5583S-10

3M Electronic Specialty
517-5583S-10
5583S-10

制造商:

说明:
导热接口产品 WX300950580 3M(TM) THERMALLY COND INTERFACE PAD 5583S, 210MM X 300MM 1.0MM

ECAD模型:
下载免费库加载程序,将此文件转换,以供您的ECAD工具使用。了解详情。

库存量: 165

库存:
165 可立即发货
生产周期:
10 周 大于所示数量的预计工厂生产时间。
最少: 1   倍数: 1
单价:
¥-.--
总价:
¥-.--
预估关税:

定价 (含13% 增值税)

数量 单价
总价
¥236.5655 ¥236.57
¥209.3551 ¥2,093.55
¥199.4337 ¥4,985.84
¥192.2356 ¥9,611.78
¥178.5061 ¥17,850.61
¥171.9634 ¥34,392.68

产品属性 属性值 选择属性
3M
产品种类: 导热接口产品
Gap Fillers / Gap Pads / Sheets
Thermally Conductive Tape
Non-standard
Silicone Elastomer
1 W/m-K
White
- 40 C
+ 125 C
210 mm
155 mm
1 mm
UL 94 V-0
5583S
商标: 3M Electronic Specialty
产品类型: Thermal Interface Products
工厂包装数量: 200
子类别: Thermal Management
零件号别名: 5583S 00051131289079 7010352934
单位重量: 21 g
找到的产品:
要显示类似产品,至少选中一个复选框
要显示该类别下的类似产品,请至少选中上方的一个复选框。
已选择的属性: 0

CNHTS:
3824999990
USHTS:
3919905060
KRHTS:
3919900000
MXHTS:
3919909900
ECCN:
EAR99

导热界面垫片

3M™导热界面垫片设计用于在发热元件、散热器和其他冷却设备之间提供优化的热传递路径。界面垫片由高度兼容且略带粘性的硅胶弹性体和导热陶瓷颗粒制成,有助于增强导热性并提供出色的绝缘性能。典型应用包括集成电路 (IC) 芯片封装热传导、散热片接触面、LED板热接口材料 (TIM)、覆晶薄膜 (COF) 热传导。

Thermally Conductive Adhesive Tapes

3M™ Thermally Conductive Tapes offer a wide range that can be used in various thermal interface solutions, including cushion gasket tape, XYZ-axis thermally conductive tape, double-sided tape, adhesive transfer tape, and water contact indicator tape variants. These thin, highly conformable thermal interfaces and heat-spreading tapes provide high adhesion and excellent thermal conductivity. The tapes apply quickly and easily. A good dielectric strength makes these tapes appropriate for applications, including bonding heat sinks, heat spreaders, and other cooling devices to the IC packages, power transistors, and other heat-generating components.

Thermal Interface Solutions

3M™ Thermal Interface Solutions includes electrically conductive transfer tapes and conductive interface pads. The electrically conductive tapes are a wide range that can be used in various thermal interface solutions. Thermally conductive silicone interface pads are designed to provide a heat transfer path between heat-generating components, heat sinks, and other cooling devices.