.5mm thread.