说明：

导热接口产品 WX300901310 3M(TM) THERMALLY COND INTERFACE PAD 5591, 210MM X 300MM 2.5MM

ECAD模型:

下载免费库加载程序，将此文件转换，以供您的ECAD工具使用。了解详情。

定价 (含13% 增值税)

数量	单价	总价
	¥278.7484	¥278.75
	¥259.8096	¥2,598.10
	¥243.6845	¥4,873.69
	¥238.4752	¥11,923.76
	¥229.7855	¥22,978.55
	¥197.2754	¥39,455.08

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

产品属性	属性值	选择属性
制造商:	3M
产品种类:	导热接口产品
产品:	Gap Fillers / Gap Pads / Sheets
类型:	Thermally Conductive Tape
封装 / 箱体:	Non-standard
材料:	Silicone Elastomer
导热性:	1 W/m-K
颜色:	White
最小工作温度:	- 50 C
最大工作温度:	+ 125 C
长度:	210 mm
宽度:	300 mm
厚度:	2.5 mm
可燃性等级:	UL 94 V-0
系列:	5591
商标:	3M Electronic Specialty
产品类型:	Thermal Interface Products
工厂包装数量:	10
子类别:	Thermal Management
零件号别名:	5591 08806080063735 7010321481
单位重量:	284.634 g

找到的产品:

要显示类似产品，至少选中一个复选框

要显示该类别下的类似产品，请至少选中上方的一个复选框。

已选择的属性: 0

筛选文档:

数据表

5591-25 数据表 (PDF)

CNHTS:: 3824999999
USHTS:: 3506911000
ECCN:: EAR99

导热界面垫片

3M™导热界面垫片设计用于在发热元件、散热器和其他冷却设备之间提供优化的热传递路径。界面垫片由高度兼容且略带粘性的硅胶弹性体和导热陶瓷颗粒制成，有助于增强导热性并提供出色的绝缘性能。典型应用包括集成电路 (IC) 芯片封装热传导、散热片接触面、LED板热接口材料 (TIM)、覆晶薄膜 (COF) 热传导。

Thermally Conductive Adhesive Tapes

3M™ Thermally Conductive Tapes offer a wide range that can be used in various thermal interface solutions, including cushion gasket tape, XYZ-axis thermally conductive tape, double-sided tape, adhesive transfer tape, and water contact indicator tape variants. These thin, highly conformable thermal interfaces and heat-spreading tapes provide high adhesion and excellent thermal conductivity. The tapes apply quickly and easily. A good dielectric strength makes these tapes appropriate for applications, including bonding heat sinks, heat spreaders, and other cooling devices to the IC packages, power transistors, and other heat-generating components.

Thermal Interface Solutions

3M™ Thermal Interface Solutions includes electrically conductive transfer tapes and conductive interface pads. The electrically conductive tapes are a wide range that can be used in various thermal interface solutions. Thermally conductive silicone interface pads are designed to provide a heat transfer path between heat-generating components, heat sinks, and other cooling devices.