Sn95.5/Ag4.0/Cu0.5 Solder Spheres for BGAs

Chip Quik Sn95.5/Ag4.0/Cu0.5 Solder Spheres for BGAs are manufactured from virgin materials to meet or exceed the requirements of building or repairing BGA packages. These solder spheres also exceed MIL standards and IPC for size tolerances and purity levels. The Sn95.5/Ag4.0/Cu0.5 solder spheres are available in nominal sizes from 0.20mm to 0.76mm (8mil to 30mil). These solder spheres are Lead-free and REACH-compliant. The Sn95.5/Ag4.0/Cu0.5 solder spheres are compliant with RoHS 3, REACH, and conflict minerals. These solder spheres operate at 217°C (423°F) melting point and are available in up to 0.60mm sphere diameter.

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含铅
Chip Quik 焊料 焊料 Spheres Sn95.5/Ag4.0/Cu0.5 0.50mm diameter 25K Bottle
数据表
3库存量
最低： 1
倍数： 1

Solder Spheres Lead Free Sn95.5/Ag04/Cu0.5 0.5 mm
Chip Quik 焊料 焊料 Spheres Sn95.5/Ag4.0/Cu0.5 0.30mm diameter 25K Bottle
数据表
1库存量
最低： 1
倍数： 1

Solder Spheres Lead Free Sn95.5/Ag04/Cu0.5 0.3 mm
Chip Quik 焊料 焊料 Spheres Sn95.5/Ag4.0/Cu0.5 0.60mm diameter 25K Bottle
数据表

Solder Spheres Lead Free Sn95.5/Ag04/Cu0.5 0.6 mm
Chip Quik 焊料 焊料 Spheres Sn96.5/Ag3.0/Cu0.5 .044" (1.1mm) diameter 6K Bottle (SAC305 lead-free solder balls)
数据表
更多信息可用

Solder Spheres Lead Free Sn96.5/Ag3.0/Cu0.5 1.1 mm No