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选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS 产品类型 技术 安装风格
Infineon Technologies MOSFET模块 EasyPACK 2C CoolSiC MOSFET M2 .XT, 3-level module 1200 V, 8 mOhm with NTC temperature sensor and high current PressFIT contact technology 37库存量
最低: 1
倍数: 1

MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET模块 EasyPACK 2C CoolSiC MOSFET M2 .XT, 3-level module 1200 V, 8 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology 16库存量
最低: 1
倍数: 1

MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET模块 EasyPACK 1C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 13 mOhm with NTC temperature sensor and high current PressFIT contact technology 25库存量
最低: 1
倍数: 1

MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET模块 EasyPACK 2C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 8 mOhm with NTC temperature sensor and high current PressFIT contact technology 19库存量
最低: 1
倍数: 1

MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET模块 EasyPACK 2C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 8 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology 11库存量
最低: 1
倍数: 1

MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET模块 EasyPACK module with CoolSiC Trench MOSFET and PressFIT / NTC 15库存量
最低: 1
倍数: 1

MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET模块 EasyPACK module with CoolSiC Trench MOSFET and PressFIT / NTC 3库存量
最低: 1
倍数: 1

MOSFET Modules SiC Press Fit
Infineon Technologies 分立半导体模块 EasyPACK module with CoolSiC Trench MOSFET and High Current Pin / NTC 11库存量
16在途量
最低: 1
倍数: 1

Discrete Semiconductor Modules SiC Press Fit
Infineon Technologies MOSFET模块 EasyPACK 1C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 13 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
30预期 2026/5/25
最低: 1
倍数: 1

MOSFET Modules SiC Press Fit