FDMS86300DC

Dual Cool™ MOSFETs

onsemi Dual Cool™ PowerTrench® MOSFETs provide Dual Cool packaging technology that features bottom- and top-side cooling in a PQFN package. The PQFN footprint is an industry standard and provides performance flexibility for the designer. The Dual Cool MOSFETs feature enhanced dual path thermal performance and improved parasitics over wire-bonded predecessors. The use of a heat sink with Dual Cool packaging technology provides even more impressive results. When a heat sink is used with onsemi Dual Cool package technology, synchronous buck converters deliver higher output current and increased power density.

PowerTrench® MOSFET

仙童 提供业界最齐全的 PowerTrench® MOSFET 产品组合。您可以从多种技术中选择适合您应用的 MOSFET。仙童 提供 N 沟道和 P 沟道版本的 MOSFET，利用其先进的 Power Trench® 工艺，该工艺经优化实现了低 R_DS(ON) 开关性能和坚固性。这些 PowerTrench® MOSFET 可满足几乎任何应用的需要，如负载开关、一次开关、移动计算、直流-直流转换器、同步整流器等等。
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Power Trench MOSFETs EXPANSION

ON Semiconductor has expanded its line of Power Trench MOSFETs to offer different drain-to-source voltages, drain current and R_DS(ON). Additional features in this expansion of the ON Semiconductor Power Trench® MOSFETs include advanced package and silicon combination for low R_DS(ON) and high efficiency, thermally efficient packages, and next generation enhanced body diode technology engineered for soft recovery. Applications for these Power Trench® MOSFETs include synchronous rectifiers for DC/DC converters, notebook or networking low side switch, telecom secondary side rectification, load switches, and many more.
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ON Semiconductor offers both N-Channel and P-Channel versions of MOSFETs using their advanced Power Trench process that has been optimized for low R_DS(ON) switching performance and ruggedness.
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