maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.

结果: 2
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 产品 设计目的 安装风格 散热片材料 散热片样式 热阻 长度 宽度 高度
Advanced Thermal Solutions 散热片 maxiFLOW BGA Heat Sink, Double-Side Thermal Tape, T412, 21mm L, 21mm W, 12.5mm H 54库存量
最低: 1
倍数: 1

Heat Sinks BGA Adhesive Aluminum Angled Fin 7.23 C/W 21 mm 21 mm 12.5 mm
Advanced Thermal Solutions 散热片 maxiFLOW BGA Heat Sink, Double-Side Thermal Tape, T412, 23mm L, 23mm W, 12.5mm H
95预期 2026/9/3
最低: 1
倍数: 1

Heat Sinks BGA Adhesive Aluminum Angled Fin 6.71 C/W 23 mm 23 mm 12.5 mm