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Telink 多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
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Telink 多协议模块 The ML9118A module is designed based on Telink WiFi 6 multiprotocol SoC, the TLSR9118. It features WiFi 6 + Bluetooth 5.4, tailored for lowpower IoT applications.
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Telink 蓝牙开发工具 - 802.15.1 The TC3215X EV-board is designed based on the TC3215X chip and and is used to verify the TC321x series chips and supports various functional tests.
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Telink 蓝牙开发工具 - 802.15.1 The TL322X EV-board is designed based on the TL322X chip and and is used to verify the TL3228X/3828X series chips and supports various functional tests.
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Telink 多协议开发工具 The TL7218X Development board is designed based on the TL7218X chip and and is used to verify the TL721x series chips and supports various functional tests. TL721X SoC supports Bluetooth LE, Zigbee, Thread, Matter, and 2.4GHz proprietary protocols. I
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Telink 多协议开发工具 Dev board designed around the TL3218X chip and is used to verify the TL321x series chips and supports various functional tests. TL321X SoC supports Bluetooth LE, Zigbee, Thread, Matter, and 2.4GHz proprietary protocols.
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Telink RF片上系统 - SoC BLE 5.0 + 2.4G Proprietary SoC,128KB Flash,temp -40C to 85C, 24 pin
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Telink RF片上系统 - SoC BLE 5.0 + 2.4G Proprietary SoC,512KB Flash,temp -40C to 85C, 40 pin
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Telink RF片上系统 - SoC BLE 5.0 + 2.4G Proprietary SoC,128KB Flash,temp -40C to 85C, 16 pin
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Telink RF片上系统 - SoC 32KB SRAM, 512KB Flash, Bluetooth LE 5.1 (5.3 listed), 2.4G, Telink Mesh, AoA/AoD, TQFN 7mmx7mm, 48 pins
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Telink TLSR8368ET24
Telink RF片上系统 - SoC
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